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50results about How to "Addressing Insufficient Selectivity" patented technology

Isolated measurement circuit for sensor resistance

A circuit and method is disclosed for measuring the resistance of a resistive sensor, such as a PTC or NTC temperature sensor used for monitoring the temperature of the windings of an electric motor. The measurement circuit is based on an electronic circuit in which conductors from a sensor located in the object to be monitored are connected to an amplifier circuit in a feedback configuration that reduces the DC level supplied to the voltage divider when the sensor resistance increases. The measured signal is amplified and, using a comparator to compare it with the output voltage of a sawtooth generator, a continuous PWM (Pulse Width Modulation) signal is generated and transmitted in digital format to a SELV electronic circuit, for example through an opto-isolator. The essentially logarithmic signal amplification makes it possible to reliably distinguish between a short circuit in the sensor circuit and low values of sensor resistance.
Owner:ABB OY

Dual damascene process flow enabling minimal ULK film modification and enhanced stack integrity

Interconnect structures possessing an organosilicate glass interlayer dielectric material with minimal stoichiometeric modification and optionally an intact organic adhesion promoter for use in semiconductor devices are provided herein. The interconnect structure is capable of delivering improved device performance, functionality and reliability owing to the reduced effective dielectric constant of the stack compared with that of those conventionally employed because of the use of a sacrificial polymeric material deposited onto the dielectric and optional organic adhesion promoter during the barrier open step done prior to ashing the patterning material. This sacrificial film protects the dielectric and optional organic adhesion promoter from modification / consumption during the subsequent ashing step during which the polymeric film is removed.
Owner:GLOBALFOUNDRIES INC

Spectroscopic assembly and method

A spectrometer assembly is provided having an optical transmission filter including a stack of continuous, non-patterned alternating dielectric and metal layers. Angle-dependent transmission wavelength shift of the optical transmission filter with continuous metal layers is small e.g. in comparison with multilayer dielectric filters, facilitating size reduction of the spectrometer assembly.
Owner:VIAVI SOLUTIONS INC

Polymer Functionalized Molecular Sieve/Polymer Mixed Matrix Membranes

The present invention discloses polymer functionalized molecular sieve / polymer mixed matrix membranes (MMMs) with either no macrovoids or voids of less than several Angstroms at the interface of the polymer matrix and the molecular sieves by incorporating polymer functionalized molecular sieves into a continuous polymer matrix. The MMMs exhibit significantly enhanced selectivity and / or permeability over the polymer membranes made from the corresponding continuous polymer matrices for separations. The MMMs are suitable for a variety of liquid, gas, and vapor separations such as deep desulfurization of gasoline and diesel fuels, ethanol / water separations, pervaporation dehydration of aqueous / organic mixtures, CO2 / CH4, CO2 / N2, H2 / CH4, O2 / N2, olefin / paraffin, iso / normal paraffins separations, and other light gas mixture separations.
Owner:UOP LLC

Isolated measurement circuit for sensor resistance

A circuit and method is disclosed for measuring the resistance of a resistive sensor, such as a PTC or NTC temperature sensor used for monitoring the temperature of the windings of an electric motor. The measurement circuit is based on an electronic circuit in which conductors from a sensor located in the object to be monitored are connected to an amplifier circuit in a feedback configuration that reduces the DC level supplied to the voltage divider when the sensor resistance increases. The measured signal is amplified and, using a comparator to compare it with the output voltage of a sawtooth generator, a continuous PWM (Pulse Width Modulation) signal is generated and transmitted in digital format to a SELV electronic circuit, for example through an opto-isolator. The essentially logarithmic signal amplification makes it possible to reliably distinguish between a short circuit in the sensor circuit and low values of sensor resistance.
Owner:ABB OY

Plasma etching method and computer-readable storage medium

In a plasma etching method, a substrate, on which an oxide film as a target layer to be etched, a hard mask layer, and a patterned photoresist are sequentially formed, is loaded into the processing chamber and mounted on a lower electrode. A processing gas containing CxFy (x is 3 or less and y is 8 or less), C4F8, a rare gas and O2 is supplied and a plasma of the processing gas is generated by applying a high frequency power to an upper or a lower electrode. Further, a high frequency power for bias is applied to the lower electrode, and a DC voltage is applied to the upper electrode.
Owner:TOKYO ELECTRON LTD

Chemical mechanical polishing slurry, cmp process and electronic device process

To provide a slurry for Chemical Mechanical Polishing, a Chemical Mechanical Polishing method using said slurry, and a method of producing electronic devices using said method that makes it possible to achieve a low scratch process capability in processing surfaces such as SiO2 film surfaces and the like and also to enable speed polishing to attain a high processing efficiency.Slurry for Chemical Mechanical Polishing characterized in comprising abrasive grains and water, wherein said abrasive grains are composite particles coated with ceria particles consisting of organic host particles and ceria particles, zeta potential of said composite particles being a negative potential, the organic host particles constituting the composite particles coated with ceria particles are organic host particles to which carboxyl groups and sulfonyl groups are introduced; the slurry is added with panarization additive; and the planarization additive is poly(methyl)acrylic acid ammonium salt.
Owner:HITACHI CHEM CO LTD

Method of etching carbon-containing layer and method of fabricating semiconductor device

A method of etching a carbon-containing layer on a semiconductor substrate using a Si-containing gas and a related method of fabricating a semiconductor device in which a plurality of contact holes having excellent sidewall profiles are formed by etching an interlayer insulating layer using a carbon-containing layer pattern formed in accordance with the invention and having a width of several tens of nm as an etch mask are provided. To etch a carbon-containing layer to be used as a second etch mask, a first mask pattern is formed on the carbon-containing layer to partially expose a top surface of the carbon-containing layer. The carbon-containing layer is then anisotropically etched with a plasma of a carbon-etching mixture gas formed of O2 and a Si-containing gas using the first mask pattern as a first etch mask to form the carbon-containing layer pattern. Neighboring contact holes in a high-density cell array region fabricated in accordance with this invention are distinctly separated from each other, even when an interval between the neighboring contact holes is as small as several tens of nm or less; and, thus, a short-circuit between neighboring unit cells using such contact holes can be prevented.
Owner:SAMSUNG ELECTRONICS CO LTD

Plasma etching method, plasma processing apparatus, control program and computer readable storage medium

A plasma etching method includes the step of: etching a silicon layer of a target object by using a plasma generated from a processing gas containing a fluorocarbon gas, a hydrofluorocarbon gas, a rare gas and an O2 gas and by employing a patterned resist film as a mask. The target object includes the silicon layer whose main component is silicon and the patterned resist film formed over the silicon layer.
Owner:TOKYO ELECTRON LTD

Filtering membranes on the basis of welded polymer structures and method for manufacture thereof

InactiveUS6773590B2Controlled distributionShort filtration pathSemi-permeable membranesMembranesSingle stageEngineering
The filtering membranes of the present invention are made from a pair of polymer films stretched in a liquid surface-active medium for the formation of crazes filled with the aforementioned medium. The crazed films are perforated and then stack together in a stretched or released state and are welded together into a sealed structure with a plurality of parallel welding seams arranged, e.g., in mutually perpendicular directions, so that a plurality of sealed cells is formed. The cells have on one side of the membrane input openings and on the other side output openings. If an input opening is in one cell, then an output opening is in the adjacent cell. Adjacent cells are interconnected only through the welding seams. Welding can be carried out by contact heating or with the use of a laser beam, or the like. The material of the welding seam has an amorphous structure. The substance captured inside the crazes may comprise a dispersion medium used for fixing dimensions of the crazes or a substance for treating the fluid being filtered. In operation, the medium to be filtered diffuses from the input cells to the output cells of the membrane through the material of the welding seams. Filtering is enhanced if the material of the seams has aforementioned crazes. In such a membrane, the total length of the welding seams on the area of 1 m<2 >may reach several hundred thousand meters. The membrane possesses selectivity sufficient for separation of two or multiple-component mixtures in a single-stage process. Depending on the method used for preparation of the polymer-film surface prior to welding, the membrane filter may have efficiency from 5 to 40,000 kg / m<2>xD.
Owner:SHKOLNIK ALEXANDER

Etchant and method for forming bumps

A method for forming bumps is disclosed. First, a substrate having an adhesive, a barrier, and a wetting layer thereon is provided. Next, a patterned photoresist is formed on the wetting layer, in which the patterned photoresist includes at least one opening for exposing a portion of the wetting layer. Next, a solder is deposited in the opening, and a stripping process is performed to remove the patterned photoresist. Next, a first etchant is utilized to perform a first etching process for etching a portion of the wetting and barrier layers by utilizing the solder as a mask, in which the first etchant is selected from the group consisting of: sulfuric acid, phosphoric acid, ferric chloride, ammonium persulfate, and potassium monopersulfate. Next, a second etchant is utilized to perform a second etching process removing a portion of the adhesive layer, and a reflow process is performed to form a bump.
Owner:ADVANCED SEMICON ENG INC

Receiver apparatus and method of processing received signal which attain optimum SNR

ActiveUS20060211396A1Optimize SNRSufficient frequency selectivityTelevision system detailsColor television detailsIntermediate frequencyFrequency band
A receiver apparatus includes a band-pass filter having a variable frequency band coupled to a node for receiving a received signal including a plurality of channels to output at an output node thereof a limited-band signal made by limiting a frequency band of the received signal to a frequency band of a desired channel, a frequency conversion unit coupled to the output node of the band-pass filter to output at an output node thereof an intermediate frequency signal made by converting frequencies of the limited-band signal, and a control unit configured to adjust an intermediate frequency of the intermediate frequency signal by controlling the frequency conversion unit in response to at least one of a signal speed and a channel frequency interval of the received signal.
Owner:FUJITSU SEMICON LTD

Plasma etching method, plasma processing apparatus, control program and computer readable storage medium

A plasma etching method includes the step of: etching a silicon layer of a target object by using a plasma generated from a processing gas containing a fluorocarbon gas, a hydrofluorocarbon gas, a rare gas and an O2 gas and by employing a patterned resist film as a mask. The target object includes the silicon layer whose main component is silicon and the patterned resist film formed over the silicon layer.
Owner:TOKYO ELECTRON LTD

Method of etching carbon-containing layer and method of fabricating semiconductor device

A method of etching a carbon-containing layer on a semiconductor substrate using a Si-containing gas and a related method of fabricating a semiconductor device in which a plurality of contact holes having excellent sidewall profiles are formed by etching an interlayer insulating layer using a carbon-containing layer pattern formed in accordance with the invention and having a width of several tens of nm as an etch mask are provided. To etch a carbon-containing layer to be used as a second etch mask, a first mask pattern is formed on the carbon-containing layer to partially expose a top surface of the carbon-containing layer. The carbon-containing layer is then anisotropically etched with a plasma of a carbon-etching mixture gas formed of O2 and a Si-containing gas using the first mask pattern as a first etch mask to form the carbon-containing layer pattern. Neighboring contact holes in a high-density cell array region fabricated in accordance with this invention are distinctly separated from each other, even when an interval between the neighboring contact holes is as small as several tens of nm or less; and, thus, a short-circuit between neighboring unit cells using such contact holes can be prevented.
Owner:SAMSUNG ELECTRONICS CO LTD

Plasma etching method and computer-readable storage medium

In a plasma etching method for plasma-etching an etching stop film after plasma-etching a low-k film in a structure in which a wiring layer, the etching stop film made of an SiC-based material, the low-k film and an etching mask are formed in that order on a substrate, the method includes the step of arranging the structure having the plasma-etched low-k film in a processing chamber in which a first and a second electrode are provided to face each other at vertically separated locations. The plasma etching method further includes the steps of introducing a processing gas containing NF3 into the processing chamber; generating a plasma by applying a high frequency power to one of the first and the second electrode; and applying a DC voltage to said one of the electrodes.
Owner:TOKYO ELECTRON LTD

High-efficiency separation and purification method for pneumocandin

InactiveCN108250273AAddressing Insufficient SelectivityThe system is simple and environmentally friendlyPeptide preparation methodsSurface modificationChemistry
The objective of the invention is to provide a high-efficiency separation and purification method for pneumocandin. The high-efficiency separation and purification method is characterized in that a hydrophilic silica-gel material surface-modified by polar groups is adopted; a crude pneumocandin product is dissolved by using a mixture of an organic solvent and an aqueous solution in a certain ratio; after sample loading, a mixture of an organic solvent and water in a certain ratio is used for elution; and purification is carried out so as to obtain pneumocandin B0 with chromatographic purity ofmore than 99%, wherein the content of the critical impurity C0 is less than 0.1%. The method provided by the invention realizes high-efficiency separation and purification of pneumocandin B0, has thecharacteristics of good stability, great sample loading amount, simple operation, controllability, etc., and is applicable to industrial separation and purification.
Owner:浙江华谱新创科技有限公司

Combined mass-to-charge ratio and charge state selection in tandem mass spectrometry

A mass spectrometer is disclosed comprising an ion mobility spectrometer and an ion gate. A collision cell is arranged downstream of the ion gate. The operation of the ion mobility spectrometer and the ion gate are synchronised so that only ions having a particular mass to charge ratio and a desired charge state are onwardly transmitted to the collision cell.
Owner:MICROMASS UK LTD

Resist underlayer composition and process of producing integrated circuit devices using the same

A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3,[R1O]3Si—X   [Chemical Formula 1][R2O]3Si—R3   [Chemical Formula 2][R4O]3Si—Si[OR5]3.   [Chemical Formula 3]
Owner:CHEIL IND INC

Cell-free and minimized metabolic reaction cascades for the production of chemicals

Provided are enzymatic processes for the production of chemicals like ethanol from carbon sources like glucose, in particular, a process for the production of a target chemical is disclosed using a cell-free enzyme system that converts carbohydrate sources to the intermediate pyruvate and subsequently the intermediate pyruvate to the target chemical wherein a minimized number of enzymes and only one cofactor is employed.
Owner:CLARIANT PROD DEUT GMBH

Forming integrated circuits using selective deposition of undoped silicon film seeded in chlorine and hydride gas

A polysilicon film is formed with enhanced selectivity by flowing chlorine during the formation of the film. The chlorine acts as an etchant to insulative areas adjacent polysilicon structures on which the film is desired to be formed. Bottom electrodes for capacitors are formed using this process, followed by an anneal to create hemishperical grain (HSG) polysilicon. Multilayer capacitor containers are formed in a non-oxidizing ambient so that no oxide is formed between the layers. The structure formed is planarized to form separate containers made from doped and undoped amorphous silicon layers. Selected ones of undoped layers are seeded in a chlorine containing environment and annealed to form HSG. A dielectric layer and second electrode are formed to complete the cell capacitor.
Owner:MICRON TECH INC

Process and plant for preparation of hydrogen and separation of carbon dioxide

ActiveUS20220048768A1Improve thermal integration of processHigh calorific valueProductsSolidificationSteam reformingSyngas
The invention relates to a process for preparing hydrogen by reforming hydrocarbons with steam, and for separation of carbon dioxide. The process includes one endothermic and one autothermal reforming step for production of a synthesis gas stream, wherein heat generated in the autothermal reforming step is utilized for heating in the endothermic reforming step. The process also includes a step of converting the synthesis gas stream obtained for enrichment with hydrogen, a step of separating the hydrogen thus prepared by pressure swing adsorption, and a step of separation of carbon dioxide from the residual gas obtained in the pressure swing adsorption. The reforming units for the endothermal and autothermal reforming steps are arranged parallel to one another or in series.
Owner:LAIR LIQUIDE SA POUR LETUDE & LEXPLOITATION DES PROCEDES GEORGES CLAUDE

Production of chiral materials using crystallization inhibitors

A method is disclosed for producing a chiral gel. A polymer including chiral monomers, such as a protein, is dissolved to generate a sol, which is optionally dialyzed. The sol is contacted with a crystallization inhibitor that allows it to form a gel. The gel in wet or dried form is useful for performing chiral separations.
Owner:EVOLVED NANOMATERIAL SCI
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