Circuits, such as chiplets and memory devices, and surface-emitting light sources, such as vertical-cavity surface-emitting lasers (VCSELs), are bonded to a front side of a photonic
wafer-scale
interposer (PWSI). The PWSI includes waveguides for communication among the circuits, memory devices, and surface-emitting light sources. Memory devices are grouped by a memory fabric, resulting in a disaggregated memory structure. A first circuit accesses memory. The accessing is based on the disaggregated memory structure. The accessing can include sending electrical data by the first circuit to a first surface-emitting
light source. A degree of freedom (DoF) of a
light beam emitted by the first surface-emitting
light source can be modulated. The emitted
light beam can comprise a degree of freedom modulated beam (DFMB) that is based on the sent electrical data. The memory fabric can allocate memory based on memory needs of the first circuit.