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3results about How to "Reduce power input" patented technology

Autophagy type space grading electric combination propulsion system and propulsion method

The invention discloses an autophagy type space grading electric combination propulsion system and method. The autophagy type space grading electric combination propulsion system comprises a chemical propulsion module and an electric propulsion module which are coaxially arranged from inside to outside. The electric propulsion module comprises a cathode, an insulating sleeve, an anode, a power supply and a transmission device; the cathode is a metal structure of the chemical propulsion module except the propellant; the anode is coaxially and fixedly arranged on the periphery of the tail of the insulating sleeve in a sleeving mode and can synchronously and axially slide along with the insulating sleeve. A space chemical propulsion mode and an electric propulsion mode are ingeniously combined, the characteristic that a pulse plasma propulsion technology adopts metal and other solid working media as propellants is utilized, and after space chemical propulsion fuel is used up, the structural material of the space chemical propulsion fuel serves as an electric propulsion working medium to achieve re-propulsion of the autophagy type space grading electric combination propulsion system. The spacecraft can meet the requirements of high thrust, high specific impulse, long service life and the like, space pollution can be reduced, and environmental protection is promoted.
Owner:PLA PEOPLES LIBERATION ARMY OF CHINA STRATEGIC SUPPORT FORCE AEROSPACE ENG UNIV

Ship loader luffing slewing device

The utility model belongs to ship loader technical field, concretely relates to a ship loader pitch rotation device, including support platform, be provided with the hinged support on support platform rotation, be provided with the cantilever frame on the hinged support hinged setting, the support platform is fixedly provided with the support frame, support frame top one side is provided with the steering device, the steering device includes the mounting seat and the goose head frame, be provided with the first pulley on the goose head frame, the goose head frame is hinged and is connected with the mounting seat, the mounting seat fixed connection support frame, be provided with the winding device on the support frame, the winding device is around and is provided with the steel wire, and the other end of steel wire passes through the first pulley after connecting cantilever frame far from the one end of hinged support. The utility model through setting up hinged cantilever frame swing when driving hinged support rotation, need not drive support frame rotation, simultaneously make the goose head frame of installing first pulley hinged installation, make it can swing with cantilever frame synchronization, guarantee cantilever frame angle adjustment smoothly.
Owner:HUADIAN CAOFEIDIAN HEAVY IND

Wafer positioning equipment for gluing developing machine

The invention belongs to the technical field of gluing and developing auxiliary equipment, and discloses wafer positioning equipment for a gluing and developing machine, the wafer positioning equipment comprises a carrier plate and a positioning operation arm, a main clamping assembly is fixedly arranged in the carrier plate, and mounting plates are fixedly arranged at the two ends of the main clamping assembly. According to the invention, the two-side extruding and pushing assemblies extrude and push along the two sides of the back of the adjustable clamping part, control the deformation of the elastic metal sheet and the thermal stress sheet, and fit along the outer side surface of the wafer to adapt to the arc surface of the outer side of the wafer so as to realize sufficient tight fit and clamping, thereby adapting to clamping of wafers of different sizes, and improving the clamping efficiency. The bending radian is rapidly adjusted to adapt to the outer side arc surface of the wafer, the use range of experience positioning is greatly widened, replacement of a positioning clamping mold is avoided, meanwhile, the adjusting process can be adjusted in real time according to the wafer size, the bending temperature can be maintained after adjustment, continuous and rapid use after one-time adjustment is achieved for the wafers of the same size, the comprehensive use effect is good, and the production efficiency is high. Adaptive adjustment is simple and fast, and the use effect is good.
Owner:YUHONGYAN TECH (SUZHOU) CO LTD