The invention discloses a method and rolling cutter for manufacturing an LED multi-
chip package substrate. The rolling cutter is fixed to a main shaft of a vertical milling
machine, moving states of three shafts of the milling
machine are respectively controlled, the pressing amount of the main shaft and the
rolling speed of the rolling cutter are controlled, and accordingly the LED multi-
chip integrated
package substrate provided with an inverted right-
square pyramid structure is obtained. The rolling cutter is manufactured in a precise
cutting mode, the surface of the outer circle of the rolling cutter is provided with five columns of right-
square pyramid structures, and the angle of each right-
square pyramid ranges from 60 degrees to 100 degrees. The heights of
conical teeth of the cutter range from 300 micrometers to 500 micrometers, the outer
diameter of the cutter ranges from 30 mm to 50 mm, and the inner
diameter of the cutter ranges from 10 mm to 15 mm. The method and rolling cutter can meet the manufacturing requirements of the LED multi-
chip integrated
package substrate provided with the inverted right-square
pyramid light obtaining structure, substrate
machining efficiency can be greatly improved, and compared with a traditional
machining method, cost is lower and speed is higher.