The invention provides a method for achieving the growth of monocrystalline silicon through a Czochralski method. The method comprises the steps of: step (1), providing silicon wafers doped with deuterium, nitrogen and barium ions and a polycrystalline silicon raw material, putting the silicon wafers and the polycrystalline silicon raw material in a crucible for fusion; and step (2), forming the monocrystalline silicon ingot doped with the deuterium and nitrogen ions by using the Czochralski method through the addition of a magnetic field. According to the method for achieving the growth of the monocrystalline silicon through the Czochralski method, the level of impurities in a molten mass and the grown monocrystalline silicon crystal ingot can be reduced, and by performing high-temperature annealing on the nitrogen-doped monocrystalline silicon wafers, COP defects in the surface area of the silicon wafers can be eliminated; by storing the deuterium ions in gaps of the monocrystallinesilicon ingot, the content of impurities of oxygen and carbon can be reduced, and when a device is formed on wafers which grow later, the deuterium ions can combine with vacant bonds at an interface between a gate dielectric layer and a semiconductor to form a stable structure, so that penetration of hot carriers can be avoided; besides, the leakage current is reduced, and the performance and reliability of the device are improved; by doping the silicon wafers with the nitrogen, deuterium and barium ions, the application amount of the doped silicon wafers can be reduced, and the manufacture cost can be reduced.