75results about How to "Yield minimization" patented technology

According to various embodiments, the present teachings include methods for reducing first wafer defects in a high-density plasma chemical vapor deposition process. In an exemplary embodiment, the method can include running a deposition chamber for deposition of film on a first batch of silicon wafers and then cleaning interior surfaces of the deposition chamber. The method can further include inserting a protective electrostatic chuck cover (PEC) wafer on an electrostatic chuck in the deposition chamber and applying power to bias the PEC wafer while simultaneously precoating the deposition chamber with an oxide. The exemplary method can also include re-starting the deposition chamber for deposition of film on a second batch of silicon wafers.

Coating compositions and methods of use, allowing for improved water and/or nutrient usage by seeds, plants, shrubs, and vegetation, among others, are disclosed.

A process for isomerization dewaxing of a hydrocarbon feed which includes contacting the hydrocarbon feed with a large pore size, small crystal size, crystalline molecular sieve and an intermediate pore size, small crystal size, crystalline molecular sieve to produce a dewaxed product with a reduced pour point and a reduced cloud point. In a preferred embodiment, the feed is contacted with the molecular sieves sequentially, first with the large pore sieve followed by the intermediate pore sieve.

A process for upgrading a hydrocarbon feedstock containing waxy components and having an end boiling point exceeding 650° F., which includes contacting the feedstock at superatmospheric hydrogen partial pressure with an isomerization dewaxing catalyst that includes ZSM-48 and contacting the feedstock with a hydrocracking catalyst to produce an upgraded product with a reduced wax content. Each catalyst is present in an amount sufficient to reduce the cloud point and the pour point of the feedstock at a conversion of greater than about 10%, and an overall distillate yield of greater than about 10% results from the process.

A sintered electrolyte sheet comprising: a body of no more than 45 μm thick and laser machined features with at least one edge surface having at least 10% ablation. A method of micromachining the electrolyte sheet includes the steps of: (i) supporting a sintered electrolyte sheet; (ii) micromachining said sheet with a laser, wherein said laser has a wavelength of less than 2 μm, fluence of less than 200 Joules/cm², repetition rate (RR) of between 30 Hz and 1 MHz, and cutting speed of preferably over 30 mm/sec.

A photomask for double exposure, and a double exposure method using the same are disclosed. The photomask for double exposure comprises a mask substrate divided into first and second regions equally arranged to upper and lower sideson different sides, respectively, a first mask pattern formed on the first region of the mask substrate, and a second mask pattern formed on the second region of the mask substrate. The photomask and the double exposure method using the same enable a finer photoresist pattern to be formed on a semiconductor wafer, while minimizing reduction in yield and productivity due to misalignment and replacement.

A process for stabilization of heavy hydrocarbons to reduce sludge formation in storage tanks and/or transportation lines and to enhance the hydrocarbon yield includes mixing a paraffinic or heavy naphtha solvent having carbon numbers in the range 10 to 20 with the feedstock to solvent-flocculate a relatively small, predetermined portion of asphaltenes present in the feedstock, separating and flashing the sediment to recover a light hydrocarbon fraction, flashing the heavy hydrocarbon/solvent phase and recycling the solvent to stabilize the heavy hydrocarbons without significantly affecting the yield of valuable products.

A method of screening complementary metal-oxide-semiconductor CMOS integrated circuits, such as integrated circuits including CMOS static random access memory (SRAM) cells, for transistors susceptible to transistor characteristic shifts over operating time. For the example of SRAM cells formed of cross-coupled CMOS inverters, separate ground voltage levels can be applied to the source nodes of the driver transistors, or separate power supply voltage levels can be applied to the source nodes of the load transistors (or both). Asymmetric bias voltages applied to the transistors in this manner will reduce the transistor drive current, and can thus mimic the effects of bias temperature instability (BTI). Cells that are vulnerable to threshold voltage shift over time can thus be identified.

Waste-treatment processes are enhanced through generation and introduction of specific biological populations customized to perform or favor specific tasks either during the main process, for the formation or precipitation of certain biological nutrients, or to accomplish solids formation reduction in a post-treatment process. These bacteria may be grown from specialized mixes of activated sludge and waste influent by exposing these materials to controlled environments (e.g., in an off-line treatment area). They may then be returned to the main process to perform certain tasks such as converting particulate cBOD into soluble cBOD for utilization, to reduce high solids yield organisms by supplementing the population characteristics with low yield organism characteristics, to provide biological nutrients or oxygenation assistance, to improve nitrification/denitrification efficiency, or to disfavor filamentous biology such as Norcardia sp.

A method of fabricating a stacked electronic component package includes placing a single-sided film spacer on an upper surface of a lower electronic component inward of bond pad with a pickup tool. After being adhered to the upper surface of the lower electronic component, the pickup tool is retracted from the single-sided film spacer. An upper surface of a film, e.g., an organic film, of the single-sided film spacer is nonadhesive. Accordingly, the single-sided film spacer does not stick to the pickup tool during retraction of the pickup tool from the single-sided film spacer.

This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface. After lamination the thermally depolymerizable/decomposable film is conveniently and cleanly removed due to thermal depolymerization and burn-off of volatile species during the sintering process, thus providing surface defect-free ceramic substrates.

A seed or seedling is coated with underivatized guar, cationic hydroxypropyl guar, polyacrylamide, poly(methacrylic acid), poly(acrylic acid), polyacrylate, polyethylene glycol), polyethyleneoxide, poly(vinyl alcohol), polyglycerol, polytetrahydrofuran, polyamide, hydroxypropyl guar, carboxymethyl guar, carboxymethylhydroxypropyl guar, underivatized starch, cationic starch, corn starch, wheat starch, rice starch, potato starch, tapioca, waxy maize, sorghum, waxy sorghum, sago, dextrin, chitin, chitosan, xanthan gum, carageenan gum, gum karaya, gum arabic, pectin, cellulose, hydroxycellulose, hydroxyalkyl cellulose, hydroxyethyl cellulose, carboxymethylhydroxyethyl cellulose, or hydroxypropyl cellulose, the coated seed or seedling having a shelf-life at room temperature in ambient conditions in an unsealed container to at least two months.

Isocyanates, preferably diisocyanates and polyisocyanates of the diphenylmethane series (MDI), are produced by reaction of amines dissolved in a solvent with phosgene in the same solvent to form the corresponding isocyanates. Hydrogen chloride and excess phosgene are subsequently removed from the reaction mixture to obtain a crude isocyanate-containing solution. Subsequently, the crude isocyanate-containing solution is separated by distillation into isocyanates and solvent. The solvent is recycled and used for the production of solutions of the amines and of phosgene. The solvent being recycled is treated to reduce the phosgene and diisocyanate contents before being used for the production of the solution of the amine.

The invention discloses a harmless low-temperature carbonization treatment process of sludge. The treatment process comprises the following steps: selecting garbage rich in plant fibers, putting the garbage into a crushing machine, performing crushing, adding the crushed plant fiber garbage into a screening box from a material inlet hopper of a screening machine, and driving a first motor to driveoverall vibration of the screening box under the action of first springs. According to the process provided by the invention, second teeth are matched with first teeth for use, so that a filter screen is convenient to install and disassemble, and the filter screen is convenient to replace and repair and convenient to use; a conveyor belt and an inclined plate are arranged, so that particle impactforce caused by falling of a pressing mechanism can be reduced, particles can be prevented from being splashed in the falling process to cause loss, the resources can be saved, and waste can be avoided; through conveying of the conveyor belt, manpower can be saved, and the working efficiency can be improved; and a fire grate rotates, so that residues can be eliminated, the air flow can be accelerated, the particle combustion is more full, and the carbonization rate is high.

The present invention relates a method for improving the organoleptic properties of protein used in the production of frozen and retort consumer food applications. More specifically, the present invention is directed to the addition of a liquid fat during the step of marinating the protein to enhance the flavor and texture of the meat products.

The present invention relates to an improved binder system to stabilize and improve yield for thermally processed meat products such as those that are used in canning or retort operations. More specifically, the present invention pertains to the novel starch/binder matrix that produces a meat product having enhanced moisture flavor and texture over those treated using currently available techniques. The novel matrix uses a combination of starches that provide differential water holding and moisture control for the meat products treated therewith.

A method is presented for forming a layout of a MOSFET (metal oxide semiconductor field effect transistor) circuit. The method includes forming a plurality of gate conductors, forming a plurality of active areas, and forming at least one gate contact (CB contact) within an active region of the plurality of active regions. The method further includes placing a marker over the at least one gate contact to identify a location of the at least one gate contact. Additionally, a distance between the at least one gate contact and at least one TS contact is optimized based on device specifications.

A method is presented for forming a layout of a MOSFET (metal oxide semiconductor field effect transistor) circuit. The method includes forming a plurality of gate conductors, forming a plurality of active areas, and forming at least one gate contact (CB contact) within an active region of the plurality of active regions. The method further includes placing a marker over the at least one gate contact to identify a location of the at least one gate contact. Additionally, a distance between the at least one gate contact and at least one TS contact is optimized based on device specifications.

Disclosed are embodiments of a method, system and computer program product for optimizing integrated circuit product yield by re-centering the manufacturing line and, optionally, adjusting wafer-level chip dispositioning rules based on the results of post-manufacture (e.g., wafer-level or module-level) performance path testing. In the embodiments, a correlation is made between in-line parameter measurements and performance measurements acquired during the post-manufacture performance path testing. Then, based on this correlation, the manufacturing line can be re-centered. Optionally, an additional correlation is made between performance measurements acquired during wafer-level performance testing and performance measurements acquired particularly during module-level performance path testing and, based on this additional correlation, adjustments can be made to the wafer-level chip dispositioning rules to further minimize yield loss.