A manufacture method of high-frequency microwave board high-density interconnect board relates to that technical field of high-frequency microwave product proces. A manufacture method comprises that follow steps of: cutting, Drilling, plasma degumming, Copper plating, whole plate plating, outer dry film, acid etching, Medium Inspection, Solder Resistance, silk screen printing, Electrical testing,primary product testing, Tin precipitation, secondary product testing and package, As compare with that prior art, methods of drilling, plasma processing, solder resistance and formation processes andspecific technology parameter control are optimized, and accurately controlling the time from plasma degumming slag to copper precipitation and the time from acid etching to silk screen printing, sothat the parameters of finished product such as size, surface copper, pore copper, plate thickness and pore diameter are stable, quality defects such as no copper in the pore, inhomogeneous ink thickness and the like are avoided, and the production efficiency and quality of high-frequency microwave board high-density interconnection board are improved.