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A method and apparatus for repairing broken microcircuits in micro-nano 3D printed micro-nano circuits based on electric field-driven micro / nano 3D printing.

This invention belongs to the field of precision electronic circuit manufacturing technology, and provides a method and device for repairing broken lines in micro-circuits based on electric field-driven micro / nano 3D printing. This invention employs electric field-driven jet deposition micro / nano 3D printing technology, with the printing nozzle connected to a high-voltage power supply. Utilizing the diameter reduction effect of the Taylor cone in electrostatic dynamics, it achieves the fabrication of micro / nano-scale feature structures. Under the action of electrostatic field tension (changing traditional pressure-driven to tension-driven), high-viscosity materials can be printed with high resolution, enabling the repair of conductive line defects below 1μm. It is particularly suitable for repairing three-dimensional / curved conductive lines and conductive line defects in large-size (meter-scale) substrates. This invention can achieve high-resolution, high-precision, low-cost, and efficient repair of micro-precision conductive line defects.
Owner:QINGDAO 5D INTELLIGENT ADDITIVE MFG TECH CO LTD