The invention discloses a host shell material for a computer, which is prepared from the following components in percentage by mass: 40 to 50 percent of diatomite, 15 to 20 percent of butyronitrile styrene copolymer, 5 to 10 percent of graphene, 2 to 5 percent of glass fiber, 2 to 5 percent of coupling agent, 10 to 20 percent of calcium fluoride, 3 to 8 percent of rose powder and 2 to 5 percent ofcross-linking agent, totaling 100 percent. The host material is prepared by the following steps: uniformly mixing and stirring diatomite, calcium fluoride, a butyronitrile-styrene copolymer, a cross-linking agent, a coupling agent and graphene, and drying in a drying oven, sieving the rose powder with a 5-10-mesh sieve, uniformly mixing the sieved rose powder with glass fibers, and mixing the obtained mixture in an internal mixer, and granulating and drying the obtained mixture, adding into an injection molding machine, and molding to obtain the finished product. The mainboard provided by theinvention has good thermal conductivity, is not easy to be stained with dust, has good mechanical resistance, is simple in preparation method, and can be produced on a large scale.