Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

58 results about "Gunn diode" patented technology

A Gunn diode, also known as a transferred electron device (TED), is a form of diode, a two-terminal passive semiconductor electronic component, with negative resistance, used in high-frequency electronics. It is based on the "Gunn effect" discovered in 1962 by physicist J. B. Gunn. Its largest use is in electronic oscillators to generate microwaves, in applications such as radar speed guns, microwave relay data link transmitters, and automatic door openers.

Monopulse azimuth radar system for automotive vehicle tracking

A monopulse vehicular radar system for tracking a target about an automotive vehicle senses a transmitted signal reflected back from the target and received at two different locations, determines the sum and the difference of the reflected signals sensed at the two locations, and compares the sum and difference to determine the deviation of the target from a reference azimuth. A source frequency provided by a Gunn diode is applied to and transmitted by a two-lobe monopulse antenna. The antenna lobes detect the reflected signals from the target by sensing them at the two different lobes. A hybrid junction provides sum and difference signals to mixers which homodyne the signals to produce sum and difference Doppler frequency signals using the source frequency. The Doppler frequency signals are amplified and then compared to determine the deviation of the target from the reference azimuth. The comparison process can be done digitally by converting the amplified frequency signals to digital signals which are then processed in a digital signal processor, or the comparison may be done in analog fashion using a phase / quotient detector. The range or distance of the target is determined by shifting the source frequency between two frequencies during transmission and frequency shifting the sum and difference Doppler frequency signals in similar fashion following reception by the antenna.
Owner:BENDIX COMML VEHICLE SYST LLC

Terahertz GaN Gunn diode based on conducting type SiC substrate and manufacturing process thereof

The invention discloses a THz GaN Gunn diode structure based on a conduction-type SiC substrate and the fabrication method thereof, which mainly solve the problem of extremely low output power of a GaAs-based THz Gunn device. The THz GaN Gunn diode comprises a SiC substrate layer, an AlN nucleation layer, and a GaN epitaxial layer, wherein the SiC substrate layer has an n-type conduction-type structure with a doping concentration of 5times10cm to ensure low-resistance conductivity; the low-temperature AlN nucleation layer has a thickness of 30 to 50 nm so that the dislocation density in the GaN epitaxial layer is reduced; the lower layer of the GaN epitaxial layer is a heavily-doped nGaN layer with a doping concentration of 5times10cm and a thickness of 1 mum; the intermediate layer is a lightly-doped NGaN layer with a doping concentration of 1times10cm and a thickness of 1 to 3 mum; and the upper layer is a heavily-doped nGaN layer with a doping concentration of 5times10cm and a thickness of 100 nm. Two etching steps are adopted in the entire fabrication of the device to realize the metallization with two different properties of SiC ohmic contact and GaN ohmic contact metallation, thereby reducing the parasitic series resistance. The THz GaN Gunn diode structure has the advantages of high output power and work frequency, and suits operation in THz bands.
Owner:XIDIAN UNIV

Gunn diode, preparation method and millimeter wave oscillator thereof

The invention discloses a Gunn diode, a preparation method and a power synthesis millimeter wave oscillator of the Gunn diode, belonging to the technical field of semiconductor devices. The Gunn diode sequentially comprises an integrated hear sink, a metal diode, a transition layer, a second contact layer, a top electrode and a gold thickening electrode from bottom to top. The preparation method comprises the following steps: growing a first contact layer, the transition layer and the second contact layer orderly on the semiconductor substrate, corroding a deep groove, evaporating the electrodes and electroplating the heat sink on the sample surface, removing the substrate, evaporating the top electrode, and conducting dry etching to form the Gunn diode. The millimeter wave oscillator seals the prepared Gunn diodes having good uniformity under a resonance cap in a waveguide cavity in pairs and at intervals of lambadag/2. According to the method, the processing fragility of the material is reduced, the heat dissipation performance of the device is improved, and the device performance difference is reduced. The millimeter wave oscillator outputs the radio frequency after multiple Gunn diodes are coupled, so that the output power is increased by times.
Owner:北京中科微投资管理有限责任公司

GaN Gunn diode based on AlGaN electro emission layer with bilinear-gradient Al components and manufacturing method of GaN Gunn diode

ActiveCN104009157AReduce mismatchReduce the dislocation concentrationBulk negative resistance effect devicesOhmic contactCoring
The invention discloses a GaN Gunn diode based on an AlGaN electro emission layer with bilinear-gradient Al components and a manufacturing method of the GaN Gunn diode. The GaN Gunn diode and the manufacturing method of the GaN Gunn diode mainly solve the problems that an existing Gunn device is low in output power and poor in heat dissipation performance. The diode comprises a main part and an auxiliary part. The main part comprises an SiC substrate, an AlN coring layer, an n+GaN cathode ohmic contact layer, an electro emission layer, an n-GaN active layer and an n+GaN anode ohmic contact layer from bottom to top and the auxiliary part comprises an annular electrode, a substrate electrode, a round electrode, a passivation layer, open holes and through holes, wherein the thickness of the electro emission layer is 200-600 nm, and the AlGaN structure with the bilinear-gradient Al components which are gradually changed linearly from 0% to 100% firstly and then from 100% to 0% from bottom to top is adopted. By means of the GaN Gunn diode and the manufacturing method of the GaN Gunn diode, the length of a dead zone can be obviously reduced, the dislocation concentration can be reduced and high-power output can be realized, and the GaN Gunn diode is suitable for working in the terahertz frequency range.
Owner:云南凝慧电子科技有限公司

Oscillator, dielectric waveguide device, and transmitter

An oscillator, a dielectric waveguide device and a transmitter incorporating the same, wherein a special temperature-compensating circuit provides a temperature-compensated device with reduced size and cost, and greater productivity. In the oscillator, a dielectric plate having a strip line of a specified length is arranged between conductive plates which enclose a Gunn diode. The oscillation output signal of the Gunn diode is extracted via the strip line. In addition, the sign of the dielectric-constant temperature coefficient of the dielectric plate is set such that changes in the oscillation frequency caused by changes in temperature of the Gunn diode are suppressed.
Owner:MURATA MFG CO LTD

Reinforced linear gradient doped GaAs planar Gunn diode and manufacturing method thereof

The invention discloses a reinforced linear gradient doped GaAs planar Gunn diode, which comprises a semiconductor insulated substrate, a high doped bottom N+ layer, a linear gradient doped N layer, an N- layer, a high doped upper surface N+ layer, a table top structure, an upper electrode and a lower electrode, wherein the semiconductor insulated substrate is used for supporting the whole GaAs planar Gunn diode; the high doped bottom N+ layer is epitaxially grown on the semiconductor insulated substrate; the linear gradient doped N layer is continuously epitaxially grown on the bottom N+ layer; the N- layer is epitaxially grown on the linear gradient doped N layer; the high doped upper surface N+ layer is epitaxially grown on the N- layer; the table top structure is formed on the bottom N+ layer and the upper surface N+ layer by two processes of digging and isolating; the upper electrode of ohmic contact is formed by evaporating metal on the upper surface N+ layer; and the lower electrode of ohmic contact is formed by evaporating metal on the bottom N+ layer. The invention discloses a manufacturing method for the reinforced linear gradient doped GaAs planar Gunn diode at the same time. By using the diode, the working frequency of an oscillating circuit in a millimeter wave or sub millimeter wave range is improved, and the conversion efficiency of direct current-to-radio frequency signals is enhanced.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

Ka-band monolithic integrated voltage-controlled oscillator based on plane gunn diode

The invention discloses a ka-band monolithic integrated voltage-controlled oscillator based on a plane gunn diode. The ka-band monolithic integrated voltage-controlled oscillator is characterized by comprising a direct current bias voltage input unit, an input lowpass filter, an output interpolation coupling capacitor, the plane gunn diode with a hot electron injection effect and a resonator which are connected in sequence. A direct current bias voltage is fed from a middle conductor of the direct current bias voltage input unit and is fed by connecting a central microstrip line of the input lowpass filter and an upper end metal arm of the output interpolation coupling capacitor with one end of a top layer anode of the plane gunn diode with the hot electron injection effect. According to the ka-band monolithic integrated voltage-controlled oscillator, a monolithic microwave integrated circuit and coplanar waveguide technology is employed; a self-bias circuit structure is employed; a circuit structure is simple; monolithic integration is easy to realize; and a complicated cavity waveguide packaging assembly is unnecessary. According to the ka-band monolithic integrated voltage-controlled oscillator, the plane gunn diode with the hot electron injection effect is introduced, so that the direct current-radio frequency conversion efficiency of the voltage-controlled oscillator is effectively enhanced.
Owner:SOUTHWEST UNIVERSITY

Linear gradient doped GaAs planar gunn diode and manufacturing method thereof

InactiveCN102074652AEasy to tuneImproving DC-to-RF Signal Conversion EfficiencyBulk negative resistance effect devicesOhmic contactSubmillimeter wave
The invention discloses a linear gradient doped GaAs planar gunn diode which comprises a semiconductor insulating substrate, a highly doped lower bottom surface N<+> layer, a linear gradient doped N<-> type layer, a heavily doped upper surface N<+> layer, a table-board structure, an upper electrode and a lower electrode, wherein the semiconductor insulating substrate is used for supporting the whole GaAs planar gunn diode; the highly doped lower bottom surface N<+> layer epitaxially grows on the semiconductor insulating substrate; the linear gradient doped N<-> type layer epitaxially grows on the lower bottom surface N<+> layer; the upper surface N<+> layer epitaxially grows on the linear gradient doped N<-> type layer; the table-board structure is formed on the upper surface N<+> layer and the lower bottom surface N<+> layer through an island digging and insulating; the upper electrode in an ohmic contact is formed on the upper surface N<+> layer by metal evaporation; and the lower electrode in an ohmic contact is formed on the lower bottom surface N<+> layer by metal evaporation. The invention also discloses a method for manufacturing the linear gradient doped GaAs planar gunn diode. By utilizing the linear gradient doped GaAs planar gunn diode, the working frequency of oscillating circuits within the ranges of millimeter waves and submillimeter waves is increased, and the conversion efficiency from direct current to ratio frequency is enhanced.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI

A kind of terahertz gan Gunn diode and its manufacturing method

The invention relates to a Terahertz GaN Gunn diode and a manufacturing method thereof. The Terahertz GaN Gunn diode comprises a cathode, an n type GaN substrate, an n+ GaN cathode ohmic contact layer, an InAlN three-dimensional structure electronic emission layer, an n-GaN transition layer, an n+ GaN anode ohmic contact layer, and an anode which are successively arranged from bottom to top, and also comprises an SiN passivation layer arranged on the n type GaN substrate, and covering the n+ GaN cathode ohmic contact layer, the InAlN three-dimensional structure electronic emission layer, the n-GaN transition layer, the n+ GaN anode ohmic contact layer, and the anode; the upper portion of the SiN passivation layer is provided with an open pore exposing the anode. The Terahertz GaN Gunn diode employs a three-dimensional structure InAlN electric emission layer structure, and substantially increases the output power density of a GaN Gunn diode under a same size.
Owner:YANGZHOU HAIKE ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products