The invention discloses a high-strength, high-elasticity and high-conductivity copper alloy. The copper alloy comprises the following chemical components: 0.005-2.0 wt% of Cr, 0.001-0.5 wt% of Zr, 2.5-5.0 wt% of Ni, 0.1-1.0 wt% of Co, 0.4-1.6 wt% of Si, 0.01-0.2 wt% of Mg, and the balance Cu. The high-strength, high-elasticity and high-conductivity copper alloy uses copper, chromium, zirconium, nickel, cobalt, silicon, magnesium, titanium, lanthanum and cerium as main components, and has the yield strength above 800 MPa, the elastic modulus above 130 GPa and the electric conductivity above 50% IACS; the comprehensive performance and the environmentally friendly performance of the copper alloy are both superior to that of an existing common material for producing electronic connectors and lead frames; and the copper alloy is an ideal material for producing the electronic connectors and the lead frames. The invention provides the copper alloy with high yield strength, high elastic modulus and excellent electric conductivity for the electronic connectors and the lead frames needed by miniaturization, lightness and high integration of electronic and communication equipment.