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49results about How to "Large process tolerance" patented technology

Focusing micro reflection element array optical anti-counterfeiting element and valuable article

The invention discloses a focusing micro reflection element array optical anti-counterfeiting element and a valuable article. The optical anti-counterfeiting element comprises a transparent base layer, a micropattern array composed of micropattern units and a focusing micro reflection element array composed of focusing micro reflection element units, the micropattern array at least partially covers a first surface of the transparent base layer, the focusing micro reflection element array at least partially covers a second surface of the transparent base layer, and the distance between the focal plane of the micropattern units and the focal plane of the focusing micro reflection element units are smaller than half of the focal length of the focusing micro reflection element units; the periodicity tL of the focusing micro reflection element array and the periodicity tw of the micropattern array meet a formula (please see the formula in the specification), and / or the included angle theta between the focusing micro reflection element array and the micropattern array meets the formula -5 degrees <= theta<=5 degrees, wherein n is a positive integer. Focusing micro reflection elements with the large diameter are adopted for the optical anti-counterfeiting element, the array periodicity and the technical tolerance are large, manufacturing is easy, and the yield can be increased substantially.
Owner:ZHONGCHAO SPECIAL SECURITY TECH +1

Three-dimensional imaging optical thin film

The invention discloses a three-dimensional imaging optical thin film, which comprises a transparent spacing layer, a micro-reflective focusing unit array layer, and a micro-graphic unit array layer. The transparent spacing layer has two opposite surfaces. The micro-reflective focusing unit array layer is arranged on one surface of the transparent spacing layer and comprises a plurality of asymmetrically arranged micro-reflective focusing units. The micro-graphic unit array layer, opposite to the micro-reflective focusing unit array layer, is arranged on the other surface of the transparent spacing layer and comprises a plurality of micro-graphic units. The micro-reflective focusing unit array layer and the micro-graphic unit array layer are matched with each other, so that the three-dimensional imaging optical thin film can form one and only one suspended image suspended in the transparent spacing layer only when being viewed form the side of the micro-graphic units. The suspended image of the three-dimensional imaging optical thin film is a single-channel or multi-channel pattern. When the imaging thin film is inclined from side to side or inclined back and forth, no other amplified micro-graphic unit enters the viewing area. The thin film is unique in visual experience and can be clearly observed in the front perpendicular condition.
Owner:SHINE OPTOELECTRONICS KUNSHAN CO LTD

Methods for manufacturing superjunction structure and superjunction semiconductor device

The invention discloses methods for manufacturing a superjunction structure and a superjunction semiconductor device. A novel semiconductor superjunction and a superjunction device are formed by the key process steps of etching a trench, performing ion implantation at a small inclination angle, filling an insulating dielectric and planarizing, forming an active layer and an electrode and the like. Compared with the prior art, the methods have the advantages that: firstly, a method of forming the superjunction by using a plurality of epitaxy processes and a plurality of implantation processes is prevented from being used; secondly, the bottom of a trench gate can be guaranteed to be flush with or slightly lower than the lower boundary of a body region, so that withstand voltage of the device is improved, and gate-source capacitance and gate-drain capacitance are reduced; thirdly, since the depth of the trench is reduced, the process difficulty of the small-angle implantation is reduced, the process tolerance is increased, and the dielectric in the extended trench is easier to fill and planarize; fourthly, a complex mask is not required, so that the influence of small-angle implantation on a trench region is avoided; and fifthly, the adverse effects of the filling and the planarizing of the extended trench and the manufacturing and the planarizing of the trench gate on the formed body region, body contact region and source region are avoided.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA +1

Terahertz quantum cascade laser of multiple-mode interface structure and manufacturing method thereof

The invention relates to a terahertz quantum cascade laser of a multiple-mode interface structure. The terahertz quantum cascade laser comprises a multiple-mode interference wave guiding structure. The multiple-mode interference wave guiding structure comprises a semi-insulating substrate, a buffer layer, a lower contact layer, an active region, an upper contact layer and an upper metal layer in the perpendicular direction from bottom to top in sequence, wherein the active region, the upper contact layer and the upper metal layer form a ridge type structure on the lower contact layer; lower metal layers are arranged on the two sides of the ridge type structure; the upper metal layer forms a multiple-mode wave guide and output wave guides through the wet etching method; the output wave guides are single-mode wave guides and located at the centers of the two ends of the multiple-mode wave guide, and the width of each output wave guide is smaller than that of the multiple-mode wave guide. The invention further relates to a manufacturing method of the THz QCL. By the adoption of the THz QCL of the multiple-mode interface structure and the manufacturing method of the THz QCL, the light-emitting power of the THz QCL can be increased, the quality of an emitted light beam is not reduced, collection efficiency is not reduced, the device is kept small, and cost is reduced.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Silicon nitride waveguide and microannulus-based mode-wavelength multiplexer manufacturing method

The invention provides a silicon nitride waveguide and microannulus-based mode-wavelength multiplexer manufacturing method. The method comprises steps: step 1, a lower-limit silicon dioxide layer and a silicon nitride material mode-wavelength multiplexing integrated device layer are sequentially grown on a substrate; step 2, an etching method is adopted to etch the silicon nitride material mode-wavelength multiplexing integrated device layer into a plurality of strip-shaped waveguide structures and a plurality of microannulus resonant cavity structures, and the etching depth reach the surface of the lower-limit silicon dioxide layer; step 3, an upper-limit silicon dioxide layer and a metal heating adjusting layer are sequentially grown on the lower-limit silicon dioxide layer with the plurality of strip-shaped waveguide structures and the plurality of microannulus resonant cavity structures formed in an etching mode; and step 4, an etching method is adopted to etch the metal heating adjusting layer to a plurality of microannulus structures, and manufacturing is completed. According to the method of the invention, coupling is selected through a mode under the wave vector matching condition and characteristics are selected through wavelength of the microannulus, and the on-chip mode-wavelength multiplexing demultiplexing function is realized.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Method for manufacturing longitudinal power semiconductor device

The invention relates to semiconductor technology, aims to overcome the difficulty of manufacturing a semiconductor power device with a trench / gate super-junction, and provides a method for manufacturing a longitudinal power semiconductor device. The technical scheme of the invention is as follows: firstly a first semiconductor region is formed by epitaxial process; a first oxide layer and a deposited mask layer are formed at the top of the first semiconductor region, the photoetching operation is performed, a first trench is formed by etching, a second oxide layer is formed on the two side walls of the first trench, the second oxide layer is removed by wet-etching, a third oxide layer is formed on the inner wall of the trench, a second semiconductor region is formed on the two side walls of the first trench, the third oxide layer is removed, a fourth oxide layer is formed, insulation dielectrics are packed and then planarization is carried out, a body region is formed, a second trench is formed on the body region by etching, a trench gate is made, and finally a source region and a body contact region are formed, followed by electrode preparation and surface passivation. The method has the benefits of having low process difficulty and being applied to MOS-controlled longitudinal devices.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Self-pulse and continuous output type silicon-based integrated semiconductor laser based on Fano resonance and preparation method of self-pulse and continuous output type silicon-based integrated semiconductor laser

ActiveCN113193477AGood single modelHigh pulse repetition rateOptical wave guidanceLaser detailsOptical communicationWaveguide
The invention relates to a self-pulse and continuous output type silicon-based integrated semiconductor laser based on Fano resonance and a preparation method of the self-pulse and continuous output type silicon-based integrated semiconductor laser. The laser comprises a substrate, and a Bragg reflector, a first tapered waveguide, III-V group multi-quantum well active regions, a second tapered waveguide and a Fano reflector which are sequentially arranged on the substrate from left to right. The Fano reflector comprises a straight waveguide and a micro-ring waveguide; the micro-ring waveguide is covered with graphene to form saturated absorption; a partial transmission unit is designed in a coupling area of a micro-ring waveguide and a straight waveguide, Fano resonance is generated, two working modes of self-pulse and continuity in a 1550nm optical communication C wave band are realized, and the laser can be suitable for multiple application scenes. Under continuous output, the central wavelength is 1550nm, and the single-mode characteristic is good; in the self-pulse mode, as the current increases, the pulse repetition rate reaches GHz, and the high pulse repetition rate is achieved. The preparation method is compatible with a conventional process and is suitable for low-cost efficient preparation.
Owner:SHANDONG UNIV +1

A multi-mode interference structure terahertz quantum cascade laser and its manufacturing method

The invention relates to a terahertz quantum cascade laser of a multiple-mode interface structure. The terahertz quantum cascade laser comprises a multiple-mode interference wave guiding structure. The multiple-mode interference wave guiding structure comprises a semi-insulating substrate, a buffer layer, a lower contact layer, an active region, an upper contact layer and an upper metal layer in the perpendicular direction from bottom to top in sequence, wherein the active region, the upper contact layer and the upper metal layer form a ridge type structure on the lower contact layer; lower metal layers are arranged on the two sides of the ridge type structure; the upper metal layer forms a multiple-mode wave guide and output wave guides through the wet etching method; the output wave guides are single-mode wave guides and located at the centers of the two ends of the multiple-mode wave guide, and the width of each output wave guide is smaller than that of the multiple-mode wave guide. The invention further relates to a manufacturing method of the THz QCL. By the adoption of the THz QCL of the multiple-mode interface structure and the manufacturing method of the THz QCL, the light-emitting power of the THz QCL can be increased, the quality of an emitted light beam is not reduced, collection efficiency is not reduced, the device is kept small, and cost is reduced.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Electro-optic intensity modulator with improved switch extinction ratio and its application

An electro-optical intensity modulator and its application to realize the improvement of the switch extinction ratio, the electro-optic intensity modulator includes an input optical waveguide; a first coupler; a first pair of phase modulation arms, and the sides of the two arms are provided with a first pair of rows Wave electrode; multi-mode interference structure, which includes two input optical waveguides, a multi-mode interference region and two output optical waveguides, used to convert the two beams of light modulated by the first pair of phase modulation arms through the multi-mode interference region The new two beams of light that are output; the second pair of phase modulation arms, the sides of the two arms are provided with a second pair of traveling wave electrodes; the second coupler and the output optical waveguide, which are used to combine the second coupler after the light output. The structure of the present invention can compensate the decrease of the extinction ratio caused by the asymmetry caused by the process error by tuning the optical power ratio of the two branches at the input end of the modulator, significantly improve the extinction ratio, increase the process tolerance, and improve the production efficiency and good quality Rate.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Organic acid type roughening liquid

The invention discloses an organic acid roughening solution, the ingredient of which comprises organic acid; the organic acid roughening solution is characterized in that the ingredient of the organic acid roughening solution comprises 0.1-3.0% of impurity ion masking agent by percentage composition. Compared with the prior art, the organic acid roughening solution has the beneficial effects that: by adopting the impurity ion masking agent, the organic acid roughening solution can effectively solve the problem that the roughening solution is easy to be interfered by impurity ions such as tin,iron, and the like; the organic acid roughening solution reduces the time by which the roughening solution is replaced during the surface treatment technique of the copper used for a printing circuitboard and prolongs the service life of the roughening solution. The organic acid roughening solution has the advantages of strong capability of impurity ion pollution resistance, large process tolerance and convenient use; furthermore, under the condition of identical small copper corroding amount, the roughening degree of the surface of the copper is high; therefore, the organic acid roughening solution can obviously reinforce the adhesion of the surface with other coating or polymer and ensure the quality of coating and electro-plating or chemical-plating treatment.
Owner:SHENZHEN BANMING SCI & TECH CO LTD

Process method of shield gate trench type MOSFET

The invention discloses a process method of a shield gate trench type MOSFET. The method comprises the following steps 1, depositing a silicon oxide layer on a semiconductor substrate, and sequentially depositing a silicon nitride layer and a silicon oxide layer to form an ONO layer, and etching the ONO layer; 2, taking the ONO layer as a hard mask, and carrying out the downward etching of the semiconductor substrate, and forming a trench; 3, carrying out back etching on the ONO layer; 4, carrying out chamfer etching on the bottom of the formed groove; 5, depositing and forming a dielectric layer in the groove; step 6, depositing and filling a polycrystalline silicon layer in the trench; and 7, performing back etching on the deposited polycrystalline silicon layer. According to the processmethod disclosed by the invention, the back etching process of the ONO layer of the hard mask layer is added before a groove chamfer etching process, so that the morphology of the top of the groove is improved, and the process tolerance of polycrystalline silicon filling is increased; the groove etching angle is allowed to reach 88 degrees or above, after the groove etching angle is increased, the size of each device unit can be reduced, and the performance of the device can be enhanced.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Electro-optic phase shifter doping structure, preparation method and electro-optic modulator

The invention discloses an electro-optic phase shifter doping structure, a preparation method and an electro-optic modulator, belonging to the field of semiconductor optoelectronic devices. The electro-optic phase shifter doping structure includes a ridge-shaped optical waveguide, and the ridge-shaped optical waveguide includes a ridge region and a The rib regions on both sides of the region, the ridge region includes an N-type doped ridge region and a P-type doped ridge region, and two vertically inclined PN junctions and connections are formed at the interface between the N-type doped ridge region and the P-type doped ridge region. The laterally inclined PN junction of the two vertically inclined PN junctions; wherein, the interface between the N-type doped ridge region and the P-type doped ridge region does not intersect the left and right sides of the ridge region. The doping structure in the present invention increases the overlapping area of ​​the optical field and the PN junction in the phase shifter, improves the phase shifting efficiency, has a lower driving voltage, reduces the power consumption of the phase shifter, and has an impact on the modulation bandwidth of the phase shifter Very small, compatible with CMOS process and has a large process tolerance, thus ensuring the yield rate of the device.
Owner:HUAZHONG UNIV OF SCI & TECH

Micro-ring optical switch based on three-dimensional integration of silicon-silicon nitride

A micro-ring optical switch based on three-dimensional integration of silicon-silicon nitride. A three-dimensional waveguide cross junction is formed by a laterally arranged silicon waveguide and a longitudinally arranged top layer silicon nitride waveguide, and is cascaded with a middle layer of silicon nitride waveguides. Microrings are formed by vertical coupling. The interlayer coupler is used to realize the interlayer coupling between the silicon nitride waveguide in the middle layer and the other two layers of waveguides, so as to assist the conversion of optical signals between the three layers of waveguides. The invention utilizes the doping of the bottom silicon waveguide to form a micro-heater, and generates heat by applying electricity at both ends of the doped waveguide to adjust the resonance wavelength of the silicon nitride microring of the intermediate layer, and switches the path of the optical signal, and has the advantages of low power consumption . When the wavelength of the optical signal matches the resonant wavelength of the microring, two optical signals in opposite directions can be routed in the device simultaneously. The optical switch structure of the present invention has a large processing tolerance, does not require additional power consumption to compensate for the shift of the operating wavelength, is insensitive to temperature, and does not require a complex control circuit.
Owner:SHANGHAI JIAOTONG UNIV
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