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33results about How to "Reduced packaging requirements" patented technology

Capacitive micromachined tuning fork gyroscope

The invention provides a capacitive micromachined tuning fork gyroscope. The gyroscope is the symmetrical dual-mass structural gyroscope, comprising a substrate and a framework arranged in the centre of the substrate, wherein the middle of the framework is provided with a framework beam perpendicular to the framework; two detection mass blocks are symmetrically arranged in the framework with the framework beam as a symmetry axis, and four corners of each detection mass block are connected with the framework and the framework beam through at least four drive beams; decoupling drive comb capacitors are respectively arranged at both ends of each detection mass block in the direction of a vertical axis; detection comb capacitors are symmetrically arranged on both outer sides of the framework in the direction of a horizontal axis; at least four detection beams are arranged on both outer sides of the framework in the direction of the vertical axis; and the detection beams are distributed symmetrically relative to the vertical axis and the horizontal axis and are fixed on the substrate through corresponding anchor points. According to the capacitive horizontal-axis micromachined tuning fork gyroscope provided by the invention, the mechanical coupling between the detection mode and the driving mode of the micromachined tuning fork gyroscope can be solved easily and effectively.
Owner:PEKING UNIV

CMOS difference radio-frequency signal amplitude detection circuit

The invention discloses a CMOS difference radio-frequency signal amplitude detection circuit, being composed of MOS transistors from M1 to Mn which work under the weak inversion polarization and a filter resistance R0 and a capacitance C0; the MOS transistors from M1 to Mn are serially connected, and the polarization is provided by a current source I1, the grids or drains of the transistors from M1 to Mn are respectively connected with the input positive end Rfin+ of a radio-frequency signal or the input negative end Rfin- of the radio-frequency signal through the capacitances from C1 to Cn, and an amplitude detection result is output by the filter resistance R0 and the capacitance C0, the current change of the MOS transistors under the weak inversion polarization submits to index property, and higher amplitude detection gain is obtained compared with square frequency characteristics, particularly for the weak signal detection, the gain is obvious, and the power consumption is low andis approximate to zero consumption; a plurality of the MOS transistors are serially connected to lead amplitude detection output of each MOS transistor to be serially added, thereby obtaining n timesof detection gain; meanwhile, input impedances of radio-frequency inputs of all MOS transistors are connected in parallel, the whole input impedance value is reduced by n times, the requirements of Qvalue that a high-frequency signal is input to a matching circuit is reduced, so as to realize to be directly connected with a radio-frequency antenna; the differential signal input is adopted, so asto be easy for chip integration and reduce the requirements of chip encapsulation. The circuit is particularly suitable for being applied to wake-up signal detection in a short range communication system and weak radio-frequency signal detection in an RFID system.
Owner:斯凯瑞利(北京)科技有限公司

Packaging structure and method of MEMS optical chip based on silicon-glass bonding

The invention provides a packaging structure and method of an MEMS optical chip based on silicon-glass bonding. The packaging structure comprises a first part and a second part, wherein the first part comprises optical glass of which the upper surface is coated with an upper optical antireflection film and while the lower surface is provided with a cavity; the upper surface of the cavity meets the requirement on smoothness of an optical surface, and a lower optical antireflection film is plated; the second part comprises the MEMS optical chips; the first part and the second part are subjected to silicon-glass bonding to achieve chip-stage bonding, and an independent sealing cavity is formed for each MEMS optical chip. With the adoption of the structure and the method, the chip-stage packaging requirement can be achieved; the reliability and stability of the chip can be improved; the electric performance, mechanical performance and optical performance for application of the optical chip can be ensured; in addition, the comprehensive level superior to that of other packaging technologies is brought; the packaging cost can be reduced; the packaging efficiency can be increased; the light loss can be decreased; the structure and the method have a wide application prospect in the packaging of optical communication devices and optical sensors.
Owner:ANHUI CHINA SCI MW ELECTRONIC TECH CO LTD

Intelligent recognition, counting, and detection algorithm for quasi-circle object facing packaging industry

The invention discloses an intelligent recognition, counting, and detection algorithm for a quasi-circle object facing a packaging industry. According to images collected by an industrial camera, effective regions where quasi-circle objects are located are obtained. An image pretreatment method includes: removing original image noises by using a median filtering algorithm and obtaining binary images after image denoising by using an adaptive local binary algorithm. Geometric feature extraction is carried out by detection for four times; to be specific, quasi-circle objects with normal areas after binaryzation are detected for first detection; the rest of quasi-circle objects with defects are detected after first detection during the second detection process; quasi-circle objects at an uneven region are detected during the third detection process; and quasi-circle objects may existing at a detection boundary are detected during the fourth detection process. Therefore, the counting accuracy of quasi-circle three-dimensional objects is improved; and the packaging requirement is low and the detection robustness is high. Meanwhile, real-time, rapid, on-line monitoring can be realized. The algorithm is applied to detection of various quasi-circle objects.
Owner:NANTONG UNIVERSITY

Automatic weighing, sealing and seaming device for wire and cable material

ActiveCN104670569AReduce the distanceGood coherent effectWrapper twisting/gatheringEngineeringCoherence effect
The invention discloses an automatic weighing, sealing and seaming device for a wire and cable material, and belongs to the technical field of packaging machinery for plastic particles for the wires and cables. The automatic weighing, sealing and seaming device comprises a weighing device supported on the terrace under a used state, a sealing device, a seaming device and a packaging bag supporting device, and is characterized in that the weighing device, the sealing device and the seaming device are arrayed on the same straight line in an arranging manner of left to right; the packaging bag supporting device is supported on a terrace of the use place at the position simultaneously corresponding to the lower parts of the front sides of weighing device, the sealing device and the seaming device. The automatic weighing, sealing and seaming device achieves a good coherence effect; the space is saved, and the adaptability to a packaging place is improved; the labor investment is reduced; furthermore, the sealing efficiency is improved; the labor intensity of an on-line worker is relieved, and the labor cost is reduced so as to save precious labor resources; the sealing quality is guaranteed; the packaging bag can be sealed under a vertical state; the automatic weighing, sealing and seaming device has an effect of preventing the wire and cable material in the bag from leaking from the bag opening.
Owner:CHANGSHU ZHONGLIAN PHOTOELECTRICITY NEW STUFF +1

Thyristor with gate capable of being turned off and manufacturing method thereof

The invention provides a thyristor with a gate capable of being turned off. A plurality of strips formed by repeatedly arranging a plurality of high-doping-concentration upper tube N-type emitting regions are arranged on the upper surface of an N-type silicon substrate sheet; an upper tube P-type concentrated base region bus bar surrounds the periphery of each strip; a cathode metal layer is arranged on the upper surface of each upper tube N-type emitting region; an upper tube P-type base region is arranged below each upper tube N-type emitting region; the side surface of each upper tube P-type base region is connected with an upper tube P-type concentrated base region or an upper tube P-type concentrated base region bus bar; an upper tube N-type collector region is arranged below the upper tube P-type base region, the upper tube P-type concentrated base region and the upper tube P-type concentrated base region bus bar; a lower tube P-type emitting region is arranged below the upper tube N-type collector region; the lower surface of the lower tube P-type emitting region is connected with an anode metal layer; and a gate metal layer is arranged above the silicon substrate sheet. According to the thyristor with the gate capable of being turned off, the dI / dt resistance and the dV / dt resistance are remarkably enhanced, and the breakdown voltage and the current capacity have a wideapplication range.
Owner:HANGZHOU UG MIN SEMICON TECH CO LTD

A high-speed transistor and a manufacturing method thereof

The invention belongs to the field of electronic technology and discloses a high-speed transistor and a manufacturing method thereof. The high-speed transistor comprises a substrate laye; a channel layer disposed on the upper surface of the substrate layer; a first undoped (AlxGa1-x) 2O3 layer disposed on the upper surface of the channel layer; a highly doped (AlxGa1-x) 2O3 layer disposed on the upper surface of the first undoped (AlxGa1-x) 2O3 layer; a voltage modulation layer disposed on the upper surface of the highly doped (AlxGa1-x) 2O3 layer; a source electrode and a drain electrode spaced apart on an upper surface of the voltage modulation layer; and a gate electrode disposed on the upper surface of the voltage modulation layer and located in a region between the source electrode and the drain electrode; As that novel high-speed and high-power transistor are fabricated by the ultra-wide band-gap semiconductor material system and the high-doping (AlxGa1-x) 2-D heterojunction electron gas is formed by the modulation of 2O 3 layer, which effectively improves the frequency and power performance of the device, improves the breakdown voltage of the device material, reduces the requirement of device packaging, and increases the market competitiveness of the device.
Owner:深圳市华讯方舟智能信息技术有限公司

CMOS difference radio-frequency signal amplitude detection circuit

The invention discloses a CMOS difference radio-frequency signal amplitude detection circuit, being composed of MOS transistors from M1 to Mn which work under the weak inversion polarization and a filter resistance R0 and a capacitance C0; the MOS transistors from M1 to Mn are serially connected, and the polarization is provided by a current source I1, the grids or drains of the transistors from M1 to Mn are respectively connected with the input positive end Rfin+ of a radio-frequency signal or the input negative end Rfin- of the radio-frequency signal through the capacitances from C1 to Cn, and an amplitude detection result is output by the filter resistance R0 and the capacitance C0, the current change of the MOS transistors under the weak inversion polarization submits to index property, and higher amplitude detection gain is obtained compared with square frequency characteristics, particularly for the weak signal detection, the gain is obvious, and the power consumption is low andis approximate to zero consumption; a plurality of the MOS transistors are serially connected to lead amplitude detection output of each MOS transistor to be serially added, thereby obtaining n timesof detection gain; meanwhile, input impedances of radio-frequency inputs of all MOS transistors are connected in parallel, the whole input impedance value is reduced by n times, the requirements of Qvalue that a high-frequency signal is input to a matching circuit is reduced, so as to realize to be directly connected with a radio-frequency antenna; the differential signal input is adopted, so asto be easy for chip integration and reduce the requirements of chip encapsulation. The circuit is particularly suitable for being applied to wake-up signal detection in a short range communication system and weak radio-frequency signal detection in an RFID system.
Owner:斯凯瑞利(北京)科技有限公司

Gate-turn-off thyristor and manufacturing method thereof

The invention provides a gate-turn-off thyristor. A plurality of strips formed by repeatedly arraying a plurality of high-doping-concentration upper tube N type emission regions are arranged on an upper surface of an N type silicon substrate chip; an upper tube P-type concentrated basic region bus bar is arranged around the periphery of each strip; a cathode metal layer is arranged on the upper surface of one upper tube N type emission region, an upper tube P-type basic region is arranged below the upper tube N type emission region, and a side face of the upper tube P-type basic region is connected with an upper tube P-type concentrated basic region or the upper tube P-type concentrated basic region bus bar; an upper tube N-type current collection region is arranged below the upper tube P-type basic region, the upper tube P-type concentrated basic region and the upper tube P-type concentrated basic region bus bar; a lower tube P-type emission region is arranged below the upper tube N-type current collection region; a lower surface of the lower tube P-type emission region is connected with an anode metal layer; a gate metal layer is arranged above the silicon substrate chip. According to the gate-turn-off thyristor provided by the invention, anti-dI/dt ad anti-dV/dt capabilities of turn-off thyristor are remarkably enhanced, and breakdown voltage and a current capacity have a wide application range.
Owner:HANGZHOU UG MIN SEMICON TECH CO LTD

GaN-based laser diode structure and manufacturing method

The invention provides a GaN-based laser diode structure and a manufacturing method. The GaN-based laser diode structure comprises an N electrode, an n-type GaN substrate, an N covering layer, an N waveguide layer, a light-emitting active layer, a P waveguide layer, an electron blocking layer and a passivation layer which are sequentially arranged in a stacked mode. A ridge strip is arranged on the upper surface of the P-type electron barrier layer and comprises a P covering layer, and a P contact layer and a P contact electrode layer which are sequentially stacked on the P covering layer; the passivation layer comprises a first passivation layer and a second passivation layer which are arranged in a stacked mode, the first passivation layer is arranged on the upper surface of the P-type electron blocking layer and located on the two sides of the ridge strip, a groove is formed in the second passivation layer, a first metal layer is arranged on the upper surface of the second passivation layer and on the ridge strip, the first metal layer is provided with a protruding part corresponding to the groove, and a second metal layer is arranged on the protruding part. And a P electrode is arranged on the upper surface of the first metal layer. The stress of the electrode structure is reduced, the adhesive force between the metal electrode and the passivation layer is improved, a thick metal electrode can be formed, the packaging requirement is reduced, the heat dissipation performance is improved, and application is expanded.
Owner:安徽格恩半导体有限公司

Organic-inorganic hybridization solar battery and manufacturing method thereof

The invention discloses an organic-inorganic hybridization solar battery which comprises a metal backing electrode, an n-type silicon substrate layer, a silicon nanometer wire array and a battery positive electrode and also comprises a p-type cavity transmission shell layer, wherein the p-type cavity transmission shell layer is a conjugated organic matter semiconductor thin film; the metal backing electrode is arranged on the lower surface of the n-type silicon substrate layer; the silicon nanometer wire array is arranged on the upper surface of the n-type silicon substrate layer; the surfaceof a silicon nanometer wire in the silicon nanometer wire array is covered by the layer of p-type cavity transmission shell layer; and the battery positive electrode is arranged on the p-type cavity transmission shell layer. As a three-dimensional radial p-n junction hybridization structure formed by the silicon nanometer wire array and the conjugated organic matter is adopted in the organic-inorganic hybridization solar battery, on one hand, the absorption of light is increased, the usage amount of silicon is reduced, the purify requirement on the silicon is reduced, on the other hand, the transmission range of current carriers is shortened, the problem that the current carriers are easy to combine is reduced, and the photoelectric conversion efficiency is improved.
Owner:SUZHOU UNIV

Wire and cable material automatic weighing sealing and suturing device

The invention discloses an automatic weighing, sealing and seaming device for a wire and cable material, and belongs to the technical field of packaging machinery for plastic particles for the wires and cables. The automatic weighing, sealing and seaming device comprises a weighing device supported on the terrace under a used state, a sealing device, a seaming device and a packaging bag supporting device, and is characterized in that the weighing device, the sealing device and the seaming device are arrayed on the same straight line in an arranging manner of left to right; the packaging bag supporting device is supported on a terrace of the use place at the position simultaneously corresponding to the lower parts of the front sides of weighing device, the sealing device and the seaming device. The automatic weighing, sealing and seaming device achieves a good coherence effect; the space is saved, and the adaptability to a packaging place is improved; the labor investment is reduced; furthermore, the sealing efficiency is improved; the labor intensity of an on-line worker is relieved, and the labor cost is reduced so as to save precious labor resources; the sealing quality is guaranteed; the packaging bag can be sealed under a vertical state; the automatic weighing, sealing and seaming device has an effect of preventing the wire and cable material in the bag from leaking from the bag opening.
Owner:CHANGSHU ZHONGLIAN PHOTOELECTRICITY NEW STUFF +1
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