The present invention discloses a method for removing a single layer of
graphene based on a pulsed
ion beam, including controlling the
sputtering energy and pulse width of the pulsed
ion beam to be maintained between the
sputtering thresholds of the defective
surface layer and the complete bottom layer of the multilayer
graphene, and bombarding the multilayer
graphene with the pulsed
ion beam at an angle, thereby selectively removing carbon atoms in the defective
surface layer and retaining carbon atoms in the complete bottom layer at the same time. The present invention can be used for selective and controlled removal of atomic
layers, and achieves precise exfoliation of large-scale single atomic
layers. Compared with conventional technologies, the present invention is more controllable, has a wider
processing window, higher performance and quality, and the pulsed
ion beam can achieve batch acquisition of complete atomic layer surfaces over a large area, which can solve the problems of uncontrollable number of
layers and low efficiency in existing graphene
material removal methods, and provides a new graphene removal solution for graphene applications in semiconductors,
light detection, and synthetic
catalysis, expanding the potential for innovative applications of two-dimensional materials.