The invention relates to the technical field of clamping devices, and discloses a
semiconductor wafer clamping and grabbing device which comprises a U-shaped supporting plate, the outer surface of the U-shaped supporting plate is slidably connected with a guide
assembly, one side of the guide
assembly is fixedly connected with a first inclined plate, one end of the first inclined plate is rotationally connected with a positioning wheel
assembly, and the other end of the first inclined plate is fixedly connected with a second inclined plate. An L-shaped plate is fixedly connected to the upper surface of the guide assembly, an air cylinder is fixedly connected to the outer surface of the L-shaped plate, and a second inclined plate is rotationally connected to the front end of the U-shaped supporting plate. By arranging the positioning wheel assembly, when the positioning wheel assembly makes contact with the
peripheral edge of the
wafer, the annular air bag can deform in a self-adaptive mode according to the shape and the surface condition of the edge of the
wafer, damage such as scratches and indentations caused by rigid contact is avoided, the whole positioning wheel assembly can flexibly clamp the
peripheral edge of the wafer, and in the clamping process, the clamping efficiency is improved. Through cooperation of the sleeve, the
piston and other parts, instantaneous
power output by the air cylinder can be buffered, and the wafer is further prevented from making hard contact with the positioning wheel assembly.