4results about How to "Low cost control" patented technology

The utility model discloses a gimbal rotation arm gap elimination structure, by the gimbal rotation base body, gimbal rotation base, nylon flat pad, wave spring pad and tension screw are formed, the middle part of gimbal rotation base body is provided with through -hole, and both sides of through -hole are provided with round groove, gimbal rotation base is provided with left and right two fixed arms, tension screw passes through the fixed arm of gimbal rotation base right side and the fixed arm of gimbal rotation base body and is connected through the thread after, nylon flat pad is set in the round groove of gimbal rotation base body left side, is connected through the thread with tension screw, right side and gimbal rotation base body contact, left side and wave spring pad contact, and wave spring pad left side and gimbal rotation base contact, the round groove of gimbal rotation base body right side is provided with nylon support flat pad, and nylon support flat pad left side and gimbal rotation base body contact, right side and gimbal rotation base contact. Through this structure, the purpose that gap elimination air return is reached to reduce, this structure is simple to process, does not need higher precision requirement, and assembly difficulty greatly reduces, and the cost control of product, and assembly difficulty, greatly improve.

The invention discloses a method and device for measuring the surface topography of a wafer, and the method comprises the steps: obtaining T interference fringe images, T is greater than or equal to 3, and the T interference fringe images are collected at T collection moments in the same phase shift process; a compensation coefficient corresponding to each interference fringe image is obtained, and the value of the compensation coefficient is associated with the illumination intensity of the corresponding interference fringe image; the corresponding interference fringe images are compensated based on the compensation coefficients, so that the illumination intensity of each compensated interference fringe image is the same, and T compensated interference fringe images are obtained; and performing phase analysis and phase unwrapping on the T compensation interference fringe images to obtain the surface morphology of the wafer. By utilizing the method, the illumination intensity in the phase shift process is compensated through the compensation coefficient, the cosine phase error caused by unstable light power output of the light source is remarkably reduced, the phase analysis precision is improved, and the precision and repeatability of wafer surface topography interference measurement are further improved.

The electrophoresis device comprises an electrophoresis part, a part placing part, an electrolyte conveying part and an electrolyte aeration part, the electrophoresis part is an electrophoresis tank, an electrophoresis space is arranged in the electrophoresis tank, the part placing part is a part placing platform, and the electrolyte conveying part is arranged on the part placing platform. A grid baffle and a peripheral baffle are arranged on the part containing platform, the grid baffle and the peripheral baffle on the part containing platform are reasonably limited, a lifting air cylinder is matched to accurately immerse parts into electrolyte, a foundation is laid for a good electrophoresis effect, and the position of an electrode bar can be flexibly adjusted; a uniform electric field can be provided according to the shapes and sizes of different parts, uniform deposition of charged particles is ensured, the thickness and quality of an electrophoresis coating are more controllable by setting electrophoresis parameters, and diversified production requirements are met.

The application relates to the field of rescue reconnaissance, and discloses a reconnaissance method and system of a dynamic release sub-machine and data fusion, which comprises the following steps: when a mother ship unmanned aerial vehicle carries a sub-machine and flies to a disaster area, macroscopic reconnaissance load is used to generate macroscopic situation information by scanning; three-dimensional modeling load is used to generate a three-dimensional model of a scene by scanning, and three-dimensional environment information is output; a target area to be approached and reconnoitered is determined according to the macroscopic situation information; the mother ship unmanned aerial vehicle calculates a sub-machine release time according to the three-dimensional environment information and the characteristics of the target area, generates a sub-machine reconnaissance track, carries the sub-machine and flies to a release position, and releases the sub-machine; the released sub-machine flies to the target area according to the sub-machine reconnaissance track, performs fine reconnaissance, and returns fine information obtained through the reconnaissance to the mother ship unmanned aerial vehicle in real time for fusion. The application has the advantages that the overall endurance time can be prolonged, and seamless connection from macroscopic situation perception to microscopic detail identification can be realized.