34results about How to "Withstand voltage" patented technology

A multilayer wiring layer 400, a first inductor 310 and a second inductor 320 are formed on a substrate 10. The multilayer wiring layer is formed by alternately stacking an insulating layer and a wiring layer in this order t or more times (t≧3). The first inductor 310 is provided in the nth wiring layer in the multilayer wiring layer 400. The second inductor 320 is provided in the mth wiring layer in the multilayer wiring layer 400 (t≧m≧n+2) and positioned above the first inductor 310. No inductor is provided in any of the wiring layers positioned between the nth wiring layer and the mth wiring layer to be positioned above the first inductor 310. The first inductor 310 and the second inductor 320 constitute a signal transmitting device 300 which transmits an electrical signal in either of two directions.

In a stepping motor comprising a pair of stator yokes and a bobbin that includes a cylindrical body and two flanges, each of the two flanges radially extending outward from the cylindrical body so that the bobbin forms a squared U-shape in the axial cross-section thereof, there is provided a bobbin cover case disposed between the stator yokes and a coil wound around the bobbin, and the bobbin cover case includes an outer cover and an inner cover that are coupled to each other so as to provide a dual-layer insulating wall covering an open mouth portion of the squared U-shape, wherein the bobbin cover case inhibits a creeping discharge between the stator yokes and the coil.

A semiconductor device includes a SOI (silicon on insulator) substrate having a first region and a second region, a multilayer wiring layer formed on the SOI substrate and having an insulating layer and a wiring layer alternately stacked in this order, a first inductor formed over the SOI substrate, and a second inductor formed over the SOI substrate and positioned above the first inductor.

A multilayer printed board comprising a plurality of capacitive coupling layers (6) each consisting of a dielectric layer (4) and a power supply layer (3) and a ground layer (5) facing each other while sandwiching the dielectric layer (4), first vias (7) connecting between the power supply layers (3) included in the plurality of capacitive coupling layers (6), and second vias (8) connecting between the ground layers (5) included in the plurality of capacitive coupling layers (6).

The invention relates to the technical field of heat conducting and heat dissipating devices and preparation methods and preparation devices thereof, and in particular relates to a holt-melting heat-conducting film, a heat-conducting liner including the hot-melting heat-conducting film and a preparation method and a preparation device thereof. The hot-melting heat-conducting film includes a heat conducting layer, wherein an adhesive layer is arranged on one surface of the heat conducting layer while a hot melt adhesive layer is arranged on the other surface of the heat conducting layer, a thin film layer is arranged on the adhesive layer, thus being simple in structure and good in heat conducting and heat dissipating effect; the heat conducting liner includes a hot-melting heat-conducting film and a support substrate, and contact point heat sources with a heat dissipating surface, thus improving heat dissipation efficiency; the preparation method comprises primarily forming, thermoforming, cooling for shaping and pulling and cutting to obtain finished products, so that the method is simple, production efficiency is improved, and production cost is reduced; the preparation device includes a control box, and a material rack, a primary forming mold, a thermoforming mold, a cooling shaping mold, an automatic puller, a counter and a cutting device sequentially arranged on an assembly line, one people can operated the whole assembly line, thus being saving in human and material resources.