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118 results about "Pulsed laser ablation" patented technology

Method for connecting materials difficult to connect through ultrafast lasers

The invention discloses a method for connecting materials difficult to connect through ultrafast lasers. The method includes the following steps that firstly, a material A is ablated through ultrashort pulse lasers, removing is achieved through laser ablation, and a nano-micro-meter structure is obtained on the surface of the material A; secondly, impurities on the surface, with the nano-micro-meter structure, of the material A are removed through corrosive liquid; thirdly, in an inert gas or vacuum environment, a material B is deformed and flows to fill the nano-micro-meter structure of the material A, the material A and the material B are combined in a mechanical combination mode, and therefore the material A and the material B are connected, wherein the melting point and the hardness of the material A are higher than the melting point and the hardness of the material B. The method for connecting the materials difficult to connect through the ultrafast lasers is a new method which is flexible, high in efficiency and wide in application range and is used for improving the connecting strength of the materials, and the application of the method includes but is not limited to the development of a nuclear fusion reactor oriented to plasma materials, electric contact materials, heat sink materials, electronic packaging and advanced composite materials.
Owner:TSINGHUA UNIV

Pulse laser processing-based novel positive rake diamond abrasive tool manufacturing method

The invention relates to a pulse laser processing-based novel positive rake diamond abrasive tool manufacturing method, being characterized in that a diamond grinding wheel with orderly-arranged abrasive particles is eroded by pulse laser, so that a vertex angle of the diamond abrasive particles is changed from being greater than 90 degrees to being smaller than 90 degrees, thus a traditional negative rake grinding method of a diamond abrasive tool is changed, and the abrasive particles taking part in the grinding are changed into a positive rake machining mode during grinding. Compared with traditional grinding (namely negative rake grinding), when the positive rake diamond grinding wheel is used for grinding, three processes of scratching, plowing and cutting are not needed, cutting is directly performed, and the traditional grinding machining mode is changed. When the diamond grinding wheel performs positive rake grinding on a hard and brittle material, normal grinding force is less than tangential grinding force, and the normal grinding force and the tangential grinding force during positive rake grinding are both less than those during negative rake grinding, so that surface/subsurface damages, such as microcracks, residual stress, phase change, dislocation and ripple, of the hard and brittle material subjected to grinding are effectively reduced, and the surface completeness of the material can be greatly improved.
Owner:HUNAN UNIV

Preparation method of curved conformal microstrip antenna array surface

ActiveCN109755760AAvoid quality risks of electrical performance deteriorationAvoid quality risksIndividually energised antenna arraysSilver pasteMicrostrip antenna array
The invention discloses a preparation method of a curved conformal microstrip antenna array surface and aims to provide a technological method of a microstrip antenna completely conformal to a metal structural part. According to the technical scheme, microstrip patches selected to serve as antenna conformal array units, and a curved antenna array surface is directly printed on the metal structuralpart; sand-blasting roughening processing is performed first, wherein a direct writing pen A is adopted to spread a polyimide precursor solution in a layered mode on a sand-blasting surface of a metal carrier according to the shape and size of a dielectric layer of the microstrip antenna array surface till the requirement of total thickness is met, and after surface drying, temperature is raisedthrough a heating substrate for dehydration, and a conformal dielectric layer of the microstrip antenna array surface is formed through aggregation on the surface of the metal carrier; pulse lasers are adopted to ablate bottom holes of vertical interconnected holes in the array units of the polyimide dielectric layer, the bottom holes are filled with conductive silver paste to serve as the vertical interconnected holes, and sintering is performed to solidify the conductive silver paste; and a conductive silver paste array unit pattern is spread on the conformal dielectric layer and is solidified onto the surface of the dielectric layer after surface drying, so that the curved conformal microstrip antenna array surface is formed.
Owner:10TH RES INST OF CETC
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