3results about How to "Reduce EMI" patented technology

A touch module, a display device including the same, and an electronic device including the display device are provided. The touch module includes: a touch panel including touch electrodes; and a touch panel driver configured to provide a touch driving signal to the touch panel and detect a touch of the object based on a touch sensing signal received from the touch panel in response to the touch driving signal. The touch panel is of a self-pointing type, and the touch panel driver includes touch drivers, and each of the touch drivers is configured to provide touch driving signals having different frequencies to the touch panel.

The invention discloses a backlight display data signal processing method, a backlight driving chip and a backlight module, and the backlight driving chip carries out the shaping processing of a received backlight display data signal, obtains a backlight display data signal represented by a square wave, determines a slope adjustment gear based on a received control instruction, and carries out the adjustment of the slope. And adjusting the rising edge and the falling edge of the backlight display data signal represented by the square wave based on the slope adjustment gear to obtain a target backlight display data signal, and sending the control instruction and the target backlight display data signal to a next-stage backlight driving chip. As the target backlight display data signal sent to the next-stage backlight driving chip is the signal obtained after the rising edge and the falling edge are adjusted, the rising and falling speed of the signal can be reduced, EMI can be reduced, and compared with an EMI reduction mode provided by the related technology, the chip size, noise, heat and cost can be reduced.

This utility model relates to the field of circuit equipment technology and discloses a busbar copper bus structure for improving parasitic inductance. It includes an improved busbar copper bus and a non-improved busbar copper bus. The improved busbar copper bus has a copper busbar substrate in the middle, a bent portion fixedly connected to the top of the substrate, a connecting portion fixedly connected to the top of the bent portion, and wiring extension plates fixedly connected to the lower sides of both sides of the substrate. A bent plate is fixedly connected to the other end of each wiring extension plate, and a wiring plate is fixedly connected to the other end of each bent plate. This busbar copper bus structure for improving parasitic inductance has a short distance of 17.5mm from the positive terminal of the positive busbar copper bus to the positive capacitor terminal, resulting in a shorter current path and better overall performance. It achieves the following technical effects: 1. Reduced parasitic inductance; 2. Improved dynamic response; 3. Optimized current sharing and thermal performance; 4. Suppression of electromagnetic interference (EMI); 5. Maximized capacitor efficiency.