The
optical module disclosed herein includes a circuit board, a substrate, a
laser, an optical modulation
chip, and a
fiber array. The
substrate surface is prone to rusting; therefore, a protective layer can be formed on the
substrate surface. A first connecting plate is provided between the substrate and the
fiber array. A first thermosetting
interface layer is formed between the bottom surface of the first connecting plate and the protective layer, and a first photocurable
interface layer is formed between the top surface of the first connecting plate and the
fiber array. The first thermosetting
interface layer increases the
interfacial bonding energy between the protective layer and the first connecting plate, thereby increasing the adhesion between the substrate and the first connecting plate. The first photocurable interface layer is formed by low-temperature curing, thereby preventing the
fiber array from deforming due to high temperatures. The first photocurable interface layer has a
low shrinkage rate, preventing the
fiber array from deforming due to stress, thereby reducing the
optical path offset of the
fiber array. The bottom and top surfaces of the first connecting plate form different interface
layers, satisfying both the adhesion between the connecting plate and the protective layer and ensuring that the fiber array has a low
optical path offset.