30results about How to "Insensitive" patented technology

The invention discloses a high-dimensional indexing structure technology of an equipment failure case based on the distance measurement. A novel high-dimensional data indexing structure is provided. The indexing structure divides a space dynamic state into a grid structure according to the aggregating properties of an equipment state case, so that two spatially-adjacent cases are put together. Atthe same time, the relation between a threshold to be inquired and the distance from a vector to be inquired to two reference points is utilized, thereby excluding impossible data in a large range, greatly improving the efficiency of inquiry and reducing the CPU consumption, and meanwhile the indexing structure is insensitive to the data distribution, so as to lay the foundation for the engineering intellectualization of the equipment fault diagnosis.

In a printing device (10) of the piezoelectric DOD type for printing a substrate (12) with a printing medium, comprising a print head (16), which is arranged in such a manner that it can be moved to and fro substantially transversely with respect to the direction in which the substrate to be printed is conveyed, the working container (30) for degassed printing medium is coupled to a flexible reservoir (32). This results in increased productivity.

The invention discloses an active high-rigidity locking combined mechanism of a flexible solar wing. The active high-rigidity locking combined mechanism comprises lower box body unfolding and lockingmechanisms and upper box body unfolding and locking mechanisms, wherein the lower box body unfolding and locking mechanisms are arranged on the two sides of the stretching mechanism respectively, andthe two sides of each lower box body unfolding and locking mechanism are each provided with one upper box body unfolding and locking mechanism; the lower box body unfolding and locking mechanism rotating shaft and the upper box body unfolding and locking mechanism rotating shaft are arranged at coaxial positions; when the lower box body unfolding and locking mechanism is unfolded, the upper box body unfolding and locking mechanism is unfolded and then locked. After being unfolded in place, the active mechanism can continuously act to eliminate a mechanism gap so as to increase the locking height, and has the advantage of high locking rigidity; the passive hinge is driven by the active mechanism to be unfolded and locked, and has the advantages of being simple and reliable. And after the active mechanism drives the passive hinge to be unfolded and locked, the cell array assembly can be separated under the action of the stretching mechanism so as to be unfolded. The mechanism is simple and reliable in structure, high in mechanism robustness, high in locking rigidity and small in folding envelope.

The invention discloses a non-inductive multifunctional electrospinning micro-pyramid array membrane and a preparation method thereof. The preparation method comprises the following steps: firstly disposing a polymer precursor solution; then adding the precursor solution to a conductive needle, and connecting the needle when the needle is connected High-voltage electricity causes the precursor solution to form charged fibers with heterostructures; the above fibers are continuously collected by a grounded conductive receiver; then, the subsequently ejected fibers with heterostructures spontaneously preferentially accumulate in the thicker layers of the collected fibers. position deposition; secondly, volatilize the solvent at room temperature, and finally obtain an ultralight film with electrospun micropyramid arrays. The membrane not only has insensitivity for long-term use, but also has multiple super properties in pressure sensing, radiation refrigeration, piezoelectricity, triboelectricity, hydrophilicity and hydrophobicity, and the like.

The invention discloses a frequency selection surface type curved surface dielectric and a cassegrain antenna system. The curved surface dielectric comprises a dielectric substrate; the upper surfaceof the dielectric substrate is a pot cover-shaped curved surface, while the lower surface adopts a shape which is cut towards the upper surface of the dielectric substrate on the basis of the same shape of the upper surface, so that the perpendicular distance from the upper surface to the lower surface of the dielectric substrate is gradually reduced from the outer edge to the center of the dielectric substrate; the upper surface of the dielectric substrate is attached with a metal layer of the set thickness; total reflection of energy at the required waveband is realized in the middle regionof the pot cover-shaped metal layer; and gap units of the same sizes are arranged on the metal layer of a peripheral region in an annular array form, so that transmission of the energy at the requiredwaveband is realized. The curved surface dielectric has the advantages as follows: by adjusting the thicknesses from the outer edge to the center of the dielectric substrate, changes of the dimensions of the gaps in the metal layer from the outer edge to the center is not needed even if the projection angle is changed, thereby greatly lowering the processing difficulty.