12 results about "Pulsed laser ablation" patented technology

The present application relates to laser processing simulation method, specifically relates to a kind of single line scribing simulation method and multi-line scanning simulation method based on section lofting, for solving the problem that the calculation efficiency of existing pulse laser ablation simulation model is limited, simulation calculation time is still longer.The single line scribing simulation method based on section lofting provided by the present application, processing track is decomposed into stable section and unstable section, a small amount of key point pulse is obtained by discrete sampling on stable section, and the ablation section line of all key point pulse is calculated and obtained;The ablation section line of lofting key point pulse is obtained, the ablation surface of stable section is obtained, and then its ablation topography is obtained;The single line scribing simulation method based on section lofting of the present application, since only the ablation section line of a small amount of key point pulse is calculated, and lofting time is unrelated to pulse number, the calculation efficiency of workpiece ablation topography is greatly improved, and the more the total number of pulse, the higher the calculation efficiency is improved.

The present application relates to nozzle structure design and liquid film separation optimization technical field, specifically, the present application relates to a kind of nozzle structure optimization method of methanol direct injection engine, the present application aims at solving the problem that the fixed radius of chamfer of the outlet of the orifice of traditional nozzle cannot be adjusted dynamically with the inherent surface roughness of the outlet edge, which leads to the real-time viscosity fluctuation of methanol, and affects the power performance of engine.The surface roughness of the outlet of the orifice is quantified by atomic force microscope nanoscale scanning, combined with the viscosity of methanol under different working temperature, a dynamic mapping table is constructed by numerical simulation to match the correction coefficient of liquid film contact angle, the viscosity of methanol is determined according to real-time temperature and the correction coefficient is queried, the liquid film adhesion compensation value is calculated by algorithm model, the design size of the chamfer radius of the outlet of the orifice is adjusted dynamically, the chamfer radius control is realized by using pulse laser ablation technology combined with real-time monitoring, the viscosity and roughness change are adapted, the uniformity of liquid film separation is improved, and the combustion efficiency is optimized.

The invention discloses a high-activity large-size water electrolysis hydrogen evolution electrode, and relates to the technical field of clean energy materials, the electrode comprises a foamed nickel substrate and a nickel oxide micro-nano structure layer generated in situ on the skeleton surface of the foamed nickel substrate through pulse laser ablation; according to the high-activity large-size water electrolysis hydrogen evolution electrode, the nickel oxide micro-nano structure layer is generated on the skeleton surface of the foamed nickel substrate in situ through ablation of the pulse laser, so that the nickel oxide micro-nano structure layer is firmly connected with the foamed nickel substrate, and the electron conduction efficiency and the structural stability can be improved; the stability of the electrochemical activity is further improved; meanwhile, the nickel oxide micro-nano structure layer shows high hydrogen evolution catalytic activity, low overpotential, high electrochemical activity and excellent long-term stability in alkaline electrolyte.

The invention belongs to the field of lithium ion battery materials, and relates to a graded nano-porous Si quantum dot and C composite material, preparation thereof and application of the graded nano-porous Si quantum dot and C composite material in an all-solid-state lithium ion battery. According to the invention, the silicon-tin quantum dots are prepared through the cooperation of hydro-thermal synthesis and nanosecond pulse laser ablation; carrying out two-step treatment of'high-temperature oxidation-hydrogen reduction 'to prepare the graded nano-porous Si quantum dots; and then a hierarchical porous Si quantum dot core-carbon coating layer-three-dimensional interlaced conductive network composite structure is constructed with a conductive medium through sanding dispersion, ball milling compounding and high-temperature pyrolysis. The material relieves silicon lithiation volume expansion by virtue of a hierarchical porous structure, the electronic conductivity is improved by virtue of a three-dimensional conductive network, and the material is very suitable for constructing a battery negative pole piece and is used for an all-solid-state lithium ion battery. The first coulombic efficiency of the constructed all-solid-state lithium ion battery at the rate of 0.1 C is 85%-90%, and the capacity retention ratio of the constructed all-solid-state lithium ion battery after 100 cycles at the rate of 0.1 C is 95%-99%.

The application discloses a kind of liquid-phase laser preparation methods of molybdenum carbide carrier load metal composite material, first based on liquid-phase pulse laser ablation technology in acetone ablation elemental Ag or Au target material, obtain the Ag or Au nanoparticle of uniform dispersion with 1-2 layers carbon layer coating, the process metal nanoparticle size distribution is uniform and adjustable.Then utilize pulse laser irradiation technology to make oxide MoO3 powder in high carbon reduction liquid phase environment (acetone) in situ carbonization change into MoC nanoparticle.Finally, using 355nm wavelength laser irradiation metal nanoparticle and MoC mixed liquid can prepare Ag@MoC or Au@MoC etc. series composite materials.The method improves the traditional metal doped molybdenum carbide process, without adding any other surfactant, stabilizer and other chemical reagents, avoid the generation of other impurity products.Operation is simple, green and efficient, and strong universality.

A device for resecting hard biological tissue is provided. The device comprises a laser source configured to emit a laser beam, and a plurality of optical fibers, each having a proximal end optically coupled to the laser source and a distal end configured to emit the laser beam. A support structure maintains the distal ends of the optical fibers in a predetermined spatial arrangement. A window is positioned to permit transmission of the laser beam from the distal ends toward the tissue. At least one spacing element is associated with the support structure to maintain a predetermined distance between the distal ends and the tissue during operation. The device further includes a fluid delivery system associated with the support structure and configured to deliver a fluid to a cutting interface at the tissue. The arrangement enables precise, efficient, and controlled laser ablation or resection of hard tissue, with improved cooling and debris management.

This invention discloses a method and application for custom molding of multi-level T-shaped microstructure arrays, applicable to the field of microstructure fabrication technology for material surfaces. The method includes the following steps: S1, constructing a virtual three-dimensional microstructure model and 3D printing the model into a solid model; wherein the solid model includes a substrate, multiple bases, and multiple filaments; the multiple bases are arranged in an array on the substrate, with gaps between adjacent bases; the multiple filaments are arranged along the same axis, with multiple bases connected to the same filament; S2, based on the solid model, using pulsed laser ablation to remove the portions of all filaments located in the gaps, obtaining a multi-level T-shaped microstructure array. This method combines the advantages of personalized 3D printing with the precise positioning and micrometer-level fine processing capabilities of pulsed lasers to fabricate a multi-level T-shaped microstructure array surface, with a simple process and high manufacturing efficiency.

The invention relates to a laser processing simulation method, in particular to a single-row scribing simulation method and a multi-row scanning simulation method based on section lofting, and aims at solving the problems that the calculation efficiency of an existing pulse laser ablation simulation model is limited in improvement and the simulation calculation time is still long. According to the single-line scribing simulation method based on section lofting, a machining track is decomposed into a stable section and a non-stable section, a small number of key point pulses are obtained on the stable section through discrete sampling, and ablation section lines of all the key point pulses are obtained through calculation; an ablation curved surface of the stable section is obtained by lofting an ablation section line of the key point pulse, and then the ablation morphology of the stable section is obtained; according to the single-row lineation simulation method based on section lofting, due to the fact that only the ablation section lines of a small number of key point pulses are calculated, and the lofting time is irrelevant to the number of the pulses, the calculation efficiency of the ablation morphology of the workpiece is greatly improved, and the larger the total number of the pulses is, the higher the improvement amplitude of the calculation efficiency is.

A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.

The invention discloses a method for recycling gold in surface treatment liquid. The method comprises the following steps that S1, pretreatment is conducted, specifically, macromolecular organic matter in the gold-containing surface treatment liquid is removed through ion exchange resin; s2, photoelectric synergistic reduction: introducing the pretreated solution into a photoelectric catalytic reaction module, and reducing gold ions in the solution into metal gold nanoparticles; s3, nanofluid interception: intercepting the metal gold nanoparticles by using a two-dimensional graphene / metal organic framework (MOF) composite nanofluid channel integrated on the surface of the electrode, and allowing the treatment liquid to permeate; and S4, intelligent regeneration: when the online conductivity sensor detects that the gold ion concentration of the outlet liquid is less than or equal to 0.1 ppm, starting the pulse laser ablation device to peel off the intercepted gold nanoparticles and collecting the intercepted gold nanoparticles. The laser with specific parameters is used for stripping and collecting the intercepted gold nanoparticles in a non-hot-melting state, so that gold recovery and intelligent regeneration of the device are realized.

Provided is a vertical double-pulse laser ablation cell and a use method thereof. A femtosecond laser window is formed in an upper end face of the main housing. The main housing is internally provided an infrared laser channel and a CCD image acquisition channel, which pass through a sample chamber, and a reaction gas channel, a carrier gas channel and a sample gas outlet channel, which communicate with the sample chamber. A spectral interface communicating with the sample chamber is obliquely formed in an upper end of an outer wall of the main housing. Both ends of the infrared laser channel, both ends of the CCD image acquisition channel, one end of the reaction gas channel, one end of the carrier gas channel, one end of the sample gas outlet channel and one end of the spectral interface are located on different outer walls of the main housing.

A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.