9results about How to "Meet specifications" patented technology

The invention provides a high-dielectric-constant NP0 type dielectric ceramic material as well as a preparation method and application thereof. The high dielectric constant NP0 type dielectric ceramic material is prepared from the following raw materials: 15 mol% to 16 mol% of BaCO3 and / or BaO, 2 mol% to 6 mol% of Nd2O3, 2 mol% to 6 mol% of Sm2O3, 5 mol% to 10 mol% of Bi2O3 and 55 mol% to 70 mol% of TiO2. The ceramic dielectric material provided by the invention has medium sintering temperature, high dielectric constant, low dielectric loss and high insulation resistance, and meets the specification requirements of NP0 type dielectric ceramics.

The present invention provides a nail hole forming tool, which relates to the technical field of CNC machining; it includes a body and a nail hole opened on the body, the nail hole includes an orifice and a hole bottom; along the direction away from the orifice, the nail hole is provided with a flaring section and a main section in sequence; the radial dimension of the inner wall of the flaring section is R1, and the value of R1 increases in sequence from one end of the flaring section away from the orifice to the end close to the orifice; an electroplating layer is provided in the nail hole, and the thickness of the electroplating layer in the flaring section is D, and the value of D increases in sequence in the direction away from the orifice; the radial dimension of the nail body adapted to the nail hole is R2; wherein R1‑2*D≥R2. The present invention sets a flaring section in the high potential area of ​​the nail hole, and as the potential increases, the radial dimension of the inner wall of the flaring section is designed to increase in sequence in the direction close to the orifice, so that each area of ​​the nail hole after electroplating can meet the specification requirements of subsequent nail hole processing, thereby improving the stability of machining.

This invention belongs to the field of optical communication technology, specifically providing a multi-film TOSA packaging structure, including a TO-CAN and an optical fiber adapter. The optical fiber adapter is installed at the cap end of the TO-CAN and forms a mirror cavity with the TO-CAN. A first collimating lens, a second collimating lens, and a filter are disposed within the mirror cavity. The first collimating lens, the filter, the second collimating lens, and the optical fiber port of the optical fiber adapter are arranged sequentially along the emission optical path of the TO-CAN. The filter is used to prevent reflected light from entering the TO-CAN or the optical fiber port. This multi-film TOSA packaging structure provided by this invention is highly integrated. The collimating lens converts the laser light output into parallel light, resulting in a small spot size, facilitating optical path transmission, and reducing energy loss. Through the cooperation of the collimating lens and the filter, reflected light in the optical path does not affect signal quality in the TOSA coaxial package, meeting specification requirements and achieving hermetic packaging.

The invention discloses a multi-suction-cylinder integral type foundation structure of a tension leg, the multi-suction-cylinder integral type foundation structure of the tension leg comprises a plurality of connecting rods and a plurality of suction cylinders, the connecting rods are sequentially connected end to end, the suction cylinders are connected to the connecting rods, lifting lugs and lifting lugs are connected to the suction cylinders, and the lifting lugs are connected to the connecting rods. The suction barrel is inserted into seabed soil; the ends of the multiple connecting rods are connected with first lug plates, vertical supports of the connecting rods are connected with second lug plates, and the first lug plates or the second lug plates are connected with anchor chains so that loads can be transmitted to seabed soil through the suction barrels connected with the connecting rods. The multi-suction-barrel integral foundation structure of the tension leg is suitable for a deep sea area, the whole structure is made of steel, the overall weight is small, the rated using amount of a floating crane and the specification requirements of related offshore construction equipment are met, and meanwhile the manufacturing cost and the transportation and installation cost can be reduced. The integral foundation structure can meet the design and use requirements, and the construction quality of the integral foundation structure is controllable.

The present invention relates to the technical field of tubular water-cooled resistors, and in particular to a water-cooled resistor suitable for large current impact, comprising a resistor bar and a plurality of water-cooled tubes made of metal, wherein the resistor bar comprises a resistor wire and an insulating layer wrapped around the outer side of the resistor wire, wherein the plurality of water-cooled tubes are arranged around the circumference of the resistor bar, and the water-cooled tubes are tightly attached to the insulating layer along the length direction of the resistor bar, and the side of the water-cooled tube is provided with a long strip-shaped inwardly concave arc groove arranged along the length direction of the water-cooled tube, and the inwardly concave radius of the arc groove is equal to the radius of the insulating layer, and the arc grooves of the plurality of water-cooled tubes together tightly and completely surround the circumference of the insulating layer; a clamping ring is provided on the outer side of the plurality of water-cooled tubes, so as to clamp the plurality of water-cooled tubes; and the plurality of water-cooled tubes and the resistor bar are bent together into a spiral shape that can be stretched and deformed. The water-cooled tube is in close contact with the resistor bar, which improves the heat dissipation performance of the resistor and increases the power density of the resistor.

The invention discloses a high PPI HDM flicker adjustment process, and the key points of the technical scheme are that the high PPI HDM flicker adjustment process comprises the following steps: utilizing a PWM output signal of an IC body to be linked with a backlight driving chip, carrying out the expression control of an LCD module, and outputting a duty backlight control signal which is the same as a client mainboard; whether the backlight duty ratio meets the set specification or not is determined through a jig duty ratio checking loop; whether the LED loop has open circuit and short circuit conditions or not is confirmed through the voltage checking loop; after the related confirmation is OK, the signal source is automatically switched to a flicker adjustment picture; after the flicker picture is represented, the CA410 is linked to capture a flicker curve after a short time, and a VCOM setting parameter corresponding to the minimum flicker value is recorded; and after optical parameter adjustment, the recorded VCOM value is subjected to OTP burning. On the basis of the existing material and process level of the LCD, the characteristics of the flicker are considered, the use scene of an HMD project is effectively combined, the flicker value is obviously increased, and the specification requirements of customers are met.

The invention provides a high-dielectric-constant temperature-stable dielectric ceramic material as well as a preparation method and application thereof. The ceramic dielectric material is prepared from the following raw materials: 15 mol% to 16 mol% of BaCO3 and / or BaO, 5 mol% to 15 mol% of Sm2O3, 5 mol% to 10 mol% of Bi2O3 and 60 mol% to 80 mol% of TiO2. The ceramic dielectric material provided by the invention has medium sintering temperature, high dielectric constant, low dielectric loss and high insulation resistance.

The utility model discloses a stamping die for nuts, which comprises an upper die assembly and a lower die assembly, the upper die assembly comprises an upper die holder, the bottom of the upper die holder is fixedly connected with an upper die plate, the bottom of the upper die plate is fixedly connected with a punch fixing plate, and the bottom of the punch fixing plate is fixedly connected with a plurality of first punches. The second punches are positioned on one side of each first punch; the lower die assembly comprises lower die bases located on the two sides, the tops of the two lower die bases are jointly and fixedly connected with a lower die plate, and a channel allowing a nut plate to penetrate through is formed in the top of the lower die plate. The bottom of the channel is provided with a first punching hole allowing the first punch to penetrate through and a second punching hole allowing the second punch to penetrate through. According to the utility model, the combination of the circular first punch and the regular hexagonal second punch is adopted and matched with the punching holes with the corresponding shapes on the lower template, so that the hole pattern required by the nut can be efficiently and accurately punched, the processing efficiency and the forming precision of the nut are improved, and the strict requirements of industrial production on the specification and the quality of the nut are met.

The utility model relates to a display panel and a display device. The display panel provided by the utility model comprises a half-voltage circuit, a step-down circuit and a power management integrated circuit, the output end of the half-voltage circuit is connected with the input end of the step-down circuit, and the output end of the step-down circuit is connected with the input end of an operational amplifier in the power management integrated circuit; the step-down circuit inputs the semi-analog power supply voltage from the half-voltage circuit through an input end, outputs the semi-analog power supply voltage through an output end when the display panel is turned on, and outputs a first voltage through the output end when the display panel is turned off; the first voltage is less than the semi-analog power supply voltage and the discharge time of the first voltage is less than the discharge time of the analog power supply voltage. According to the technical scheme provided by the utility model, the semi-analog power supply voltage can be always smaller than the analog power supply voltage.