The present invention relates to a photosensitive resin composition excellent in
pliability,
ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at
room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a
siloxane-containing
polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition.In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; R1 represents
alkyl group having 1 to 6 carbon atoms or
phenyl group; R2 represents alkylene group having 2 to 6 carbon atoms or
phenylene group; l represents a number of 0 to 10; R3 represents a
divalent group or a direct bond; R4 represents —CH2═CH—R6—, in which R6 represents a direct bond, alkylene group having 1 to 6 carbon atoms, or
phenylene group; R5 represents a
diamine residue; and m, n, and o, indicating the range of the abundant
molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.