The invention discloses an organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for a PCB (Printed Circuit Board). The organic silicon electronic pouring sealant is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl end silicone oil-1, 50 to 60 parts of vinyl end silicone oil-2, 0.38 to 0.5 part of 12 percent platinum catalyst, 0.02 to 0.04 part of ethynylcyclohexanol, 25 to 30 parts of vinyl silicone resin, 1-allyloxy-2, 14.8 to 16.8 parts of 3-epoxypropane 1, 23 to 25 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agent A171, a proper amount of hydrogen-containing silicone oil, 3.4 to 4 parts of graphene, 0.2 to 0.4 part of silane coupling agent KH1510, a proper amount of acetone and a proper amount of deionized water. The pouring sealant prepared by the invention is simple in preparation process, wide in raw material source, high in operability and high in quality stability of a product; in addition, the pouring sealant has the advantages of excellent weather fastness, heat dissipation, corrosion resistance, high strength and the like, and is worthy of being popularized.