The present invention discloses a
broadband and efficient
coupling device for terahertz spoof surface plasmons, a preparation method thereof and an application thereof, belonging to the technical field of terahertz on-
chip passive devices. It is successively connected from left to right by a standard rectangular
waveguide I, a converter II, a spoof
surface plasmon waveguide III, a converter II and a standard rectangular
waveguide I. The present invention realizes
wave vector matching, polarization matching and
impedance matching before and after mode conversion with a parameterized three-dimensional
metal surface. Through structural
parameter design and optimization,
broadband and efficient conversion from the TE mode of the standard rectangular waveguide to the spoof
surface plasmon mode is achieved. The present invention uses the geometric characteristics of the structure to disassemble the overall device for
processing compatibility, separately prints the disassembled device structures through a high-precision 3D printing process, combines with a magnetron
sputtering method to metallize the device surface, and finally completes the overall
assembly of the device using the reserved holes. This device has the advantages of high confinement, low loss, and tunability, etc.