The invention discloses a
palladium-free chemical
copper-plating method on a
graphite nanosheet surface. The
palladium-free chemical
copper-plating method is characterized in that a
graphite nanosheet which is coated with a complete and compact
metal copper housing on the surface is finally obtained through dispersing, coarsening, surface
hydroxylation, activating,
copper plating and passivating in sequence. The
graphite nanosheet has a plurality of hydroxyls after surface
hydroxylation treatment, and is activated, so that active ions and the graphite nanosheet are combined by chemical bonds, and
binding force between a
coating and the graphite nanosheet is strong; moreover, a problem that stannous
chloride and
palladium chloride which are dear and not environment-friendly are used in conventional graphite surface treatment is overcome. Besides, a complexing agent used by
copper plating liquid provided by the invention is a composite complexing agent of
sodium ethylene diamine tetracetate and citrate, wherein addition of the citrate is 100-400 times the
sodium ethylene diamine tetracetate,
hardness of the
coating is regulated by regulating a proportion of the citrate and the
sodium ethylene diamine tetracetate, thereby avoiding only using dear sodium
ethylene diamine tetracetate as the complexing agent. The palladium-free chemical copper-plating method disclosed by the invention has environment-friendly effect, is economical and practical, and has good application prospect.