The invention discloses a fabrication method for a flexible printed circuit (FPC) fine circuit. The fabrication method comprises the steps of substrate opening, laser drilling, black hole processing, full-board electroplating, slight etching combination processing of volcanic ash and a chemical medicine, dry film lamination in vacuum, laser direct imaging (LDI), dry film developing, dry film photocuring, circuit etching, automatic optical detection, and finished product package. The fabrication method for the FPC fine circuit is simple and scientific in design, copper particles are fine and uniform in surfaces after slight etching combination processing of the volcanic ash and the chemical medicine, a copper surface is good in roughness, and the binding force between a dry film and the copper surface is improved; the dry film is photocured, the binding force between the dry film and the copper surface is improved, etching of the FPC fine circuit is facilitated, and the reject ratio such as dry film dropping and circuit opening is reduced.