31results about How to "Fully annealed" patented technology

The invention discloses an annealing device for wire and cable manufacturing. The device comprises an equipment main body, a control panel is fixedly connected to the middle position of the bottom of the front surface of the equipment main body, an annealing device is arranged in the middle position of the left side of the top of the equipment main body, protection supports are fixedly connected to the positions, located on the two sides of the annealing device, of the top of the equipment body, a fixing frame is fixedly connected to the right sides of the tops of the protection supports, and a feeding guide sleeve is fixedly connected to the side, close to the annealing device, of the fixing frame. The invention relates to the technical field of wires and cables. According to the annealing device for wire and cable manufacturing, the stability of a cable during moving is effectively improved, the feeding tensioning force of the cable is adjusted, and meanwhile, the entering position is automatically adjusted, so that the situation that the cable position is excessively deviated in the device, a heating mechanism and a feeding adjusting body are concentrated to have a small amount of height deviation is avoided, and it can be guaranteed that the interior is in a tight state, and sufficient annealing is facilitated.

A method for forming a pressure sensor, comprising: providing a semiconductor substrate; forming a bottom electrode layer on the semiconductor substrate; forming a sacrificial layer on the semiconductor substrate, the sacrificial layer covering the bottom electrode layer; forming a top electrode layer , the top electrode layer covers the top surface, side surfaces and part of the semiconductor substrate of the sacrificial layer; laser annealing is performed on the top electrode layer; after the laser treatment, a through hole is formed in the top electrode layer an opening in the thickness of the top electrode layer, the opening exposing the sacrificial layer; and removing the sacrificial layer through the opening. The forming method can improve the performance of the formed pressure sensor.

The invention relates to a preparation method of silica optical fiber, in particular to a preparation method of high-strength silica optical fiber, which is used to solve the disadvantage that the strength of the existing silica optical fiber cannot meet the requirements of special application occasions. The preparation method of the high-strength silica optical fiber comprises the following steps: firstly, mechanically polishing a quartz preform with a diameter of 20-35 mm, the roughness after polishing is 6-8 μm, and then performing flame polishing, and the roughness after polishing is 4-6 μm , and then gradually reduce the heating temperature by gradually reducing the flow rate of hydrogen in the oxyhydrogen flame. After stopping the heating, let the quartz preform stand at room temperature, pickle the quartz preform and then draw it. The drawing speed is 3-10m / min , while annealing the bare optical fiber output from the exit of the drawing furnace, the length of the annealing section is 600mm, the annealing temperature is 300-500°C, and finally the bare optical fiber is coated.

The invention discloses a method for preparing a superconducting wire / strip. The method for preparing the superconducting wire / strip comprises the following steps that 1, a metal package sheathing / ceramic core wire composite wire is wound on a pay-off reel after the metal package sheathing / ceramic core wire composite wire is cleaned, the metal package sheathing / ceramic core wire composite wire penetrates through a first guide pulley, an induction coil device, a second guide pulley and a drawing die in sequence, and the metal package sheathing / ceramic core wire composite wire is clamped on a wire drawing machine drawing device to complete assembling; 2, the wire drawing machine drawing device is started to drive the metal package sheathing / ceramic core wire composite wire to draw; 3, the drawn metal package sheathing / ceramic core wire composite wire is collected, then the assembling and drawing process are repeated, and then the superconducting wire / strip is obtained through heat treatment; and induction annealing and synchronous drawing are carried out on the metal package sheathing / ceramic core wire composite wire during repeated drawing. According to the method for preparing thesuperconducting wire / strip, induction annealing is introduced into the drawing, so that the metal package sheathing of the metal package sheathing / ceramic core wire composite wire rapidly heats up, induction annealing and synchronous drawing are realized, the mechanical properties of the superconducting wire / strip are guaranteed, the core breaking phenomenon is avoided, and the processing uniformity of the superconducting wire / strip is improved.

The invention provides a method for nitridation and crystallization of metastable-state samarium-iron alloy. The method comprises the steps of performing rapid cooling and sudden condensation on molten-state samarium-iron alloy to obtain the metastable-state samarium-iron alloy; performing nitridation and initial crystallization on the metastable-state samarium-iron alloy to obtain nitrided samarium-iron alloy; and performing annealing and crystallization on the nitrided samarium-iron alloy to obtain a samarium-iron nitrogen permanent-magnet material. During nitridation of a metastable-state material, a large amount of rheological units existing in the metastable-state alloy are beneficial for diffusion and homogenization of nitrogen atoms, the nitridation content of the alloy can be remarkably increased, and the nitrogen atoms are uniformly distributed; crystallization is completed before decomposition of Sm<2>Fe<17>N<x>, nitride formation is reduced or prevented, and the metastable-state samarium-iron alloy has a refined microstructure; and moreover, according to the method provided by the invention, the nitridation speed is fast, and the nitridation efficiency of improving a samarium-iron nitrogen magnetic material by the samarium-iron alloy is improved.

The invention provides a laser annealing device and a laser annealing method. A general pulse waveform rises sharply from the start of oscillation, shows a peak value, and then gradually decreases. When the power shows a peak value, the surface of the annealing object is rapidly heated to a high temperature. Since the peak time is instantaneous, it is difficult to sufficiently heat the deep region of the annealing object. In the laser annealing apparatus of the present invention, when a pulse current is input, a laser pulse is emitted from a laser diode. The optical system guides the laser beam emitted from the laser diode to the annealing object. The driver supplies a pulse current having a top flat time waveform and a pulse width of 1 μs to 100 μs to the laser diode.

The invention relates to the technical field of slotting cutter manufacturing, and discloses a manufacturing process of an ultra-thin slotting blade. According to the manufacturing procedure, the process sequentially includes the steps of forging and annealing a blank, lathing and grinding the two end faces, performing finish turning on an outer circle, grinding the flat face, cutting an inner hole through a slow-feeding wire, grinding the inner hole, cutting a key groove through the wire, cutting a cylinder into a blade through the slow-feeding wire, accurately grinding a blade supporting face, accurately grinding a blade front edge face, grinding a tooth profile and a relief angle, performing mirror grinding on a front blade face, passivating a cutting edge and conducting coating. In theblank forging and annealing step, multiple blades are combined and forged into the cylinder blank. The demagnetizing step is executed between the step of lathing and grinding the two end faces and the step of performing finish turning on the outer circle. The steps of heat treatment, destressing, surface sand blasting and cold treatment are sequentially executed between the step of performing finish turning on the outer circle and the step of grinding the flat face. By means of the manufacturing process, the manufacturing quality of the ultra-thin slotting blade is improved.

The invention provides an optimization preparation method of an LF2 aviation guide pipe. The optimization preparation method comprises the following steps of heating, extruding, puling and correcting,etching, rolling, diameter reducing annealing, drawing, straightening, cleaning, detection and finished product annealing for a hollow ingot are carried out in sequence, so that an aluminum alloy conduit is obtained. According to the method, the cutting inclination, the wall thickness difference and the curvature degree of the hollow ingot are specifically controlled, so that the prepared conduithas good dimensional accuracy; the aluminum alloy conduit is prepared by adopting a non-lubricating extrusion process under the specific perforation needle length, and the aluminum alloy conduit withgood inner surface quality is obtained under the condition that the perforating needle is not damaged in the extrusion process; a high-temperature short-time and rapid heating cooling annealing process is adopted, so that a guide pipe with a small surface grain size is obtained, and the phenomenon that the aluminum alloy generates "orange peel" in the follow-up bending process is avoided. According to the optimization preparation method, the LF2 aviation guide pipe with good quality is prepared under the comprehensive action of various processes.

The invention provides a manufacturing method of an aluminum alloy conduit having a good bending property. The manufacturing method comprises the steps of sequentially performing heating, extrusion, withdrawal straightening, corrosive washing, rolling, diameter-reducing annealing, drawing, washing, detection and finished product annealing on a hollow ingot to obtain the aluminum alloy conduit, wherein the finished product annealing method comprises the following steps: (1) fixing the temperature of an empty furnace to be 480 to 500 DEG C, maintaining the temperature after the furnace reaches apreset temperature, and baking; (2) after the baking is ended, quickly performing hot-furnace charging to finish charging of the furnace; (3) after charging of the furnace is ended, setting the furnace temperature to be 430 to 450 DEG C, maintaining the temperature and performing annealing treatment; and (4) quickly discharging a product from the furnace after the annealing treatment is ended, and performing air cooling, wherein the time starting from the end point of charging to discharging is shorter than or equal to 65 min. By adopting high-temperature and short-time quick heating, coolingand annealing processes, the manufacturing method provided by the invention can effectively refine grains; the annealing process can be used for obtaining a conduit with a relatively small surface grain size; and the phenomenon of 'Orange Peel', generated in a subsequent bending process, of the aluminum alloy can be prevented.

The invention discloses a machining technology of a titanium alloy pipe. The technology comprises the following steps of alloy smelting, pouring, perforating, extruding, rolling and surface treatment.According to the machining technology, titanium serves as a main raw material, the material is poured into an ingot, then perforating and extruding are carried out, and the smoothness degree of the inner surface of the obtained pipe is good.

The invention provides a manufacturing method of a flip LED chip. A first substrate is provided; a light-emitting structure and a first insulating layer are sequentially formed on the first substrate; a second insulating layer is formed on a first N-type electrode and the surface of the first insulating layer; the first insulating layer is etched to form a patterned first through hole which runs through the first insulating layer and a metal reflecting layer and extends into a first N-type gallium nitride layer; the contact position of the N-type electrode and a thimble during packaging of the chip is staggered by the patterned first through hole; patterning isolation is carried out on the N-type electrode; a short circuit caused by conduction of a P electrode and the N electrode since the thimble jacks through the insulating layer in the packaging process is prevented; the reliability of the chip in the packaging process is improved; and furthermore, good ohmic contact is formed by full annealing.