The invention belongs to the technical field of ceramic materials, and discloses high-entropy ceramic as well as a preparation method and application thereof. The molecular formula of the high-entropy ceramic is (Me1aMe2bMe3cMe4dMe5eMe6fMe7gMe8h)B2, 0.1</=a</=0.9, 0.1</=b</=0.9, 0.1</=c</=0.9, 0.1</=d</=0.9, 0.1</=e</=0.9, 0.1</=f</= 0.9, 0</=g</=0.9, 0</=h</=0.9, and a+b+c+d+e+f+g+h=1; Me1-Me8 are any 6-8 of Hf, Mo, Zr, Nb, Ti, V, W, Cr and Ta; the high-entropy ceramic is prepared by the following steps of adding any 6-8 of metal oxides HfO2, MoO3, ZrO2, Nb2O5, TiO2, V2O5, WO3, Cr2O3 and Ta2O5, B4C and carbon powder into a solvent, carrying out ball milling and mixing to obtain mixed powder, carrying out compression molding to obtain a blank, heating the blank to 1400-1600 DEG C, heating the obtained high-entropy powder to 1000-1400 DEG C by adopting spark plasma sintering, filling a protective atmosphere, then heating to 1900-2100 DEG C, pressurizing to 10-100 MPa, and calcining to obtain the high-entropy ceramic. The relative density of the high-entropy ceramic is greater than 98%, the hardness is 35-40 GPa, and the thermal conductivity is 0.1-1 W/(mK).