Packaging (2) for an upgrade module (4, 104, 204a, 204b, 204c, 204d) includes a spacer (24) with an aperture (28) receiving a printed circuit board (PCB) (30) and a housing (26) enclosing the spacer (24) and PCB (30). In one embodiment, the housing is a labeled overlay (26) including an inner surface (36) engaging the spacer (24), an outer surface (38) with printed information (40) and a removable writeable portion (42). The overlay (26) includes openings (44, 46, 48) for access to, for example, the PCB (30), and first, second and third portions (50, 52, 56) which fold around and adhere to three sides of the spacer (24). The module (4, 104, 204a, 204b, 204c, 204d) is incorporated within or proximate to an analog sensor (14, 114) for conversion of the sensor (14, 114) into a digital communicating device. An optional fastening mechanism (70) secures the module (4, 104, 204a, 204b, 204c, 204d) in position. A method of assembling and employing the upgrade module (4, 104, 204a, 204b, 204c, 204d) in position. A method of assembling and employing the upgrade module (4, 104, 204a, 204b, 204c, 204d) and packaging therefor is also disclosed.