50results about How to "Reduce resin viscosity" patented technology

Powder desiccant is mixed into a seal which adheres a first substrate to a second substrate, thereby sealing a display region. Almost no moisture permeates through the outer surfaces of the substrates sandwiching the display region, while moisture permeating through the seal is adsorbed by the desiccant. An emissive layer is thereby prevented from deterioration due to moisture. By covering the display region with a resin sealing layer composed of resin having desiccant mixed therein, the display region can reliably be protected from moisture. By forming a groove in the substrate and placing a desiccant therein, moisture can be further reliably adsorbed.

A light emitting apparatus is provided, and the light emitting apparatus has a light emitting device mounted on a substrate or a resin package where a substrate surface or the resin package is resin-encapsulated by an encapsulating resin section added with a phosphor in such a manner to cover the light emitting device. A surface resin layer of a different color from that of the encapsulating resin section is provided on a surface side of the encapsulating resin section.

A composite item is fabricated in system that includes a layer of preform, supply of resin, mandrel, and bagging film. The layer of preform corresponds to the composite item. The supply of resin is sufficient to infuse the preform. The mandrel includes a preform receiving zone to receive the layer of preform and a resin receiving zone to receive the supply of resin. The resin receiving zone is adjacent to the preform receiving zone. The bagging film is operable to generate an envelope surrounding the preform receiving zone and the resin receiving zone.

A solar cell module includes: a photoelectric conversion body 101 having an uneven surface on a light-entering surface; and a protection layer 10 made of a resin and provided to cover the uneven surface. In a cross section of the protection layer 10 taken in parallel to a light-entering direction, a thickness W2 of a projected portion on the uneven surface is smaller than a thickness W1 of a recessed portion on the uneven surface.

Methods of preventing the production of sand with fluids produced from a subterranean formation penetrated by a well bore are provided. The methods basically comprise the steps of preparing a resin composition which delayedly forms a hardened open cell foam capable of allowing the passage of well fluids therethrough while screening and preventing the passage of formation sand and then placing the resin composition adjacent to the formation by way of the well bore.

Fibers in a fiber reinforced resin laminate are exposed by placing a gel in contact with the resin laminate, forcing the fibers of the resin laminate into the gel, and using the gel to displace the resin surrounding the fibers being forced into the gel. The gel is removed to expose the fibers.

The present disclosure provides a method for building a three-dimensional object using a printable composition including high viscosity polymerizable components. The method includes the steps of a) providing a printable composition comprising a high viscosity polymerizable component and a temporary solvent; b) selectively curing the printable composition to form an article representing the shape of the three-dimensional object; and c) removing a substantial amount of the temporary solvent from the article. The method is particularly well suited to making an orthodontic clear tray aligner. Also disclosed are a variety of printable compositions including high viscosity polymerizable components, such as polyurethane methacrylates, and temporary solvents.

The invention discloses a grafted nano ambary fiber crystal whisker modified urea formaldehyde resin adhesive and a preparation method thereof. The grafted nano ambary fiber crystal whisker modified urea formaldehyde resin adhesive is prepared from formaldehyde, urea, polyvinyl alcohol and a reaction enhancer, wherein the mole ratio of the formaldehyde to the urea is (1.1-0.95):1, and the addition amount of the polyvinyl alcohol is 0.1-0.8% of the total weight. The addition amount of the reaction enhancer is 0.1-3.0% of the total weight. The preparation method comprises the following steps: adding the reaction enhancer, adding the first batch of urea according to a mole ratio of (2.0-2.2):1, adding the second batch of urea according to the mole ratio of (1.4-1.2):1, and finally, adding the third batch of urea according to the mole ratio of (0.95-1.1):1. By using the formaldehyde and urea in a low mole ratio as the raw materials, the self-made acrylic acid grafted nano ambary fiber crystal whisker is added to increase the molecule branching degree and molecular weight of the resin, so that the low-mole-ratio urea formaldehyde resin has the advantages of low formaldehyde content, high adhesion strength and low cost.

Employed are a resin-filled ferrite carrier for an electrophotographic developer filled with a resin in voids of a porous ferrite core material, wherein the resin filled in the voids is a silicone resin which has a softening point of 40° C. or above and is cured at or above such softening point, and the filled amount is 7 to 30 parts by weight based on 100 parts by weight of the core material, a method for producing thereof band an electrophotographic developer using this ferrite carrier.

A dental instrument for working with composite resin includes an elongate handle and at least one tool attached at an end of the elongate handle. The tool is heated and/or vibrationally driven, and used to engage and work dental composite resin.

A photo-curable resin composition for an optical component is provided, the photo-curable resin composition including: (A) an epoxy resin having a refractive index of not less than 1.57; (B) an alicyclic epoxy resin; (C) an oxetane resin having at least one oxetane ring in its molecule; and (D) a photoacid generator; wherein the resin (A) is present in a proportion of 20 to 75 wt % based on the amount of an overall resin component of the resin composition; wherein the component (D) is present in a proportion of 0.5 to 2.5 parts by weight based on 100 parts by weight of the overall resin component; the resin composition being free from a solvent component and having a viscosity of 0.5 to 25 Pa·s in a 25° C. environment.

A liquid crystal sealant comprising an epoxy resin represented by the following formula (1):

[Formula 1]

(in the formula, n denotes an average polymerization degree and is a positive number of 0-5) as a resin component, a curing agent, a curing accelerator and an inorganic filler is excellent in screen printability as a liquid crystal sealant in making a liquid crystal display device and can provide excellent reliability in moisture resistance for the liquid crystal display device obtained).

The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor.

The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents.

The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.

A thermosetting resin compositing having an essential component (A) organopolysiloxane containing a compound represented by following general formula (1) or (2) and optical semiconductor peripheral material using the composition. [Herein, in the formulas, R1 independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, R2 represents an epoxy group-containing organic group, R3 represents R1 or R2, a independently represents an integer of 2 or more, b independently represents an integer of 0 or more, X represents general formula (3) , Y represents a bivalent hydrocarbon radical with the carbon number of 1 to 6, Z represents following formula (4), R1 in the formula independently represents a substituted or non-substituted monovalent hydrocarbon radical with the carbon number of 1 to 10, and c represents an integer of 0 or more.]

A method for manufacturing a printed wiring board, including the steps of: forming a thermosetting resin layer so as to fill the spaces between circuit patterns formed on the printed wiring board; heating and curing the resin layer in a reduced pressure chamber in which the pressure is reduced while a smoothing plate is pressed against the resin layer; and then polishing the cured resin layer covering the circuit patterns, thereby exposing the circuit patterns. The step of heating and curing the resin layer in the reduced pressure chamber comprises the following successively performed steps: step 1: maintaining the resin layer at a non-curable temperature to prevent the resin layer from curing, in a state where the resin layer is pressed via the smoothing plate in the reduced pressure chamber; step 2: heating the resin layer in the pressed state to a curing temperature at which the resin layer is cured; step 3: introducing outside air into the reduced pressure chamber with the pressed state and the curing temperature maintained; step 4: reducing the pressure applied to the smoothing plate with the curing temperature maintained; and step 5: cooling the resin layer.

The invention relates to the technical field of fine chemical preparation, and discloses a low-viscosity fast curing UV polyester acrylate and a preparation technology thereof. The low-viscosity fastcuring UV polyester acrylate is prepared from 68-79 wt% of unsaturated polyester, 10-15 wt% of an acrylic monomer, 10-15 wt% of epichlorohydrin, 0.5-1 wt% of a catalyst and 0.5-1 wt% of a polymerization inhibitor; and the unsaturated polyester comprises, by weight, 20 parts of maleic anhydride, 10.1 parts of phthalic anhydride, 5.8 parts of deionized water, 0.1 part of hypophosphorous acid, 30 parts of dicyclopentadiene, 20 parts of diethylene glycol, 14.4 parts of pentaerythritol, 8 parts of fumaric acid and 1.5 parts of toluene. The UV polyester acrylate of the invention has the advantagesof low viscosity, fastness in curing, high reaction activity, good economical property, and facilitation of large-scale preparation and promotion of UV paints; and the preparation technology is simple, and is convenient to operate.

Disclosed is a wax that is added to a thermoplastic resin that undergoes a molding process at high temperatures. The wax does not thermally decompose when that thermoplastic resin composition undergoes the molding process. The wax also prevents mold fouling and provides superior lubricating properties and mold release properties. Also disclosed are a method for producing the wax with superior productivity, a lubricant and mold release agent for thermoplastic resin molding processes.

The wax contains a dehydration condensed amide wax component. 99.98-5% by weight of which is an acid, which is formed from 2 mol of a C_12-22 saturated aliphatic monocarboxylic acid by molar ratio and “a” mole of a C_2-12 polybasic acid by molar ratio (0≦“a”≦5), and “b” mole of a C_2-14 diamine by molar ratio (1≦“b”≦6), and 0.02-5% by weight of an oxidation inhibitor that has compatibility with this amide wax component.

This disclosure provides resin formulations which may be used for 3D printing and thermally treating to produce a ceramic material. The disclosure provides direct, free-form 3D printing of a preceramic polymer, followed by converting the preceramic polymer to a 3D-printed ceramic composite with potentially complex 3D shapes. A wide variety of chemical compositions is disclosed, and several experimental examples are included to demonstrate reduction to practice. For example, preceramic resin formulations may contain a carbosilane in which there is at least one functional group selected from vinyl, allyl, ethynyl, unsubstituted or substituted alkyl, ester group, amine, hydroxyl, vinyl ether, vinyl ester, glycidyl, glycidyl ether, vinyl glycidyl ether, vinyl amide, vinyl triazine, vinyl isocyanurate, acrylate, methacrylate, alkacrylate, alkyl alkacrylate, phenyl, halide, thiol, cyano, cyanate, or thiocyanate. The resin formulations may contain a solid-phase filler, to provide high thermal stability and mechanical strength (e.g., fracture toughness) in the final ceramic material.

A tool system for moulding an article is provided which comprising a tool (100) having a tool surface (104) for forming an article, the tool surface comprising a plurality of tool zones (106). Heating and cooling means (102a) are independently associated with at least some of said tool zones (106). A control means is adapted to control the heating and cooling means (102a) to individually heat or cool the tool zones (106) having heating and cooling means (102a) associated therewith so as to regulate the heat transfer into and out of the article at each tool zone (106) at any particular time throughout the moulding process.