44results about How to "Extended heat transfer path" patented technology

The invention discloses an ion cyclotron resonance heating antenna vacuum feed mouth ceramic sealing structure, comprising a vitrified pipe, the left and right end surfaces of which are metallized end surfaces, and is characterized in that: the inner walls of the left end and the right end of the vitrified pipe are sheathed with a first and a second oxygen-free copper flanges, the first and the second oxygen-free copper flanges are provided with annular inner and outer flangings welded on the metallized left end surface of the vitrified pipe by vacuum; a first and a second stainless steel sealing flanges are welded on annular inner and outer flangings of the first and the second oxygen-free copper flanges; the first and the second stainless steel sealing flanges are respectively provided with the annular inner and outer flangings, the outer ends of which becomes conic structure from thick to thin gradually. The outer ends of the flanges are conic structure, aiming at reducing heat conduction amount to the ceramics when a crunch seal part and the inner and outer conductors are welded by lengthening the heat transfer path and reducing the heat transfer area, thus finally reducing the heat stress among the stainless steel flanges and the ceramics when welding, and guaranteeing the successful welding of the crunch seal parts and the inner and the outer conductors.

A spark ignition device, metal shell, and methods of construction are provided. The spark ignition device has a ceramic insulator extending along a longitudinal axis and a metal shell. The metal shell extends along the longitudinal axis to a distal end. A center electrode is received in the ceramic insulator and extends along the longitudinal axis. A ground electrode has an attachment end fixed by a weld joint to the distal end of the shell and a free end extending from the distal end to provide a spark gap. The weld joint includes a resistance weld joint and a laser weld joint, which in combination inhibit material expulsion; provide a reliable, strong attachment of the ground electrode to the shell; provide an improved heat transfer path between the ground electrode and the shell, and facilitate repeatable and accurate positioning of the ground electrode to the shell.

A system and method are provided for forming a multi-chip package. The multi-chip package includes a multi-layer substrate and a heat spreader of single, unibody construction. At least two integrated circuits are coupled between the multi-layer substrate and the heat spreader. The integrated circuits are spaced from one another to allow airflow between those circuits and a portion of the underside surface of the heat spreader. Depending on the layout of the package, a passive device can also be placed in the space between integrated circuits. The passive device extends upward a spaced distance from the underneath surface of the heat spreader so as not to block the airflow therebetween. The multi-chip package can accommodate integrated circuits that are either all packaged, all unpackaged, or a combination of each. If packaged and unpackaged integrated circuits are placed on the multi-layer substrate, the heat spreader can extend in two separate planes to accommodate the different thicknesses of those packaged and unpackaged integrated circuits. Alternatively, a second heat spreader can be placed on a relatively thin integrated circuit so that the upper surface of the second heat spreader is coplanar with an upper surface of a relatively thick integrated circuit. This will allow a planar heat spreader to be arranged across the thick integrated circuit and the second heat spreader. In all instances, however, the heat spreader extends as a single, contiguous unibody element across the entire multi-chip package.

A core material of the vacuum insulation panel of the present embodiment is a core material of a plurality of vacuum insulation panels formed by laminating nonwoven fabrics, wherein the nonwoven fabric is composed of thermosetting resin fibers, and the thermosetting resin fibers are formed of a thermosetting resin.

The invention relates to a superconducting device current lead. The shape of the bar copper segment of the current lead is transformed from the straight bar type to solenoid type to saving the space that means fully increasing the heat passage in the limit space. One superconducting device current lead of the invention is made of copper bar material with insulating layer covered on its surface, and the copper bar material is formed solenoid. The other superconducting device current lead of the invention is jointing by copper bar material part and bar material of the high temperature superconducting material or band part; its surface is covered with the insulating layer; the copper bar material part is made of the solenoid. The current lead is adopted to reduce forty percent of the occupied space height, and its effect is notable for the condition that the heat passage can not be reduced.

The present invention provides a radiant air conditioning system for a heat-producing device (1), comprising a compressor (4), a condenser (5), an expansion valve (6), and at least one radiant panel evaporator (2) which are connected through a connecting pipe to form a recycling refrigerant loop, wherein each of the radiant panel evaporators comprises a refrigerant pipe (22) and a radiant panel (21) which exchanges heat with the refrigerant pipe (22). The radiant air conditioning system further comprises at least one heat transfer plate (3), configured to perform radiant heat transfer with the heat-producing device (1) and transmit an amount of absorbed heat to the radiant panel (21). The present invention improves heat transfer effect between the radiant panel (21) and the heat-producing device (1), and is particularly suitable for cooling a plurality of densely distributed heat-producing devices (1).

The invention relates to a low-temperature storage tank which comprises a body and a support arranged at the bottom of the body and used for supporting the body. The body comprises an inner container, an inner container supporting device and a shell, wherein the inner container and the shell are spaced, through holes are formed in the bottom of the shell, the bottom end of the inner container supporting device downwards penetrates out of the through holes, and the top end of the inner container supporting device is arranged in the space to support the inner container. The body and the support of the low-temperature storage tank are integrated, the through holes are formed in the bottom of the shell, the bottom end of the inner container supporting device downwards penetrates out of the through holes to be connected to the support, heat transfer routes of the inner container supporting device are added, heat conduction is reduced, and therefore the static evaporation rate of the low-temperature storage tank is reduced, and the heat insulation performance of the low-temperature storage tank is improved; the total height of the low-temperature storage tank is lowered, and the manufacturing cost is lowered; and besides, the low-temperature storage tank is simple in structure and can be applied to low-temperature tanks with the medium volume.

The present invention provides a silicon nitride circuit board in which metal plates are attached on front and rear sides of a silicon nitride substrate having a three-point bending strength of 500 MPa or higher, with attachment layers interposed therebetween, wherein assuming that a thickness of the metal plate on the front side is denoted by t1, and a thickness of the metal plate on the rear side is denoted by t2, at least one of the thicknesses t1 and t2 is 0.6 mm or larger, a numerical relation: 0.10≦|t1−t2|≦0.30 mm is satisfied, and warp amounts of the silicon nitride substrate in a long-side direction and a short-side direction both fall within a range from 0.01 to 1.0 mm. Due to above configuration, TCT properties of the silicon nitride circuit board can be improved even if the thicknesses of the front and rear metal plates are large.

A gas stove capable of controlling multiple gas nozzles in a grouping manner comprises a flame control device, which is characterized in that the flame control device has three groups to hundred groups of gas nozzles, wherein at least one group has two to fifty gas nozzles, and the total number of the gas nozzles is four to three hundred. A Gas outflow through hole is arranged on a gas nozzle plate, the gas nozzles are installed on the through hole; a flame adjusting plate is arranged below the gas nozzle plate, a gas storage chamber is arranged below the flame adjusting plate; the flame adjusting plate is installed on a lower surface of the gas nozzle plate through a positioning-and-clamping device; gas-out section adjusting grooves and gas-in section adjusting grooves are arranged on the flame adjusting plate, a gas inflow through hole is arranged on the flame adjusting plate, a gas manifold is installed on the gas nozzle plate and is communicated with the gas inflow through hole; a transmission mechanism can drive the flame adjusting plate to move relatively with the gas nozzle plate in a gapless manner. When flames are adjusted to be small, heights of the flames are not lowered, radiating area of a burner is reduced, and heat efficiency is improved.

The invention discloses a preparation method of an electric conduction and heat conduction functionalized carbon nanotube/TPU composite material. The preparation method comprises the following steps:modifying a functionalized carbon nanotube with chitosan to obtain a functionalized carbon nanotube (CS-CNT), carrying out a reaction on the functionalized carbon nanotube (CS-CNT) with 4,4'-diphenylmethane diisocyanate, adding polytetramethylene ether glycol, 1,4-butanediol and a catalyst, and carrying out a pre-polymerization-chain extension reaction to synthesize the electric conduction and heat conduction functionalized carbon nanotube/TPU composite material. A hydrogen bond interaction and an electrostatic adsorption effect between chitosan and a carbon nano tube exist in a CS-CNT molecule, wherein a large number of hydrogen bonds and covalent bonds exist between the CS-CNTs, between the CS-CNTs and the TPU monomer, and between the CS-CNTs and the TPU matrix at the same time, so thatthe bonding force between the TPU composite material and a TPU matrix is enhanced, the crosslinking degree is increased, a complete and compact conductive network and a more efficient heat conductionnetwork are formed, and the conductive performance and the heat conduction performance of the TPU composite material are greatly improved.

The invention provides a chip employing liquid metal for enhancing inner heat transmission. Along with constant improvement of chip performance, power consumption of a ceramic chip increases continuously. Especially along with emergence of packaging forms of three-dimensional stacking and SIP energy, chip packaging density increases continuously and heat flow density increases therewith. The heatdissipation problem of the chip itself becomes urgent. At the same time, the chip is filled with nitrogen (9) due to problems of sealing performance and the like of the ceramic chip. However, the nitrogen (9) has extremely low thermal conductivity and the heat dissipation path of the chip is limited. According to the invention, the chip package is filled with liquid metal (7), so that the transmission path is enhanced, chip heat resistance is reduced and chip heat dissipation performance is improved.

The invention discloses a supporting mechanism of a vacuum heat insulation vertical storage tank. The supporting mechanism comprises an annular supporting unit and a top supporting unit, wherein the annular supporting unit structurally comprises a side face fixing pipe arranged on the side wall of an outer cylinder body in a penetrating mode, an outer end opening of the side face fixing pipe is sealed, a side face mounting pipe is arranged in the side face fixing pipe, the outer end of the side surface mounting pipe is fixedly connected with the inner end of the side face fixing pipe through afirst connecting piece, and the outer end of a glass fiber reinforced plastic support pipe is clamped and sleeved at the inner end of the side face mounting pipe; and the top supporting unit structurally comprises a top fixing pipe vertically arranged on a top end socket of the outer cylinder body in a penetrating mode, an upper end opening of the top fixing pipe is sealed, a top mounting pipe isarranged in the top fixing pipe, the upper end of the top mounting pipe is fixedly connected with the lower end of the top fixing pipe through a second connecting piece, a lantern ring is arranged atthe upper end of a glass fiber reinforced plastic strut, and the upper end of the glass fiber reinforced plastic strut is clamped at the lower end of the top mounting pipe through the lantern ring ina sleeving mode. By means of the supporting mechanism, external heat is not prone to be transmitted to an inner cylinder body.

The invention relates to a vermiculite-nanometer powder composite heat insulation material. The vermiculite-nanometer powder composite heat insulation material comprises, by weight, 30 to 70 parts ofexpanded vermiculite, 20 to 70 parts of nanometer powder, 30 to 50 parts of a binder and 10 to 20 parts of an infrared opacifier. According to the invention, since gaps among the vermiculite is filledwith the nanometer powder, a heat transfer path is prolonged and macropores are made finer, and thus, heat insulation performance is improved; the infrared opacifier is introduced to improve radiantheat insulation effect; and filling of the nanometer powder improves the strength of the material and reduces water absorption rate.

The invention relates to a closing device for a steam pipe, and belongs to the field of steam heat-insulation pipes. The closing device for the steam pipe comprises a working pipe, an outer protecting pipe and a closing subassembly, wherein the closing subassembly is arranged between the working pipe and the outer protecting pipe and comprises a plurality of connecting annular plates with different diameters, a plurality of limiting plates with different diameters, a plurality of reinforcing rib plates and a plurality of corrugated pipes; the working pipe is connected with one of the corrugated pipes via the first connecting annular plate; one of the corrugated pipes is connected with the outer protecting pipe via the second connecting annular plate; one of the corrugated pipes is connected with the other corrugated pipe via the third connecting annular plates; and the working pipe and the outer protecting pipe form a closed structure through the corrugated pipes and the connecting annular plates. By the closing device for the steam pipe, a complete closing effect can be achieved, and water of the outside is prevented from entering a heat-insulation layer; the service life of the closing device is improved greatly, and the closing device is prevented from failing; a gap is filled with a high-temperature-resistant heat-insulation material, and heat loss of the closing subassembly can be reduced greatly; and large relative displacement in a closed position of the heat-insulation layer of the pipe is allowed, designed layout of pipelines is flexible, investment is reduced relatively, and the reliability is improved.

The invention relates to a capacitor which comprises an electrode outer frame, wherein a first electrode plate is arranged on one side inside the electrode outer frame, and a second electrode plate isarranged on the other side inside the electrode outer frame; a first electric contact is arranged on one side at the upper end of the first electrode plate; a second electric contact is arranged on the other side of the second electrode plate; a capacitor core is arranged between the first electrode plate and the second electrode plate; insulating layers are arranged on outer sides of the first electrode plate and the second electrode plate; sealed end covers are arranged on two sides of the electrode outer frame; and a plurality of cooling fins are arranged on the outer side of the electrodeouter frame along a horizontal direction. Under the actions of the first electric contact and the second electric contact, good electrical connection between a conductive metal plate and the outer frame is ensured, and a heat transfer path is increased, so that heat inside the capacitor capable of realizing rapid heat dissipation can be rapidly conducted out, and a rapid heat dissipation effect is achieved.