The application provides a combined bottom plate structure of a
laser, which is a multi-layer plate integrated structure fixedly connected to the bottom of the inner cavity of the
laser, comprising a support plate, a
semiconductor refrigerator, a heat insulation pad, a base plate and a mounting plate; the bottom surface of the support plate is fixedly connected to the bottom of the inner cavity of the
laser shell; the
semiconductor refrigerator and the heat insulation pad form a first square body structure, the bottom surface of the first square body structure is connected to the top surface of the support plate; the mounting plate and the base plate form a second square body structure; the bottom surface of the second square body structure is connected to the top surface of the first square body structure, and the top surface of the second square body structure is an optical platform for bearing a plurality of optical components and absorbing heat. The application also provides a heat dissipation method for the combined bottom plate structure of the laser. The application solves the technical problem that the bottom plate structure of the existing laser cannot simultaneously meet the requirements of high-efficiency heat dissipation, accurate
temperature control and stable structure due to the single material.