32results about How to "Reduce the effects of thermal stress" patented technology

The invention discloses a method based on a femtosecond laser technology for peeling a GaN thin film and a sapphire substrate, and the method belongs to the field of LED and power device chips. The method comprises the steps of: (1) growing the GaN thin film on the sapphire substrate by adopting chemical vapor deposition; (2) bonding a target substrate on the GaN thin film to obtain a sapphire / GaN / target substrate; (3) carrying out scanning radiation on the upper surface of the sapphire substrate by adopting femtosecond laser from the edge of the sapphire / GaN / target substrate; (4) and heating the sapphire / GaN / target substrate to not lower than 30 DEG C and removing the sapphire substrate to obtain a bilayer structure of the GaN / target substrate. The method provided by the invention has the advantages that: the method is a cold processing method, the temperature in the GaN thin film before and after femtosecond laser radiation is even and has no obvious change, the thermal stress influence on the GaN thin film is effectively reduced, and the laser peeling quality is improved; and the method increases the efficiency and yield of peeling the sapphire substrate, and overcomes the defect that the GaN thin film is liable to damage.

The invention discloses a two-stage thermotube type EGR cooler. The two-stage thermotube type EGR cooler mainly consists of a shell with an exhaust gas inlet and an exhaust gas outlet respectively arranged on two ends of the cooler and a two-stage thermotube with heating sections arranged inside the shell. The thermotube is communicated with four pipe sections of a heating section, a steam tube, a condensation section and a condensation tube in turn from beginning to end; the heating sections of the two-stage thermotube are arranged along the exhaust gas flow direction in order; and the condensation sections of the two-stage thermotube are overlapped and arranged along the radiation wind blowing direction. In the two-stage thermotube, a first stage thermotube and a second stage thermotube respectively adopt water and methanol as cooling mediums. The two-stage thermotube type EGR cooler adopts the principle of cooling exhaust gas by the thermotube technology and has good cooling effect. In addition, the reasonable combination of the two-stage thermotube and the cross matching of two radiating mediums further improve the temperature reduction effect of the cooler.

The invention discloses an inter-stage casing force bearing framework. The inter-stage casing force bearing framework comprises a support plate, an outer casing, a plurality of caps, a guider blade and a bearing block, wherein the support plate and an inner casing are integrally molded; one end of the support plate is arranged on the inner casing, and the other end of the support plate is providedwith a plurality of fixture blocks; the outer casing is provided with the caps; the caps are evenly distributed in the circumferential direction; a fixture slot is formed in each cap; each fixture block of the support plate and the corresponding fixture slot are inserted and connected; and each fixture block and the corresponding fixture slot are in clearance fit. According to the inter-stage casing force bearing framework disclosed by the invention, the problems of thermal deformation and incoordination caused by the fact that the inner casing and the outer casing and the support plate are connected by bolts are solved through the inserted-connected structure of the support plate and the casings; the support plate and the fixture slots are of an inserted-connected structure, and each cylindrical fixture block at the outer end of the support plate can freely expand in the radial direction in the corresponding fixture slot so as to compensate thermal deformation and incoordination of the support plate and the casings, thereby reducing the influence of thermal stress.

A metal-based integrated resonant accelerometer mounted on the same plane comprises a metal base and two double-end clamped quartz tuning forks, the metal base comprises a mass block, a first flexiblehinge, a second flexible hinge and a fixed metal base, and the mass block is connected with the fixed metal base through the first flexible hinge and the second flexible hinge; the two double-end clamped quartz tuning forks have the same structure, are attached to the mass block and the fixed metal base, and are arranged in the same plane in a differential mode; the metal base is formed by processing low-stress or stress-free processes such as laser cutting, low-speed wire cutting and the like, and is provided with positioning grooves for positioning the double-end clamped quartz tuning forks, and the central axes of the positioning grooves in the DA direction perpendicular to the sensitive direction SA coincide with each other; the metal-based integrated resonant accelerometer has the advantages that the differential effect is good, the micro-assembly process is easy to implement, sensitivity is high, machining is easy, the machining precision of the precise elastic part is high, andmachining residual stress is small.

The present invention further provides a chip package process, which includes providing a substrate, disposing a chip on the substrate and forming a buffering compound on the substrate and the chip, wherein the buffering compound covers the chip. The present invention further provides another chip package process, which includes providing a substrate, forming a buffering compound on the substrate and disposing a chip in the buffering compound.

The invention discloses a two-stage thermotube type EGR cooler. The two-stage thermotube type EGR cooler mainly consists of a shell with an exhaust gas inlet and an exhaust gas outlet respectively arranged on two ends of the cooler and a two-stage thermotube with heating sections arranged inside the shell. The thermotube is communicated with four pipe sections of a heating section, a steam tube, a condensation section and a condensation tube in turn from beginning to end; the heating sections of the two-stage thermotube are arranged along the exhaust gas flow direction in order; and the condensation sections of the two-stage thermotube are overlapped and arranged along the radiation wind blowing direction. In the two-stage thermotube, a first stage thermotube and a second stage thermotuberespectively adopt water and methanol as cooling mediums. The two-stage thermotube type EGR cooler adopts the principle of cooling exhaust gas by the thermotube technology and has good cooling effect. In addition, the reasonable combination of the two-stage thermotube and the cross matching of two radiating mediums further improve the temperature reduction effect of the cooler.

The invention provides a steam oxygenating step-down pressure blowing system and method for a boiler. The steam oxygenating step-down pressure blowing system comprises a super-heater unit and a reheater unit, wherein an oxygenating pipeline I is connected to an inlet header pipeline of a roof superheater of the super-heater unit; an oxygenating pipeline II is connected to an outlet header connecting pipe of a vertical low temperature superheater; an oxygenating pipeline III is connected with an outlet header connecting pipe of a platen superheater; the oxygenating pipeline I, the oxygenating pipeline II and the oxygenating pipeline III are connected with first oxygen storage devices through a first oxygenating mother pipe; an inlet header nitrogen filling interface of a low temperature reheater of the reheater unit is connected with an oxygenating pipeline IV; an inlet header of a high temperature reheater is connected with an oxygenating pipeline V; and the oxygenating pipeline IV andthe oxygenating pipeline V are connected with second oxygen storage devices through a second oxygenating mother pipe. According to the steam oxygenating step-down pressure blowing system and the method, by reasonably selecting connecting points of a temporary oxygenating system pipeline and boiler heated surfaces, dense protective films are formed on all the heated surfaces of the boiler and metal surface of the inner wall of a steam pipeline; blowing times are few, and the consumed time is short; and a chemical cleaning procedure of the boiler is omitted, so that the cost is reduced.

The invention relates to a cooling structure of a cylinder cover of a diaphragm compressor. According to most traditional water channel perforating manners, perforation is performed in the direction facing the insides of cylinder covers from the side walls of the cylinder covers, the heat exchange areas, passing central high-temperature zones, of water channels are very small, a lot of heat of thecentral high-temperature zones cannot be brought away timely, and the cooling effect is not obvious. The cooling structure of the cylinder cover of the diaphragm compressor comprises the cylinder cover; a cooling water groove is formed in the end surface of the cylinder cover and is formed inside the cylinder cover; an exhaust component is arranged on the cylinder cover; the cooling water groovesurrounds the exhaust component, communicates with a water inlet group and communicates with a water outlet group; the water inlet group is formed in the side surface of the cylinder cover; the wateroutlet group is formed in the side surface of the cylinder cover; a spiral ring is arranged in the water groove, so that cooling water flows sufficiently in the water groove, and a stagnant water zoneis prevented. The heat exchange area of the cooling water and the central high-temperature zone is increased, the heat of the central high-temperature zone is guided out, and the temperatures of thecylinder cover and exhaust are reduced.

The invention discloses a growing direction for GaN thin film based on Al2O3 underlay, which aims to solve the problem of generating excessive heat stress during the growing of AIN layer inserted under low temperature in prior art. The growing process of the Gan thin film is that: put the underlay of Al2O3 in the MOCVD reaction chamber where the chemical vapor deposition of metallorganics occurs; inflate the hydrogen or mixed gas of hydrogen and alkaline air to the reaction chamber and make heat treatment to the underlay chip; grow the GaN orAIN nucleating layer on the heat-processed underlay; grown the GaN top layer on the AIN interposed layer. The technological conditions of AIN interposed layer growing under high temperature is: 20 to 760 Torr in growing pressure, 900 to 1,100 degrees centrigrade in temperature, 120 mu mol / min in flow rate of aluminium resources and 1000 to 5000 sccm in flow rate of alkaline air. The GaN epitaxial layer grown by the method provided in the invention is applicable to making micro wave high power transistor based on GaN, LED and optical maser.

The invention discloses a core body of a plate-fin heat exchanger with strong thermal adaptability in a flexible structure, including a cover plate, a seal, an expandable partition, and an expandable fin. Several layers of expandable partitions and several layers of expandable fins are alternately stacked and arranged, and are connected by brazing with cover plates. The hot channel is two layers of expandable partitions sandwiching a layer of expandable The cold aisle is a layer of expandable fins sandwiched between two layers of expandable partitions arranged opposite to the hot aisle and sealed by seals. The core of the plate-fin heat exchanger is internally cooled. The sealing strips at both ends of the hot aisle are grooved on the aisle side. A flexible structure with strong thermal adaptability plate-fin heat exchanger core body, which can be used in special working conditions such as large heat transfer temperature difference, alternating fluid temperature, discontinuous heat transfer, etc., with a wide range of applicable temperature, double arch Shaped cover plate and double Ω-shaped seal structure can greatly improve the thermal adaptability of the equipment, reduce the risk of damage such as fatigue damage, and prolong the service life of the equipment.

The invention relates to a 00Cr22Ni5Mo3N lock ring processing method capable of eliminating deformation and reducing material consumption, belonging to the lock ring production process. Solution treatment, artificial aging treatment and machining, using the method of double-foot continuous forging for forging, using the three-fire rolling ring formed by the ring rolling machine, after the solution treatment and artificial aging treatment of the supersaturated solid solution inside the stainless steel, the final lock is obtained. Finished circle. Strictly control the heating temperature, heating rate and holding time of the billet in the forming process of the lock ring section steel, and control the temperature of the solution treatment and artificial aging treatment to reduce the deformation of the product; the lock ring is forged by the method of double-length continuous rolling. Cancel the welding process to reduce the deformation caused by welding and the waste of cutting materials; use the forming process of the ring rolling machine to make special spindle molds and mandrel molds, and roll out the beveled edges inside and outside the lock ring to reduce material waste.

The invention discloses a process for preparing boot last without gas hole, comprising: A. injecting to form boot last blank and de-molding, B. cooling, C. nicking boot last. The process is characterized in that: the cooling step comprises following steps: fast cooling surface of boot last blank to solidify and form solidified thin layer, then cooling gradually in environment with temperature dropping from high to low. The boot last is characterized by high intensity and accuracy, and greatly increased rate of finished products. The invention also provides a private heat treating forming machine used in said process, comprising shell, shell is equipped with multiplayer conveyer belts up-and-down, one end of each conveyer belt expect bottom one and sealed shell is equipped with vacant sitefor boot last dropping, vacant site distributes interlaced side-to-side from top conveyor belt, the bottom of shell is provided with a plurality of hot gas feeding port with outlet located inwardly, hot gas feeding port is connected to hot gas source, shell is equipped with blank feeding port in relative to top conveyor belt and blank discharging port in relative to bottom conveyor belt.

The invention relates to the technical field of anti-explosion compensators, and particularly discloses a safety type anti-explosion compensator which comprises a pipe body and a pipeline, the pipeline is arranged in a port of the pipe body, flange plates are arranged on the surfaces of the pipeline and the pipe body, a cavity is formed in the inner wall of the pipe body, a pressure-resistant assembly is arranged on the inner wall of the cavity, and the pressure-resistant assembly is arranged on the inner wall of the cavity. An expansion pipe is arranged in the pipe body, a rubber cushion is arranged between the expansion pipe and the compression-resistant assembly, and the compression-resistant assembly comprises a compression-resistant plate, a movable rod and a spring; the cavity is formed in the inner wall of the pipe body and used for installing the compression-resistant assembly, so that a movable rod and a spring in the compression-resistant assembly are used for providing supporting force for the compression-resistant plate, when the compression-resistant plate is subjected to thermal stress transmitted to a rubber cushion from the expansion pipe, the compression-resistant plate can transmit the force to the movable rod, meanwhile, the spring is compressed, and the compression-resistant plate is prevented from being damaged. The elastic force of the spring is used for eliminating thermal stress, and the effect of enhancing the resistance of the pipe body to thermal stress is achieved.

The invention relates to a gradient diamond / copper composite material and a preparation method thereof, belonging to the field of thermal management materials. It is characterized in that: the diamond / copper mixed powder with different diamond volume fractions is filled into the high-strength graphite mold according to the design through the gradient filling method to realize the transverse or longitudinal gradient distribution of the diamond volume fraction; and the tungsten plating on the diamond surface strengthens the The combination of diamond and copper improves the thermal conductivity of the composite material; the composite material is formed by resistance hot pressing sintering, which has a fast sintering speed and high density of the material. The invention provides a preparation method of a gradient diamond / copper composite material, which can prepare a composite material with good interface quality and high density, and realize the gradient distribution of diamond volume fraction for specific needs, taking into account thermal performance and sealing and welding performance.

The invention relates to a surface transverse wave pressure and temperature sensor, which comprises a glass membrane sheet, a glass circular ring, a quartz crystal cantilever beam, a resonance type surface acoustic transverse wave force sensing element, a quartz crystal wafer and a resonance type surface acoustic transverse wave temperature sensing element; the glass circular ring is disposed on ametal base arranged concentric with the pressure inlet of the metal base; the glass membrane sheet is disposed on the glass circular ring; the upper surface of the glass membrane sheet has three protuberant structures; quartz crystal cantilever beams are disposed on a edge protuberant structure and the middle protuberant structure while the distance between the middle protuberant structure and the quartz crystal cantilever beam is zero; the resonance type surface acoustic transverse wave force sensing element is photoengraved on the upper surface of the quartz crystal cantilever beam; the quartz crystal wafer is disposed on the other edge protuberant structure; and the resonance type surface acoustic transverse wave temperature sensing element is photoengraved on the upper surface crystalwafer. The invention reduces sensor volume, reduces the influence of adhesion force and thermal stress to the pressure sensor, increases the mechanical oscillation property and the fatigue property of the sensor, and improves the stability and the uniformity.

This invention relates to a method for manufacturing double mosaic structure, which first of all forms a block layer, a first dielectric layer, a second dielectric layer, a multi-layer mask layer, a first bottom anti-reflection layer and a pattern first photo resist layer orderly on a substrate, then takes the pattern first photo resist layer as the mask to etch to get a first channel structure, then forms a second bottom anti-reflection layer to fill the first channel structure and cover the surface of the multi-layer mask layer, after that, forms a second photo resist layer on the second bottom anti-reflection layer to be taken as the mask to etch it to get a first medium window structure, then etches the first channel structure and the first medium window structure to get a second channel structure and a second medium structure.

A micro accelerometer based on electrostatic adsorption effect. It includes: a lower base, an upper base, a movable plate, a support beam and its anchor point, a support column, a fixed drive electrode, a movable drive electrode, a fixed switch electrode, and a movable switch electrode are arranged between the lower and upper bases. The fixed drive electrodes and fixed switch electrodes are located on the inner surfaces of the lower and upper bases, and the movable drive electrodes and movable switch electrodes are located on the lower and upper surfaces of the movable plate. The invention realizes the measurement of the acceleration by measuring the closing time of the switch electrode. The present invention uses a combination structure composed of a rigid circular plate and its supporting beams as a movable structure. The contact resistance between the movable and fixed switch electrodes is relatively low, and the movable and fixed drive electrodes have relatively large electrostatic adsorption force, thereby preventing the movable switch electrodes from contacting each other. Bouncing after fixing the switching electrodes and enabling the measurement of high accelerations. The supporting beam in the invention is a non-straight beam, which can effectively eliminate the influence of thermal stress on acceleration measurement.

The invention provides a fabrication method of a semiconductor device. The method comprises the steps of providing a package substrate, wherein the package substrate is provided with a first surface and a second surface which are opposite to each other, a plurality of chip pre-package regions and strip-shaped regions are arranged on the first surface, and the strip-shaped regions are arranged among the plurality of chip pre-package regions; and at least etching to remove a part of the strip-shaped regions. According to the fabrication method of the semiconductor device, provided by the invention, the thermal stress influence among the chip pre-package regions caused by thermal expansion coefficient mismatching of a package material is reduced by partially etching the package substrate, wraping is prevented, so that the performance stability of the semiconductor device is ensured, and the production efficiency is improved.

A metal-based integrated resonant accelerometer mounted on the same plane, including a metal base and two double-end fixed-supported quartz tuning forks, the metal base includes a mass block, a first flexible hinge, a second flexible hinge, and a fixed metal base , the mass block is connected to the fixed metal base through the first flexible hinge and the second flexible hinge; the two double-ended fixed-supported quartz tuning forks have the same structure and are mounted on the mass block and the fixed metal base. Differential layout; the metal base is processed by low-stress or stress-free processes such as laser cutting and wire cutting, and has a positioning slot for positioning double-ended fixed-supported quartz tuning forks. The positioning slot is perpendicular to the DA direction of the sensitive direction SA. It has the advantages of good differential effect, easy implementation of micro-assembly process, high sensitivity, simple processing, high processing precision of precision elastic parts, and small processing residual stress.

The invention discloses a power module by directly bonding a power terminal, comprising a chip, an insulating substrate, a radiating rib, the power terminal and a shell, wherein the power terminal is directly fixed on the shell. The fixing mode of the power terminal can optimize the design shape of the terminal, reduce stray inductance, and improve the reliability and service life by applying thepower terminal module.

The invention discloses a shell of a bulletproof vehicle and a production method thereof. The method comprises: cutting a bulletproof plate according to the size of the shell of a bulletproof vehicle; welding the cut bulletproof plate, wherein welding wire and the bulletproof The components of the boards are the same to form a preliminary bulletproof vehicle shell; the preliminary bulletproof vehicle shell is structurally reinforced to form a reinforced bulletproof vehicle shell; the entire reinforced bulletproof vehicle shell is heat treated to obtain a finished bulletproof vehicle shell. It solves the technical problems in the prior art that the bulletproof performance at the position of the welding seam joint is greatly reduced, the phenomenon of breakdown occurs in the target shooting test, and it is difficult to meet the overall protection requirements of the bulletproof vehicle. It has achieved the technical effect that the welded joints of the bulletproof vehicle can achieve the protection performance equivalent to that of the bulletproof plate after heat treatment, which greatly improves the overall safety of the bulletproof vehicle and meets the requirements of the overall bulletproof performance.

A circuit board capable of furthest exerting capacity of a semiconductor integrated circuit, easy to implement high function, easy to be produced and with excellent cost performance and reliability, comprising: a board core having a main core surface and a rear core surface; a ceramic capacitor having a main capacitor surface and a rear capacitor surface, having a structure in which a first innerelectrode layer and a second inner electrode layer are alternately stacked with a ceramic dielectric layer interposed therebetween, and having a plurality of capacitor function units being electrically independent from each other, the ceramic capacitor being buried in the board core in a state where the main core surface and the main capacitor surface are directed in a same direction; and a buildup layer having a structure in which an interlayer insulating layer and a conductor layer are alternately stacked on the main core surface and the main capacitor surface and having a semiconductor integrated circuit device mounting region for mounting a semiconductor integrated circuit device having a plurality of processor cores on a surface of the buildup layer, wherein the plurality of capacitorfunction units are capable of being electrically connected to the plurality of processor cores, respectively.