This invention relates to the field of
satellite optoelectronic measurement and sensing technology, and particularly to a thermal management device and method for space optoelectronic imaging elements on satellites. The thermal management device includes a bracket, a
metal shell, a circuit board, a secondary TEC cooling
assembly, a
heat sink, micro heat pipes, and a
heat transfer fixing plate. Cooling is achieved through the secondary TEC cooling
assembly, which is connected in series with the
heat sink, micro heat pipes, and the
satellite cabin's thermostatic plate. The
heat sink, micro heat pipes, and
heat transfer fixing plate form an integrated heat conduction chain. A large
heat pipe is pre-embedded inside the
satellite cabin's thermostatic plate, and heat is dissipated from the
heat transfer fixing plate through internal
working fluid circulation, completing the entire process of thermal management for the optoelectronic imaging element. This achieves thermal management and miniaturized design for large-area single-
photon imaging elements. The heat transfer fixing plate provides the thermal management device with resistance to the space mechanical environment, making it suitable for
aerospace engineering applications. The overall thermal
management process is simple, convenient to operate, and provides reliable thermal management results.