The invention relates to an IC power supply chip, in particular to a power supply management chip which is high in cost performance and integration, enables a periphery circuit to be simple and has an optimum performance index. Additionally, the invention aims to provide a covering packaging material and process. According to the technical scheme and product novel innovation design application, a wafer extremely high in thermal conductivity is subject to optimization, the wafer material type is changed by means of extension, oxidation, doping (diffusion), photoetching and deposition and the like to finish the high-integration IC power supply chip which is subject to power supply integrated circuit coverage packaging. The IC power supply chip is high in cost performance and integration, enables the periphery circuit to be simple, is high in power supply quality factor, small in size, light in weight, high in control precision, good in rapidity and simple and compact in structure, enables power supply output to be matched with a reactive capacitor and provides the optimum performance index. The IC power supply chip is subject to special covering packaging, safety in chip use is guaranteed, and the IC power supply chip is simple in production process, low in cost, wide in application prospect, high in popularization and application value and good in market prospect.