The invention discloses a palladium-free chemical copper-plating method on a graphite nanosheet surface. The palladium-free chemical copper-plating method is characterized in that a graphite nanosheet which is coated with a complete and compact metal copper housing on the surface is finally obtained through dispersing, coarsening, surface hydroxylation, activating, copper plating and passivating in sequence. The graphite nanosheet has a plurality of hydroxyls after surface hydroxylation treatment, and is activated, so that active ions and the graphite nanosheet are combined by chemical bonds, and binding force between a coating and the graphite nanosheet is strong; moreover, a problem that stannous chloride and palladium chloride which are dear and not environment-friendly are used in conventional graphite surface treatment is overcome. Besides, a complexing agent used by copper plating liquid provided by the invention is a composite complexing agent of sodium ethylene diamine tetracetate and citrate, wherein addition of the citrate is 100-400 times the sodium ethylene diamine tetracetate, hardness of the coating is regulated by regulating a proportion of the citrate and the sodium ethylene diamine tetracetate, thereby avoiding only using dear sodium ethylene diamine tetracetate as the complexing agent. The palladium-free chemical copper-plating method disclosed by the invention has environment-friendly effect, is economical and practical, and has good application prospect.