The invention provides a 3D integrated superminiature band-pass filter which is realized by adopting a semi-lumped structure, and comprises an input/output port, four parallel-connection resonant cells, an inter-stage coupling capacitor and a Z-shaped crossed coupling capacitor. According to the band-pass filter provided by the invention, interconnection between stages is realized by virtue of electromagnetic coupling among the resonant cells. By virtue of an LTCC (low temperature co-fired ceramic) laminating structure, an equivalent lumped parameter element is realized. Compared with the prior art, the 3D integrated subminiature band-pass filter has the advantages of a small size, low cost, good frequency-selection characteristic, high temperature stability and small insertion loss, can be machined into a paster film, is convenient to integrate with other microwave assemblies and beneficial to mass production. The scheme adopted by the invention can be used for inhibiting out-of-band harmonic waves, and is applicable to occasions and corresponding systems with strict requirements on size, electrical performance, temperature stability and reliability, such as communication terminals of corresponding microwave millimeter wave frequency bands, digital radars and wireless communication hand-held terminals.