The invention relates to a metallic bond, a diamond grinding wheel prepared through the bond and a preparation method of the diamond grinding wheel. The metallic bond comprises, by weight percent, 95%-99% of copper-tin prealloyed powder, 0.5%-3% of graphite powder and 0.5%-2% of nanometer alpha-Al2O3. The copper-tin prealloyed powder, the graphite powder, the nanometer alpha-Al2O3 and diamond are taken according to a certain proportion, procedures of burdening and material mixing, pelletizing, compression, sintering and aftertreatment are carried out in sequence, and tool bits can be prepared. The multiple tool bits are arranged on a matrix at equal distance in the circumferential direction, the cambered surfaces of the tool bits are perpendicular to the matrix, and the diamond grinding wheel is prepared. The above tool bits are uniform in ingredient and good in density, diamond distribution is uniform, and the control effect of the metallic bond on the diamond is good. The grinding wheel has the beneficial effects of being good in ground workpiece surface quality, free of dark cracks and scratches, sharp in grinding and long in service life, facilitating large-scale production and the like and is especially suitable for producing sapphire wafers with the thinning thickness ranging from 100 micrometers to 700 micrometers.