The invention discloses a copper plating device adopting an external tank for dissolving electrolytic copper and a copper plating technique thereof. By adopting an insoluble anode in the plating tank, phosphorus powder, copper powder and insoluble impurities can be effectively prevented from being generated by the anode, a high-purity electroplating solution is prepared, and the corrosion resistance of a clad layer and the quality of an electroplated product are improved; metallic copper is supplemented from the outside, no anode mud or copper powder or phosphorus powder is generated, the utilization rate of the metallic copper can be effectively increased, and electrolytic copper is cheaper than phosphorous copper and active copper oxide powder; meanwhile, the concentration of copper ions can be controlled, the content of copper sulfate is prevented from being increased, and the quantity of supplemented sulfuric acid can be decreased; the voltage loss of the anode is small, and the whole insoluble anode can conduct electricity extremely uniformly so that the distance between a cathode and the anode can be decreased to a large extent, the voltage of the plating tank can be effectively reduced, and energy consumption can be reduced; and the current efficiency difference between the cathode and the anode is avoided, the problems that the content of the copper sulfate is increased and sulfuric acid consumption is high are solved, maintenance is easy, and the environmental friendliness is better.