The invention relates to an MEMS (Micro-Electro-
Mechanical System)
cutting and cleaning as well as releasing method of a
wafer. The method comprises the following steps of pasting a UV (
Ultraviolet) film, wherein the frontal surface of the
wafer is put at the midpoint of a vacuum suction cup, of which the middle is suspended, of a film pasting
machine;
cutting, wherein a step
cutting is adopted, the two-step cutting is continuously completed, the cutting thickness of a front cutting blade is 20 to 60 percent of the
total thickness of the
wafer, and a
back cutting blade is used for thoroughly
scratching the wafer; cleaning and spin-
drying, wherein the wafer which is fixedly arranged on a stainless
steel frame is integrally placed on a rotatable
ceramic dense-hole suction cup, the
ceramic dense-hole suction cup is used for fixing the periphery of the stainless
steel frame, a liquid spraying
system is arranged above the
ceramic dense-hole suction cup, the liquid spraying
system comprises a plurality of spray heads capable of leftwards and rightwards swinging to spray a solution, the spray heads spray liquid to clean the wafer, and the ceramic dense-hole suction cup is rotated at a high speed, so as to throw out waste liquid; irradiating; carrying out film expansion on the wafer; taking down a
chip from the UV film by utilizing a
chip pick-up device, and putting the
chip into a tray; placing the tray in a degumming
machine device, and carrying out structure release. The alignment for two times is not needed; the accuracy of cutting positions for the two times is guaranteed.