The invention discloses a TSV packaging defect detection method and
system, and the method comprises the steps: carrying out the multi-dimensional excitation scanning of a TSV packaging structure through employing an
eddy current pulse thermal imaging device, and generating a three-dimensional
eddy current field distribution
feature matrix; inputting the three-dimensional
eddy current field
distribution characteristic matrix into a topological manifold
decomposition module for defect characteristic separation, and constructing three characteristic components of a structure deformation topological ring, an interface fracture chain and a thermal stress abnormal curved surface based on a continuous
coherence analysis method; performing cross-domain fusion
processing of a dynamic heterogeneous neural
network on the three feature components, and generating a defect topology
fingerprint spectrum through a double-path attention gating mechanism; and inputting the defect topology
fingerprint into a multi-scale entropy evaluation module for defect evolution
simulation, and outputting a quantitative detection report containing defect geometric parameters,
failure probability and reliability threshold. According to the embodiment of the invention, a comprehensive defect detection
system can be constructed, and the accuracy and efficiency of defect identification are improved.