2results about How to "Improve laser efficiency" patented technology

The application discloses an electromagnetic wave oscillator capable of realizing dynamic coning adjustment, which comprises upper and lower iron core arrays symmetrically arranged relative to the center of an electron beam vacuum chamber; an excitation coil system comprises a plurality of excitation coils of the same specification wound on the main period iron core and the end iron core respectively, and generates a magnetic field perpendicular to the direction of electron beam movement; an independent power supply control system comprises a plurality of power supply modules corresponding to the main period and at least two independent end power supply modules; the independent power supply control system is connected with the excitation coil system, each period of excitation coil group is independently powered by two independent power supply modules, the current flow directions of a group of excitation coils opposite to each other are the same, and the current flow directions of adjacent excitation coils are opposite. The application can reduce the serious electron orbit distortion caused by the sharp change of the longitudinal magnetic field gradient in the strong coning mode, thereby providing an ideal technical scheme for the demand of improving the free electron laser efficiency, the inverse free electron laser accelerator and the like.

A platemaking apparatus (100) using laser engraving, a control system, a platemaking method, and a storage medium, which belong to the field of laser beam machining. The platemaking apparatus (100) using laser engraving comprises: a base (10); an XY motion platform (20), which is arranged on the base (10) so as to move transversely and is used for bearing a printing plate; a support platform (30), which is disposed on the base (10), a movement space being provided between the support platform (30) and the base (10) and allowing for transverse movement of the XY motion platform (20); a plurality of laser machining assemblies (40), the laser machining assemblies (40) being connected to the support platform (30), and at least a portion of the laser machining assemblies (40) being adapted to move relative to the support platform (30) and being used to perform laser engraving on the printing plate. The plurality of laser machining assemblies (40) are provided, such that laser engraving operations can be performed simultaneously so as to increase the platemaking speed. At the same time, the laser machining assemblies (40) are configured as movable structures, so that each laser machining assembly (40) can work independently, and different image or text content may be engraved on the printing plate in respective corresponding areas, thus allowing for completion of engraving of the entire printing plate.