This invention relates to the field of
chip heat sink technology, specifically to a
heat sink for chips, comprising a base, the base including a heat-conducting plate for contacting the
chip; a vapor chamber on the heat-conducting plate, with multiple heat pipes evenly connected around the circumference of the vapor chamber, multiple annular heat dissipation fins fixedly inserted on the heat pipes, the multiple heat dissipation fins being distributed vertically, each heat dissipation fin having a central hole, a
cooling pipe rotatably disposed within the central hole of the multiple heat dissipation fins, a fan disposed on the inner side of the top of the
cooling pipe, and multiple liquid cooling plates disposed on the outer circumference of the
cooling pipe, the liquid cooling plates rotating synchronously with the cooling
pipe, each liquid cooling plate being located between two adjacent heat dissipation fins, the cooling
pipe having multiple air outlets evenly distributed along the circumference of the cooling
pipe and evenly distributed vertically along the cooling pipe, the
diameter of the air outlets gradually decreasing from top to bottom, extending the overall service life of the heat dissipation fins.