This invention discloses a method for overload or interference
signal release and discrete
capacitor enhancement design of a
hydrophone discrete beam-diaphragm fusion acoustic sensing
chip. A flat diaphragm fabricated on a C-shaped
silicon cup substrate is divided into multiple sub-beam diaphragms, which together form a circular flat diaphragm with micron-level gaps between each sub-beam diaphragm. Each sub-beam diaphragm has a piezoelectric sensing membrane and a detection
capacitor electrode, with the detection capacitors on each sub-beam diaphragm connected in series. This invention addresses how to enhance the original sensitivity of a sensor
chip within the limited dimensions of a MEMS sensitive structure, while simultaneously improving the sensor's overload resistance and environmental adaptability. The
hydrophone discrete beam-diaphragm fusion acoustic sensing
chip is used to sense
underwater sound pressure and other signals, enabling the fabrication of
sound pressure hydrophones. This chip can also be used to design and fabricate sensors for displacement,
differential pressure, flow rate, velocity, particle vibration, and corresponding parameters in air.