The invention discloses a ceramic material laser scribing process method. The ceramic material laser scribing process method comprises following steps that firstly, a ceramic material to be machined is placed on an absorbing platform of an optical fiber laser cutting machine, and positioning is carried out; secondly, a cutting path is preset, and the designed cutting path is input to software; thirdly, laser machining parameters are set, wherein under the focus exact position state, the scribing speed ranges from 180 to 220 mm/s, the pulse width is 0.1 ms, the peak power is 36 to 45 W, and therepeated frequency is 2400 to 2800 Hz; fourthly, the optical fiber laser cutting machine is started, and a ceramic material is subject to laser scribing. An optical fiber laser device is adopted to precisely scribe ceramic, under different process parameters of the control variate method, the machining technology is subject to experiment operation, through adjusting and optimizing of process parameter setting, the proper ceramic material laser scribing depth is obtained, product machining quality is improved, the process stability is good, market needs are met, and the good practical value isachieved.