Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

3results about How to "Meet specifications" patented technology

A multi-film TOSA packaging structure

ActiveCN224438223Ueasy transfersmall spot
This invention belongs to the field of optical communication technology, specifically providing a multi-film TOSA packaging structure, including a TO-CAN and an optical fiber adapter. The optical fiber adapter is installed at the cap end of the TO-CAN and forms a mirror cavity with the TO-CAN. A first collimating lens, a second collimating lens, and a filter are disposed within the mirror cavity. The first collimating lens, the filter, the second collimating lens, and the optical fiber port of the optical fiber adapter are arranged sequentially along the emission optical path of the TO-CAN. The filter is used to prevent reflected light from entering the TO-CAN or the optical fiber port. This multi-film TOSA packaging structure provided by this invention is highly integrated. The collimating lens converts the laser light output into parallel light, resulting in a small spot size, facilitating optical path transmission, and reducing energy loss. Through the cooperation of the collimating lens and the filter, reflected light in the optical path does not affect signal quality in the TOSA coaxial package, meeting specification requirements and achieving hermetic packaging.
Owner:WUHAN HUAGONG GENUINE OPTICS TECH CO LTD

Punching die for nut part

The utility model discloses a stamping die for nuts, which comprises an upper die assembly and a lower die assembly, the upper die assembly comprises an upper die holder, the bottom of the upper die holder is fixedly connected with an upper die plate, the bottom of the upper die plate is fixedly connected with a punch fixing plate, and the bottom of the punch fixing plate is fixedly connected with a plurality of first punches. The second punches are positioned on one side of each first punch; the lower die assembly comprises lower die bases located on the two sides, the tops of the two lower die bases are jointly and fixedly connected with a lower die plate, and a channel allowing a nut plate to penetrate through is formed in the top of the lower die plate. The bottom of the channel is provided with a first punching hole allowing the first punch to penetrate through and a second punching hole allowing the second punch to penetrate through. According to the utility model, the combination of the circular first punch and the regular hexagonal second punch is adopted and matched with the punching holes with the corresponding shapes on the lower template, so that the hole pattern required by the nut can be efficiently and accurately punched, the processing efficiency and the forming precision of the nut are improved, and the strict requirements of industrial production on the specification and the quality of the nut are met.
Owner:ZHEJIANG CHUANGSHITONG AUTO PARTS CO LTD

Display panel and display device

The utility model relates to a display panel and a display device. The display panel provided by the utility model comprises a half-voltage circuit, a step-down circuit and a power management integrated circuit, the output end of the half-voltage circuit is connected with the input end of the step-down circuit, and the output end of the step-down circuit is connected with the input end of an operational amplifier in the power management integrated circuit; the step-down circuit inputs the semi-analog power supply voltage from the half-voltage circuit through an input end, outputs the semi-analog power supply voltage through an output end when the display panel is turned on, and outputs a first voltage through the output end when the display panel is turned off; the first voltage is less than the semi-analog power supply voltage and the discharge time of the first voltage is less than the discharge time of the analog power supply voltage. According to the technical scheme provided by the utility model, the semi-analog power supply voltage can be always smaller than the analog power supply voltage.
Owner:KUSN INFOVISION OPTOELECTRONICS