The application discloses a high-durability FeFET based on a ferroelectric
semiconductor channel and an antiferromagnetic
gate dielectric and a preparation method thereof. A back gate
electrode layer, an antiferromagnetic
gate dielectric layer, a ferroelectric
semiconductor channel layer, a top gate high-k
gate dielectric layer and a top gate
electrode layer are sequentially stacked in the FeFET structure. The antiferromagnetic gate
dielectric layer serves as a back gate
dielectric layer, and the top gate high-k gate
dielectric layer serves as a top gate
dielectric layer. The thickness of the back gate
dielectric layer is greater than that of the top gate
dielectric layer, and an asymmetric double-gate structure is formed. In the application, a
hafnium oxide-based antiferromagnetic film is used to replace a ferroelectric film as a gate dielectric of the FeFET, so that the
operating voltage is effectively reduced. There is no
interface layer between the ferroelectric
semiconductor channel and the antiferromagnetic gate dielectric, and the durability failure caused by the charge
trapping and defect generation associated with the
interface layer of the traditional FeFET is inhibited. The out-of-plane
spontaneous polarization of the ferroelectric semiconductor channel is continuously and accurately adjustable, and the FeFET has a gate storage mode and a channel storage mode which are switched with each other based on the asymmetric double-gate structure of the FeFET, so that the FeFET is expected to exhibit higher durability.