The invention relates to the technical field of
semiconductor test equipment, in particular to a full-automatic high-precision probe
station, which utilizes multi-
physics field
coupling sensing and compensation to remarkably improve the positioning precision: by comprehensively collecting multi-
physics field data such as a temperature field and a
stress field and combining a
coupling algorithm to optimize a
compensation strategy, multi-factor interference is effectively counteracted, and the accuracy of the probe
station is improved. The positioning repetition precision can reach + / -0.05 [mu] m, and the test requirement of the advanced
semiconductor technology is met; a dynamic three-
dimensional modeling technology and dynamic adaptability enhancement are achieved, a dynamic three-
dimensional modeling system with the size affected by multi-
physical field data can update the form of a
test target in real time, test deviation caused by target deviation or surface fluctuation is avoided, and the adaptability of equipment to a complex
test scene is improved. The
automation degree is high, the testing efficiency is improved, the whole process of
data acquisition, modeling, compensation and testing can be completed without manual intervention, the calibration process is simplified, the testing period is shortened, and the method is suitable for batch detection scenes.