The invention discloses high-dimensional stability Sn-Ag-Cu solder suitable for electronic packaging. The main component metal elements of the solder include Sn, Ag, Cu and Be. According to the solder, the excellent melting property, the excellent welding performance and the excellent mechanical property of Sn-Ag-Cu solder alloy are maintained, the elasticity modulus of a welding connector can also be remarkably improved, a welding spot is made to have high toughness, the dimensional stability is good, and the solder is particularly suitable for ultra-small interval electronic packaging. The electric conductivity and heat conductivity of the prepared welding spot can also be improved, so that the welding spot still has the excellent comprehensive service performance while bearing electric, thermal and mechanical loads and accords with the miniaturization, precision and high-performance development tendency of modern electronic components, the using reliability of the electronic products is improved, and the service life of the electronic products is prolonged. Furthermore, through one or more of Al, Ni and V, the high-temperature oxidation resistance, wettability, fluidity and high-temperature chemical stability of the solder can be further improved, the solder alloy is refined, and the mechanical property of the welding spot is improved.