This invention belongs to the field of precision
electronic circuit manufacturing technology, and provides a method and device for repairing broken lines in micro-circuits based on
electric field-driven micro / nano 3D printing. This invention employs
electric field-driven jet deposition micro / nano 3D printing technology, with the printing
nozzle connected to a high-
voltage power supply. Utilizing the
diameter reduction effect of the
Taylor cone in electrostatic dynamics, it achieves the fabrication of micro / nano-scale feature structures. Under the action of electrostatic field tension (changing traditional pressure-driven to tension-driven), high-
viscosity materials can be printed with
high resolution, enabling the repair of conductive
line defects below 1μm. It is particularly suitable for repairing three-dimensional / curved conductive lines and conductive
line defects in large-size (meter-scale) substrates. This invention can achieve high-resolution, high-precision, low-cost, and efficient repair of micro-precision conductive
line defects.