35results about How to "Reduced conduction capacity" patented technology

The blood pressure and blood lipid- lowering capsule is prepared with three kinds of Chinese medicinal materials, including cassia seed, haw and lotus leaf, in certain weight proportion. The medicine has the functions of clearing away heat, promoting blood circulation, falling turbid and relaxing the bowels, and possesses determined curative effect on hyperlipemia. It has high safety, short disintegrating period, small dosage, raised patient's compliance and high clinical curative effect.

The invention discloses a diamond reinforced metal-base composite material for electronic packaging and a preparation method thereof. The material comprises the following components by volume percent: 30%-90% of diamond, 0.1%-5% of addition element and 10%-70% of metal substrate, wherein the addition element comprises one or more of Zr, Cr, Ti and B and the metal substrate comprises one metal of Ag, Cu and the like. The preparation method of the material comprises the following steps: mixing powder, pressing, infiltrating and pressing again. Owning to the adopted alloy element addition method, the wettability among phases is greatly improved. Therefore the material prepared by the method of the invention has better thermal conductivity, thermal expansion coefficient and mechanical properties compared with the former electronic packaging material and the adopted liquid phase infiltration method has the advantages of simple operation, low cost and capability of mass production.

The invention relates to a fuel cell system, comprising a plurality of individual fuel cells (2) which are combined to form a fuel cell stack, and two current collectors (3) which adjoin the two individual fuel cells at the ends, an end plate (4) adjoining the current collectors in each case directly or with the interposition of an insulation plate (6), wherein a heat accumulator (5) is provided in an adjacent manner on at least one of the current collectors (3) on the side facing away from the individual fuel cells (2). Said heat accumulator can be arranged in a recess of the end plate (4) or of the optionally present insulation plate (6), and a compensation reservoir for a change in volume of the heat accumulator (5) may be provided.

The invention discloses a technology for embedding metal into blue and white porcelain. The technology comprises the following steps: (1) sketching blue and white patterns and metal patterns on a manufactured porcelain body, digging ink mark slots along the ink marks of the metal patterns, then putting the porcelain body into a kiln and firing for the first time; (2) coloring the blue and white patterns, then putting the porcelain body into the kiln and firing for the second time; (3) enabling the bottom surfaces and the walls of the ink mark slots to be evenly coated with white vaseline, enabling the metal to be melted, pouring the melted metal into the ink mark slots, enabling the melted metal to be solidified, grinding and leveling; and (4) spraying clear glaze onto the porcelain body, then putting the porcelain body into the kiln and firing for the third time. According to the technology, the porcelain body is fired for three times, so that the blue and white patterns can fully present colors, and better metallic luster is realized; the metal and the porcelain are combined into a whole, so that the product not only has the freshness and beauty of the blue and white porcelain, but also is endowed with the grave and deep feeling of the metal; and therefore, the artistic value and the commercial value of the product are greatly improved.

The invention relates to a chemical vapor deposition apparatus for a flat display comprising a reaction chamber for performing a deposition processing to a substrate, an air inlet tube for injecting processing air into the reaction chamber and an air supplying tube connected to the air inlet tube and for guiding the processing air flowing to the air supplying tube. In the chemical vapor deposition apparatus, a parasitic electric slurry generation prevention part is located in the air inlet tube and prevents the parasitic electric slurry from generating in the air supplying tube through increasing the pressure of the air supplying tube during the deposition processing.

The invention relates to a lead-free copper alloy wire material which is prepared from the following components in parts by weight: 0.2-0.8 part of tellurium, 0.01-0.06 part of microelements and 99.14-99.79 parts of copper. The microelements are composed of the following components in parts by weight: 0.004-0.015 part of phosphorus, 0.001-0.015 part of boron and 0.005-0.03 part of magnesium. The preparation method of the lead-free copper alloy wire is technically characterized by comprising the following steps: horizontal continuous casting of a wire blank, hot-shrinkage deformation by continuous extrusion, cold-shrinkage deformation by multi-disk pulling. The wire blank can directly enter the continuous extrusion machine to a thermally-deformed wire blank with corresponding size of the finished product without heating, and a multi-disk pulling machine is utilized to obtain the wire blank with the size of the finished product by primary processing without annealing in the middle. The invention overcomes the difficulties of high cracking tendency in cold working and high-temperature brittleness in hot working in the tellurium-containing copper master alloy cast wire blank.

The invention discloses a bamboo domestic architecture; it includes foundation, walls, floor and roof one by one from the bottom to the top. Said foundation is bamboo concrete or armored concrete structure, the wall and the floor components use bamboo component or bamboo and wood assembly, the perimeter of floor is supported by the wall, the bamboo component of said walls comprises of beam, bottom beam, wall pillar installed between the beam and the bottom beam as well as the wall surface which covers the outside of wall pillar. The bamboo component of said floor comprises of many floor joists and floor surface using bamboo as base material, the floor joist is placed on the beam and the floor surface is placed on the floor joist. The invention is a simple, low cost, small construction difficulties, short construction period, better environmental protection and bamboo domestic architecture.

The invention discloses an engineering mold heat insulation board with good pressure resistance and heat resistance performance, which comprises a heat insulation board body. board, the fourth middle board and the heat insulation lower board, the bottom of the heat insulation upper board is connected to the top of the first middle board by building sealant, and one side of the bottom of the first middle board is connected to the second board by the building sealant. One side of the top of the middle plate is bonded and connected, and one side of the bottom of the second middle plate is bonded and connected to one side of the top of the third middle plate through building sealant. In the present invention, an asbestos board and a rock wool board are added to the heat insulation lower board. , Strengthen the connecting ribs and return-shaped grooves, and add ultra-fine glass wool, high-silica wool boards and vacuum insulation boards on the heat-insulating upper board, which greatly reduces the heat conduction performance and can effectively improve the heat-insulating lower board and insulation board. The heat resistance performance of the hot plate reduces the phenomenon of scalding during use.

The invention discloses a thermal interface material and a preparation method thereof, wherein the thermal interface material is used to transfer heat generated by a heat source to a radiator, and the thermal interface material includes a base material layer, a first contact layer, a second contact layer and doped material. The base material layer is made of a material with a positive thermal expansion coefficient or a material with a negative thermal expansion coefficient. The first contact layer covers one side of the base material layer and is in contact with the heat source; the second contact layer covers the other side of the base material layer and is in contact with the heat sink; The thermal expansion coefficient of the dopant material is opposite to that of the base material layer, and the concentration of the dopant material increases from the center plane of the base material layer to the first contact layer and the second contact layer respectively in preset gradients. In the present invention, the concentration of the dopant material is gradually increased in a predetermined gradient to ensure that the difference in thermal deformation between the organic matter and the heat-conducting particles in the thermal interface material is small, avoiding the peeling of the organic matter and the heat-conducting particles to form holes that lead to a decrease in thermal conductivity, and ensuring the stable performance of the thermal interface material.