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32results about How to "Short thermal response time" patented technology

Heat-type wind-speed and wind-direction sensor with heat insulation structure and preparation method thereof

The invention discloses a heat-type wind-speed and wind-direction sensor with a heat insulation structure, comprising a silicon chip and a ceramic substrate, wherein the silicon chip is positioned above the ceramic substrate; four heating elements and four heat-sensing temperature-measuring elements are symmetrically distributed on the four edges of the upper surface of the silicon chip; a heat insulating groove is arranged between each heating element and each heat-sensing temperature-measuring element; heat insulating cavities are arranged below the heat-sensing temperature-measuring elements at the back of the silicon chip; and a ceramic gold-plating layer and a silicon gold-plating layer are arranged between the silicon chip and the ceramic substrate and are connected by adopting a gold-gold bonding process so as to be used for the heat connection between the silicon chip and the ceramic substrate. In the whole preparation process of the sensor, a standard CMOS (complementary metal-oxide-semiconductor) process is used, the after-treatment process is simple, and the prepared heat-insulating groove and the heat insulating cavities can be used for increasing the sensitivity of the chip effectively, reducing the heat conduction loss of the chip and the heat capacity of the sensor, and reducing the response time of the sensor.
Owner:SOUTHEAST UNIV

Nuclear grade platinum resistance thermometer and its method for reducing thermal response time

The invention relates to a nuclear-grade platinum resistance thermometer and the method for reducing thermal response time with the invention, comprising a terminal box, a wiring board arranged in the terminal box, and a protective sleeve with a built-in platinum resistance element, wherein, the temperature sensing surface of the platinum resistance element is clung tightly to the inner surface of the protective sleeve, and no MgO powder is filled between the platinum resistance element and the protective sleeve; the outer surface of the protective sleeve is clung tightly to the inner surface of an external protective tube; the platinum resistance element is welded with an armored leading wire; MgO powder is filled in the armored leading wire; a metal coat is plated on the outer surface of the protective sleeve. The invention has the advantages that due to the temperature sensing surface of the platinum resistance element clung tightly to the protective sleeve and the protective sleeve clung tightly to the external protective tube, the heat conductivity of the thermometer is improved; the thermal response time is reduced; the earthquake resistant requirement for nuclear power station is satisfied; due to wear-resistant, heat-resistant, and oxidation-resistant special metal coating on the surface of the protecting sleeve, the protecting sleeve does not stick to the protective tube due to oxidation corrosion.
Owner:NO 3 AUTOMATION INSTR & METERS FACTORY SHANGHAI AUTOMATION INSTR & METERS CO LTD

Thermal type wind sensor based on anisotropic heat-conducting substrate and preparation method therefor

The invention discloses a thermal type wind sensor based on an anisotropic heat-conducting substrate; a chip of the sensor comprises the anisotropic heat-conducting substrate; four heating elements are symmetrically distributed at the center of the upper surface of the anisotropic heat-conducting substrate; four thermal sensing temperature-measuring elements are symmetrically distributed at the periphery of the four heating elements; the back surface of the anisotropic heat-conducting substrate is contacted with external environment so as to detect wind speed and wind direction; a glass heat-insulation inner ring is inlaid among the heating elements in the anisotropic heat-conducting substrate and silicon substrates under the thermal sensing temperature-measuring elements; a glass heat-insulation outer ring is inlaid among the silicon substrates under the thermal sensing temperature-measuring elements and silicon substrates at the edge of the chip; the two glass heat-insulation rings can ensure that the thickness of the anisotropic heat-conducting substrate is thinned to be about 100 microns by a thinning technology on one hand, the total power consumption of the sensor can be reduced on the other hand so that the sensor keeps higher signal sensitivity and shorter thermal response time under the lower power consumption.
Owner:SOUTHEAST UNIV

High-sensitivity thermal-response platinum resistor temperature sensor

The invention discloses a high-sensitivity thermal-response platinum resistor temperature sensor. A thermal conductive metal cap is fixedly embedded at the top end of a metal protecting pipe of the high-sensitivity thermal-response platinum resistor temperature sensor, a platinum resistor inductive core is arranged inside a counter bored hole of the thermal conductive metal cap, a signal transmission cable is in electric connection with the platinum resistor inductive core, transmitting signals are guided out of the metal protecting pipe, thermal-insulating layers are arranged on the internal part of the metal protecting pipe of the thermal conducting inductive cap and outside the counter bored hole of the thermal conducting cap, and the thermal conducting connecting body of the counter bored hole of the thermal conducting cap is linked up with thermal conducting metal points which are embedded in the backside of the insulating substrate of the inductive core of the platinum resistor in a thermal-conducting mode. The high-sensitivity thermal-response platinum resistor temperature sensor improves induction sensitivity of the sensor, shortens thermal response time, and enables the platinum inductive core to be capable of sensing temperature change of environment sensitively and outputting transmission signals of detection.
Owner:丹东鸭绿江敏感元件有限公司

Infrared detector and preparation method thereof

The invention relates to an infrared detector and a preparation method thereof. The infrared detector comprises a substrate, a thermosensitive layer, a dielectric layer, an electrode layer and a passivation layer, wherein the thermosensitive layer, the dielectric layer, the electrode layer and the passivation layer are located on the substrate, the dielectric layer is located between the thermosensitive layer and the electrode layer, the thermosensitive layer is located on one side, close to the substrate, of the dielectric layer, and the passivation layer is located on one side, away from the substrate, of the electrode layer. The infrared detector comprises a plurality of infrared detector pixels arranged in a matrix, each infrared detector pixel comprises an absorption plate structure, at least two micro-bridge columns and at least two beam structures, and the absorption plate structures are connected to the corresponding micro-bridge columns through the corresponding beam structures; the thermosensitive layer covers the area where the absorption plate structure and the beam structure are located, and the passivation layer covers the area where the absorption plate structure and the beam structure are located; and the material for forming the thermosensitive layer comprises one or more of amorphous silicon, amorphous carbon, amorphous germanium or amorphous silicon germanium. According to the technical scheme, the thermal response time of the infrared detector is shortened, and the infrared response rate of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD

Infrared focal plane array and infrared thermal imaging system based on infrared focal plane array

The invention discloses an infrared focal plane array and an infrared thermal imaging system based on the infrared focal plane array, and belongs to the field of the infrared thermal imaging. The infrared focal plane array comprises a plurality of array units in periodical arrangement, each array unit comprises a substrate, an insulation support layer, a sub-wavelength grating structure and an infrared absorbing layer; the infrared thermal imaging system based on the infrared focal plane array comprises a wavelength conversion module, a read-out signal production module and an imaging displaymodule; a core element of the wavelength conversion module is the infrared focal plane array; the infrared radiation from a target is focused on the focal plane, the infrared image information of thetarget is converted into the temperature distribution information on the focal plane array; the read-out signal production module is used for producing linear polarization narrow-band near infrared ray and enabling the linear polarization narrow-band near infrared ray to enter the imaging display module after being reflected by the infrared focal plane array, thereby realizing target object visualization. The system disclosed by the invention realizes large-area array, high-pixel, low-cost and quick-response thermal imaging system design.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Novel movable type energy storage device using superconductive tubes and copper foam phase-change materials

The invention discloses a novel movable type energy storage device using superconductive tubes and copper foam phase-change materials. The novel movable type energy storage device using the superconductive tubes and the copper foam phase-change materials comprises a plurality of parallel single phase-change heat accumulators, wherein each single phase-change heat accumulator comprises a closed cylindrical shell; each shell comprises an outer sleeve, an inner metal sleeve and an interlayer; the interlayer of each shell is a cold water channel; a spiral guide ring is arranged in the interlayer of each shell; a superconductive tube is arranged in each shell; the upper end of each superconductive tube is sealed and inserted in the upper part of the inside of the corresponding shell; the lower end of each superconductive tube is open, is exposed outside the corresponding shell and is connected with a waste heat source; a phase-change material which is used for filling holes of copper foam is used for filling between the corresponding inner sleeve and the corresponding superconductive tube; the single phase-change heat accumulators are erected side by side; a water inlet of the upper end of each single phase-change heat accumulator is connected with a water inlet tube through a water collecting square tube; and a water outlet of the lower end of each single phase-change heat accumulator is connected with a water outlet tube through a three-way tube. The novel movable type energy storage device recycles the waste heat by the superconductive tubes, and is quick in heat transmission and high in heat conduction efficiency; and by the copper foam, the heat conduction coefficient of the phase-change materials is improved by the copper foam, and heat storage rate and heat release rate are increased.
Owner:上海绚光节能环保科技股份有限公司

A power module based on phase change material and its manufacturing method

The invention provides a power module based on phase change material and a manufacturing method thereof, which belong to the technical field of power modules. The power module comprises a substrate (1), a ceramic copper-clad plate (2), a phase-change module and a power terminal (7). The upper surface of the substrate (1) is rectangular, a plurality of ceramic copper-clad plates are respectively arranged on the substrate (1), and the ceramic copper-clad plates (2) are connected through a copper bar. The phase-change module is arranged on the ceramic copper-clad plate (2), and a plurality of power terminals (7) are arranged on a power terminal mounting end. The phase change module comprises a heat transfer enhancing frame (3) and a sealing cover (4), and the heat transfer enhancing frame (3)is filled with phase change material. A power semiconductor chip (5) is welded to the outer surface of the sealing cover. The invention is advantageous in that the power module with short-time and controllable junction temperature is provided, which can respond to transient temperature rise of the power module, and is suitable for occasions when short-circuit current is actively provided for supporting the power grid voltage during a power grid fault period, and other impact power occasions of electromagnetic ejection and super-capacitor charging.
Owner:CHONGQING UNIV

Optical readout full-hollow focal plane array provided with thermal sink structures and manufacturing method thereof

The invention discloses an optical readout full-hollow focal plane array provided with thermal sink structures and a manufacturing method thereof. Each pixel of the array comprises a framework and other parts such as a reflection board and the like in the framework, and the upper part of each pixel framework comprises a thermal sink structure formed by a thick metal film. The thermal sink structures enhance the thermal conductance of a whole film area and accelerate energy transmission, so that the temperature uniformity of the film area is improved greatly. A thermal crosstalk phenomenon caused by the fact that energy spreads along framework grids is eliminated, the response time is decreased, and the thermal imaging speed is accelerated. In addition, the thickness of a whole support framework is increased by 10 times, and the mechanical strength of the film area and the film smoothness are greatly improved. Besides, the frameworks tower above the plane where the parts of the pixels are in, so that reflection rays irradiated on the reflection boards can be separated from reflection rays irradiated on the frameworks, and imaging signals read by the reflection boards and reflection signals of the frameworks can be separated. The method is simple in process, short in production cycle and high in yield.
Owner:北京中科微投资管理有限责任公司

Optical readout fully hollow focal plane array with heat sink structure and manufacturing method thereof

The invention discloses an optical readout full-hollow focal plane array provided with thermal sink structures and a manufacturing method thereof. Each pixel of the array comprises a framework and other parts such as a reflection board and the like in the framework, and the upper part of each pixel framework comprises a thermal sink structure formed by a thick metal film. The thermal sink structures enhance the thermal conductance of a whole film area and accelerate energy transmission, so that the temperature uniformity of the film area is improved greatly. A thermal crosstalk phenomenon caused by the fact that energy spreads along framework grids is eliminated, the response time is decreased, and the thermal imaging speed is accelerated. In addition, the thickness of a whole support framework is increased by 10 times, and the mechanical strength of the film area and the film smoothness are greatly improved. Besides, the frameworks tower above the plane where the parts of the pixels are in, so that reflection rays irradiated on the reflection boards can be separated from reflection rays irradiated on the frameworks, and imaging signals read by the reflection boards and reflection signals of the frameworks can be separated. The method is simple in process, short in production cycle and high in yield.
Owner:北京中科微投资管理有限责任公司

A phase-change thermal storage particle with modified resin as shell material and its preparation process

The invention relates to phase change heat storage granules with a modified resin as a shell material and a preparation process of the phase change heat storage granules. The phase change heat storagegranules comprise a shell material and a core material, wherein the core material is arranged inside the shell material; the shell material consists of a light sensitive prepolymer, an active diluent, a light sensitive agent and a heat conduction material; the mass percentages of the components are as follows: 70-80% of the light sensitive prepolymer, 10-20% of the active diluent, 1-10% of the light sensitive agent, and 1-3% of the heat conduction material; the core material is saturated fatty acid of 10-14C. As the modified resin is adopted as the shell material of the phase change heat storage granules, the core material wrapped by the shell material is not leaked off in the heat absorption / release process, meanwhile, due to adoption of a granular phase change heat storage material, theheat exchange area is greatly increased, and due to adoption of the modified resin as the shell material, the overall heat conduction property is improved, so that the heat response time of a phase change material is shortened, and the heat storage capability of the phase change material is utilized to the maximum extent.
Owner:常州港华燃气有限公司

Hot air speed and air direction sensor based on thinning process and manufacturing method thereof

The invention provides a wafer level packaged hot air speed and air direction sensor realized by adopting a silicon substrate thinning process technology and a manufacturing method thereof. In a sensor chip, a heating element and a heat-sensitive temperature measuring element are manufactured by adopting a CMOS (Complementary Metal-Oxide-Semiconductor Transistor) process; a heat insulation groovewith the depth of 50 microns is formed between the heating element and the heat-sensitive temperature measuring element by adopting a dry etching process, so that transverse heat conduction effects between the heating element and the heat-sensitive temperature measuring element are reduced; a silicon substrate of a sensing chip is thinned by using a thinning process until the thickness of the silicon substrate is 80-100 microns, so that the heat conduction and the heat capacity of the substrate of the chip are lowered; and a ceramic substrate is attached to the back face of a thinned silicon chip to protect the silicon chip and sense the changes of the air speed and the air direction of the ambient temperature. By adopting the air speed and air direction sensor, wafer package is realized,the heat conduction loss of the silicon substrate and the heat capacity of the sensor chip are greatly lowered, and a large output signal and shorter response time can be obtained under low power consumption.
Owner:SOUTHEAST UNIV

Heat-type wind-speed and wind-direction sensor with heat insulation structure and preparation method thereof

The invention discloses a heat-type wind-speed and wind-direction sensor with a heat insulation structure, comprising a silicon chip and a ceramic substrate, wherein the silicon chip is positioned above the ceramic substrate; four heating elements and four heat-sensing temperature-measuring elements are symmetrically distributed on the four edges of the upper surface of the silicon chip; a heat insulating groove is arranged between each heating element and each heat-sensing temperature-measuring element; heat insulating cavities are arranged below the heat-sensing temperature-measuring elements at the back of the silicon chip; and a ceramic gold-plating layer and a silicon gold-plating layer are arranged between the silicon chip and the ceramic substrate and are connected by adopting a gold-gold bonding process so as to be used for the heat connection between the silicon chip and the ceramic substrate. In the whole preparation process of the sensor, a standard CMOS (complementary metal-oxide-semiconductor) process is used, the after-treatment process is simple, and the prepared heat-insulating groove and the heat insulating cavities can be used for increasing the sensitivity of the chip effectively, reducing the heat conduction loss of the chip and the heat capacity of the sensor, and reducing the response time of the sensor.
Owner:SOUTHEAST UNIV

Phase change heat storage granule with modified resin as shell material and preparation process of phase change heat storage granule

The invention relates to phase change heat storage granules with a modified resin as a shell material and a preparation process of the phase change heat storage granules. The phase change heat storagegranules comprise a shell material and a core material, wherein the core material is arranged inside the shell material; the shell material consists of a light sensitive prepolymer, an active diluent, a light sensitive agent and a heat conduction material; the mass percentages of the components are as follows: 70-80% of the light sensitive prepolymer, 10-20% of the active diluent, 1-10% of the light sensitive agent, and 1-3% of the heat conduction material; the core material is saturated fatty acid of 10-14C. As the modified resin is adopted as the shell material of the phase change heat storage granules, the core material wrapped by the shell material is not leaked off in the heat absorption / release process, meanwhile, due to adoption of a granular phase change heat storage material, theheat exchange area is greatly increased, and due to adoption of the modified resin as the shell material, the overall heat conduction property is improved, so that the heat response time of a phase change material is shortened, and the heat storage capability of the phase change material is utilized to the maximum extent.
Owner:常州港华燃气有限公司

A kind of infrared detector and preparation method thereof

The present disclosure relates to an infrared detector and a preparation method thereof. The infrared detector includes a substrate, a dielectric layer, an electrode layer and a thermosensitive layer on the substrate. The electrode layer is located between the dielectric layer and the thermosensitive layer, and the dielectric layer is located on the substrate. The electrode layer is adjacent to one side of the substrate, and the electrode layer is arranged in contact with the thermosensitive layer; the infrared detector includes a plurality of infrared detector pixels arranged in a matrix, and the infrared detector pixels include an absorption plate structure, at least two micro-bridge columns and At least two beam structures, the absorption plate structure is connected to the corresponding micro-bridge column through the corresponding beam structure; the heat-sensitive layer covers the area where the absorption plate structure and the beam structure are located; wherein, the materials constituting the heat-sensitive layer include amorphous silicon, amorphous One or more of carbon, amorphous germanium or amorphous silicon germanium; the material constituting the electrode layer at least includes titanium. Through the technical solution of the present disclosure, the thermal response time of the infrared detector is reduced, and the infrared response rate of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD

Device and method for measuring real-time heat flux density of wall surface of combustion chamber

The invention relates to a heat flux density measurement technology, in particular to a device and method for measuring the real-time heat flux density of a wall surface of a combustion chamber, and mainly solves the technical problems of long thermal response time, low measurement precision and incapability of real-time measurement in measurement of the wall surface of the combustion chamber in the prior art. The device comprises a combustion chamber wall, a measuring hole, a measuring assembly and a fixing and limiting assembly. Measuring holes are formed in the combustion chamber wall; thermocouples are arranged in the measuring holes; the thermocouples contacts with the bottom of the measuring holes; the thermocouples are sleeved with fixing sleeves, and limiting holes are formed in the thermocouple fixing plate. The thermocouple fixing plate is fixedly connected with the wall of the combustion chamber, the fixing sleeve is pressed and fixed between the outer wall face of the combustion chamber and the thermocouple fixing plate, and springs are compressed between check blocks and the thermocouple fixing plate. The fixing sleeves, the springs, the check blocks and the thermocouple fixing plate are combined to form a spring compensation type thermocouple fixing method. Meanwhile, the invention also provides a method for measuring the real-time heat flux density of the wall surface of the combustion chamber.
Owner:XIAN AEROSPACE PROPULSION INST

A kind of infrared detector and preparation method thereof

The present disclosure relates to an infrared detector and a preparation method thereof. The infrared detector includes a substrate, a thermosensitive layer on the substrate, a dielectric layer, an electrode layer and a passivation layer, and the dielectric layer is located between the thermosensitive layer and the electrode layer. , the heat-sensitive layer is located on the side of the dielectric layer close to the substrate, and the passivation layer is located on the side of the electrode layer away from the substrate; the infrared detector includes a plurality of infrared detector pixels arranged in a matrix, and the infrared detector pixel includes an absorbing plate Structure, at least two micro-bridge columns and at least two beam structures, the absorbing plate structure is connected to the corresponding micro-bridge column through the corresponding beam structure; the heat-sensitive layer covers the area where the absorbing plate structure and the beam structure are located; wherein, the heat-sensitive layer is formed The material includes one or more of amorphous silicon, amorphous carbon, amorphous germanium or amorphous silicon germanium; the passivation layer covers the area where the absorber plate structure is located; wherein, the material constituting the electrode layer includes at least titanium-tungsten alloy. Through the technical scheme disclosed in the present disclosure, the infrared responsivity of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD

A mobile energy storage device using superconducting heat pipes and copper foam phase change materials

The invention discloses a novel movable type energy storage device using superconductive tubes and copper foam phase-change materials. The novel movable type energy storage device using the superconductive tubes and the copper foam phase-change materials comprises a plurality of parallel single phase-change heat accumulators, wherein each single phase-change heat accumulator comprises a closed cylindrical shell; each shell comprises an outer sleeve, an inner metal sleeve and an interlayer; the interlayer of each shell is a cold water channel; a spiral guide ring is arranged in the interlayer of each shell; a superconductive tube is arranged in each shell; the upper end of each superconductive tube is sealed and inserted in the upper part of the inside of the corresponding shell; the lower end of each superconductive tube is open, is exposed outside the corresponding shell and is connected with a waste heat source; a phase-change material which is used for filling holes of copper foam is used for filling between the corresponding inner sleeve and the corresponding superconductive tube; the single phase-change heat accumulators are erected side by side; a water inlet of the upper end of each single phase-change heat accumulator is connected with a water inlet tube through a water collecting square tube; and a water outlet of the lower end of each single phase-change heat accumulator is connected with a water outlet tube through a three-way tube. The novel movable type energy storage device recycles the waste heat by the superconductive tubes, and is quick in heat transmission and high in heat conduction efficiency; and by the copper foam, the heat conduction coefficient of the phase-change materials is improved by the copper foam, and heat storage rate and heat release rate are increased.
Owner:上海绚光节能环保科技股份有限公司

A kind of infrared detector and preparation method thereof

The present disclosure relates to an infrared detector and a preparation method thereof. The infrared detector includes a substrate, an electrode layer and a thermosensitive layer located on the substrate. The electrode layer is located on the side of the thermosensitive layer adjacent to the substrate. Layer contact arrangement; the infrared detector includes a plurality of infrared detector pixels arranged in a matrix, the infrared detector pixels include an absorption plate structure, at least two micro-bridge columns and at least two beam structures, and the absorption plate structure passes through the corresponding beam structure connected to the corresponding micro-bridge column; the heat-sensitive layer covers the area where the absorption plate structure and the beam structure are located; wherein, the material constituting the heat-sensitive layer includes one of amorphous silicon, amorphous carbon, amorphous germanium or amorphous silicon germanium or several; the material constituting the electrode layer at least includes titanium-tungsten alloy. Through the technical solution of the present disclosure, the thermal response time of the infrared detector is reduced, and the infrared response rate of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD

A mobile energy storage device using copper foam phase change material

The invention discloses a novel movable energy accumulation device using foamy copper phase change materials. The novel movable energy accumulation device comprises multiple single body phase change energy accumulators which are connected in parallel. Each single body phase change accumulator comprises a sealed cylindrical shell. Each shell comprises an outer-layer sleeve, an inner-layer metal sleeve and an interlayer, wherein a sealing opening in the upper end of a superconduction heat pipe is inserted in the upper portion of the interior of the shell, and an opening in the lower end of the superconduction heat pipe is exposed out of the shell and is connected with a waste heat source; the part between the inner-layer sleeve and the superconduction heat pipe is filled with the foamy copper phase change materials; and a spiral pipeline is further arranged in the shell to pass between the phase change materials, and the shell interlayer and the spiral pipeline in the shell are cold water channels. The multiple single body phase change energy accumulators are erected side by side, water inlets in the upper ends of the multiple single body phase change energy accumulators are connected with a water inlet pipe, and water outlets in the lower ends of the multiple single body phase change energy accumulators are connected with a water outlet pipe. According to the novel movable energy accumulation device, the superconduction heat pipe is used for recycling waste heat, heat transmission is fast, and the heat transmission efficiency is high; the heat conduction coefficient of the phase change material is increased through foamy copper, and the heat accumulating and releasing rate is increased.
Owner:上海绚光节能环保科技股份有限公司

High-sensitivity thermal-response platinum resistor temperature sensor

The invention discloses a high-sensitivity thermal-response platinum resistor temperature sensor. A thermal conductive metal cap is fixedly embedded at the top end of a metal protecting pipe of the high-sensitivity thermal-response platinum resistor temperature sensor, a platinum resistor inductive core is arranged inside a counter bored hole of the thermal conductive metal cap, a signal transmission cable is in electric connection with the platinum resistor inductive core, transmitting signals are guided out of the metal protecting pipe, thermal-insulating layers are arranged on the internal part of the metal protecting pipe of the thermal conducting inductive cap and outside the counter bored hole of the thermal conducting cap, and the thermal conducting connecting body of the counter bored hole of the thermal conducting cap is linked up with thermal conducting metal points which are embedded in the backside of the insulating substrate of the inductive core of the platinum resistor in a thermal-conducting mode. The high-sensitivity thermal-response platinum resistor temperature sensor improves induction sensitivity of the sensor, shortens thermal response time, and enables the platinum inductive core to be capable of sensing temperature change of environment sensitively and outputting transmission signals of detection.
Owner:丹东鸭绿江敏感元件有限公司

Infrared detector and preparation method thereof

The invention relates to an infrared detector and a preparation method thereof. The infrared detector comprises a substrate, a dielectric layer, an electrode layer and a thermosensitive layer, wherein the dielectric layer, the electrode layer and the thermosensitive layer are located on the substrate, the electrode layer is located between the dielectric layer and the thermosensitive layer, the dielectric layer is located on the side, which is close to the substrate, of the electrode layer, and the electrode layer is in contact with the thermosensitive layer; the infrared detector comprises a plurality of infrared detector pixels arranged in a matrix, each infrared detector pixel comprises an absorption plate structure, at least two micro-bridge columns and at least two beam structures, and the absorption plate structures are connected to the corresponding micro-bridge columns through the corresponding beam structures; the thermosensitive layer covers the area where the absorption plate structure and the beam structure are located; the material for forming the thermosensitive layer comprises one or more of amorphous silicon, amorphous carbon, amorphous germanium or amorphous silicon germanium; and the material for forming the electrode layer at least includes titanium. According to the technical scheme, the thermal response time of the infrared detector is shortened, and the infrared response rate of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD

An infrared focal plane array and an infrared thermal imaging system based on the infrared focal plane array

The invention discloses an infrared focal plane array and an infrared thermal imaging system based on the infrared focal plane array, belonging to the field of infrared thermal imaging. The infrared focal plane array includes several periodically arranged array units, and each array unit includes a substrate, a thermal insulation support layer, a sub-wavelength grating structure and an infrared absorption layer. The infrared thermal imaging system based on the infrared focal plane array includes a wavelength conversion module, a readout signal generation module and an imaging display module; the core component of the wavelength conversion module is an infrared focal plane array; the infrared radiation from the target is focused on the focal plane, The infrared image information of the target is converted into temperature distribution information on the focal plane array; the readout signal generating module is used to generate linearly polarized narrow-band near-infrared light and make it reflected by the infrared focal plane array and then enter the imaging display module to realize the visualization of the target object . The invention realizes the thermal imaging system design of large area array, high pixels, low cost and fast response.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

A kind of infrared detector and preparation method thereof

The present disclosure relates to an infrared detector and a preparation method thereof. The infrared detector includes a substrate, a thermosensitive layer on the substrate, a dielectric layer, an electrode layer and a passivation layer, and the dielectric layer is located between the thermosensitive layer and the electrode layer. , the heat-sensitive layer is located on the side of the dielectric layer close to the substrate, and the passivation layer is located on the side of the electrode layer away from the substrate; the infrared detector includes a plurality of infrared detector pixels arranged in a matrix, and the infrared detector pixel includes an absorbing plate Structure, at least two micro-bridge columns and at least two beam structures, the absorbing plate structure is connected to the corresponding micro-bridge column through the corresponding beam structure; the heat-sensitive layer covers the area where the absorbing plate structure and the beam structure are located, and the passivation layer covers the absorbing plate The region where the structure and the beam structure are located; wherein, the material constituting the heat sensitive layer includes one or more of amorphous silicon, amorphous carbon, amorphous germanium or amorphous silicon germanium. Through the technical proposal of the present disclosure, the thermal response time of the infrared detector is reduced, and the infrared response rate of the infrared detector is improved.
Owner:BEIJING NORTH GAOYE TECH CO LTD
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