16 results about "Nanomanufacturing" patented technology

An apparatus for creating pressure gradients in gas, includes a thermoelectric stack that includes a plurality of thin films of thermoelectric material separated by a thermal and electrical insulator, wherein each thin film, of the plurality of thin films, is in communication with a gas in which a pressure gradient is created. The apparatus further includes at least one aperture connecting two volumes of the gas at opposite sides of the thermoelectric stack, at least one electrical conductor connecting the plurality of thin films, where the at least one electrical conductor includes walls of the aperture or a separate element, and an electric current supply to supply electrical current to the plurality of thin film.

Catalyst assisted chemical etching of semiconductor substrate can achieve extreme aspect ratio (better than 1000:1), reproducibility and controlled etching quality for submicron feature size in the direction perpendicular to the substrate. The current patterning methods of the catalyst layer suffer of carbon contamination that affects the etching quality and limits the high-resolution pattern transfer in the semiconductor substrate for high aspect ratio etching. The present method allows to use semiconductor standard manufacturing processes to realize carbon-free pattern of catalyst layer by a physical separation with an interlayer material between the catalyst and the polymeric resist used in common lithographic methods. The present method allows to realize controlled predefined nanostructures with high resolution, high fidelity and high throughput yield during the catalyst assisted chemical etching of silicon for X-ray optics nanofabrication.

A method and system for high-speed 2θ multi-point scatterometry is disclosed. The method includes directing a laser beam from a laser light source to a collimation optical system that collimates the laser beam to a collimated laser beam; adjusting a polarization of the collimated laser beam using a polarization control optics; directing the collimated laser beam that is polarized by a first optical system to illuminate a focal area on a sample surface; receiving reflected light from the focus of the laser light source at the sample surface by a second optical system; detecting the reflected light by a detector system to produce detection signals; and processing the detection signals to measure parameters of the sample surface.

The invention discloses a topological insulator Bi2Te3 nanopore size regulation and control method based on thickness-diameter ratio feedback, and belongs to the field of two-dimensional material nanometer manufacturing. Comprising the following steps: step 1, placing a sample in a transmission electron microscope, and prefabricating nanopores with the diameter of 1-5nm in a bismuth telluride film with the thickness of 2-10nm by utilizing a converged electron beam; step 2, performing irradiation by using an electron beam with 300kV acceleration voltage, wherein the beam density is controlled to be 1.54 * 10 < 5 > A.m <-2 >; 3, feeding back the regulation and control size based on the ratio of the initial aperture of the nanopore to the thickness of the material, and when the thickness-diameter ratio is smaller than 0.5, realizing aperture shrinkage or expansion by adjusting the beam density; and when the thickness-diameter ratio is greater than 0.5, the electron beam irradiation only enables the aperture to be enlarged, and the aperture cannot be shrunk. The method does not need chemical reagents, is green and environment-friendly, can directionally regulate and control the size of the bismuth telluride nanopore, and is suitable for preparing topological quantum devices, nanofiltration membranes and thermoelectric nanostructures.

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These PFBs can be created on one or more sources wafers. Then using pick-and-place technologies, the PFBs can be selectively arranged on a destination wafer thereby allowing Nanoscale-aligned 3D Stacked Integrated Circuit (N3-SI) and the Microscale Modular Assembled ASIC (M2A2) to be efficiently created. Some embodiments include systems and techniques for the construction of construct semiconductor devices which are arbitrarily larger than the standard photolithography field size of 26×33 mm, using pick-and-place assembly.

The invention relates to the technical field of nanometer manufacturing and braze coating, in particular to amorphous nanometer alloy particles for braze coating and a preparation method of the amorphous nanometer alloy particles. The preparation method comprises the following steps: S1, adopting a metal salt mixture of at least two different metals as a target material, and loading the target material onto a substrate; s2, adding ionic liquid into the liquid-phase organic medium, and dispersing to obtain a composite medium; s3, immersing the substrate into the composite medium, and irradiating the metal salt by adopting double-pulse femtosecond laser to carry out liquid phase ablation; and S4, a passivating agent is added into the reaction liquid obtained in the step S3, mixing is conducted, solid-liquid separation, washing and drying are conducted, a passive film is formed on the surface of alloy particles, and the amorphous nano-alloy particles are obtained. The method disclosed by the invention is a universal method and is suitable for preparing various multi-component amorphous nano-alloy particles; and the prepared nano alloy particles are high in amorphous state degree and excellent in oxidation resistance.

A device including a chamber and a nozzle detachably connected to the chamber, the nozzle defining an aperture, a target carousel disposed within the chamber, a first laser configured to generate a first beam directed toward the target carousel to perform in-situ ablation to form a laser plume, a gas flow system configured to supply gas into the chamber, such that the gas interacts with the laser plume and causes condensation and formation of nanoparticles, and a second laser configured to generate a second beam directed through the interior of the chamber, through the aperture of the nozzle, and toward a substrate disposed outside the device, the second laser beam configured to sinter and crystalize on the substrate the nanoparticles exiting the nozzle.

The present invention discloses a method for encapsulating single perovskite nanocrystal particles induced by ammonia vapor and confined by ligands. This method involves purifying perovskite nanocrystals prepared by hot injection, capped with APTES and OA, and repaired with PbX2 for lattice defects, before dispersing them in toluene. A ligand and an organosilane are then added, and the mixture is stirred in an ammonia vapor atmosphere to produce SiO2-encapsulated monodisperse perovskite nanocrystal particles. The CsPbX3@SiO2 core-shell structure particles prepared using this method can nearly intactly preserve the crystal structure and excellent optical properties of CsPbX3, significantly improving the stability of the nanocrystals while maintaining their small size and monodispersity. These particles are suitable as building blocks for advanced nanofabrication technologies, particularly in display technology, anti-counterfeiting, and other fields.

The invention discloses a construction method of a controllable micro-nano array based on 3D printing, which comprises the following steps: synthesizing gold nanorods by a seed crystal growth method and a dual-surfactant method, and modifying the surfaces of the gold nanorods to effectively synthesize gold-silver core-shell nano bricks with solid morphology and uniform size. A simple and effective self-assembly and nanometer manufacturing method is combined with ligand modification, particles are controllably synthesized, the synthesized high-concentration gold and silver core-shell structure nanometer brick solution is used as a spraying material, and the printing process of micro-droplets is controlled through a micro-scale high-precision spraying controllable micro-nano array preparation technology; and micro-nano-scale ordered arrangement of the gold-core silver-shell bimetallic nano bricks is controlled, so that the controllable micro-nano array with macroscopic large scale and microscopic ordered is prepared.

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These PFBs can be created on one or more sources wafers. Then using pick-and-place technologies, the PFBs can be selectively arranged on a destination wafer thereby allowing Nanoscale-aligned 3D Stacked Integrated Circuit (N3-SI) and the Microscale Modular Assembled ASIC (M2A2) to be efficiently created. Some embodiments include systems and techniques for the construction of construct semiconductor devices which are arbitrarily larger than the standard photolithography field size of 26×33 mm, using pick-and-place assembly.

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These PFBs can be created on one or more sources wafers. Then using pick-and-place technologies, the PFBs can be selectively arranged on a destination wafer thereby allowing Nanoscale-aligned 3D Stacked Integrated Circuit (N3-SI) and the Microscale Modular Assembled ASIC (M2A2) to be efficiently created. Some embodiments include systems and techniques for the construction of construct semiconductor devices which are arbitrarily larger than the standard photolithography field size of 26×33 mm, using pick-and-place assembly.

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These PFBs can be created on one or more sources wafers. Then using pick-and-place technologies, the PFBs can be selectively arranged on a destination wafer thereby allowing Nanoscale-aligned 3D Stacked Integrated Circuit (N3-SI) and the Microscale Modular Assembled ASIC (M2A2) to be efficiently created. Some embodiments include systems and techniques for the construction of construct semiconductor devices which are arbitrarily larger than the standard photolithography field size of 26×33 mm, using pick-and-place assembly.

A system and method for hyperdimensional imaging includes a three-dimensional nano-fabricated optical structure comprising a porous scaffold material with nanoscale voids and volumetric variations in at least one optical property. The volumetric variations are patterned across three spatial dimensions of the porous scaffold material to encode optical information and implement a plurality of optical functions. The system and method enable integration of multiple optical functions including lensing, dispersion, and phase encoding within a single volumetric structure, providing enhanced pixel utilization and optical throughput for hyperspectral and hyperdimensional imaging applications.

A diagnostic chip for detecting biomarkers and trace amounts of nanoparticles in chemical mixtures or water. The diagnostic chip includes one or more inputs, and a sample containing particles of different sizes is introduced into at least one of the inputs. The diagnostic chip further includes multiple separation regions, and the sample is pressurized as it passes through the separation regions. Each separation region includes a deterministic lateral displacement array, and the deterministic lateral displacement arrays in two or more of the separation regions have different etch depth profiles. In this way, the diagnostic chip effectively detects biomarkers and trace amounts of nanoparticles in chemical mixtures or water.

We provide diagnostic equipment. [Solution] A diagnostic chip for detecting biomarkers and trace nanoparticles in chemical mixtures or water. The diagnostic chip comprises one or more input sections into which a sample containing particles of different sizes is introduced. Furthermore, the diagnostic chip comprises multiple separation regions into which the sample is pressurized as it passes through. Each separation region comprises a deterministic transverse displacement array, and the deterministic transverse displacement arrays in two or more of these separation regions have different etching depth profiles. In this way, the diagnostic chip effectively detects biomarkers and trace nanoparticles in chemical mixtures or water.