4 results about "E-textiles" patented technology

The application relates to the technical field of electronic fabrics, in particular to an electronic fabric based on laser-activated printable conductive ink and a preparation method thereof. Bismuth, indium and tin are mixed to obtain a mixture, the mixture is smelted to completely melt, and a molten alloy is obtained; the molten alloy is mixed with boiling water and ultrasonically treated to obtain an alloy dispersion liquid; the alloy dispersion liquid is centrifuged to obtain alloy particles which are dried and then mixed with a binder solution and stirred to obtain an alloy particle and binder solution composite ink; the ink is then patterned on a fiber pad in a stencil printing mode, and after activation, an electronic fabric is obtained. By combining an electrospun polyimide nanofiber base material and a laser-sintering-activated printable bismuth alloy conductive ink, the prepared electronic fabric has high flexibility, high air permeability and high conductivity, and the square resistance can reach 0.5 omega / D.

A judging method for a module peeling time of a soft electronic fabric module is provided. The method includes: preselecting a plurality of module material combinations, the plurality of module material combinations respectively comprising a substrate material, a wire material and a packaging material; extracting the plurality of module material combinations to generate a plurality of module material combination parameters; generating a plurality of machine learning training data based on the plurality of module material combination parameters and a plurality of module pre-processing conditions; and training a machine learning model according to the plurality of machine learning training data to provide an optimized prediction model for judging a module peeling time.

The invention belongs to the technical field of intelligent spinning and flexible electronics, and relates to an electronic fabric interface and a preparation method and application thereof.The electronic fabric interface comprises a fabric-based conductive path and a three-layer gradient packaging structure wrapping a connecting area between the fabric-based conductive path and a circuit board; the three-layer gradient packaging structure is composed of an inner layer high bonding layer, a middle gradient layer and an outer layer flexible protection layer. The elastic moduli of the inner layer high bonding layer, the middle gradient transition layer and the outer layer flexible protection layer are gradually reduced in sequence; during preparation, firstly, the end part of the fabric-based conductive path and a circuit board are bonded and electrically connected through a conductive adhesive, and then an inner layer high bonding layer, a middle gradient transition layer and an outer layer flexible protection layer are respectively coated and cured in a connection area to obtain an interface; the method is applied to connection and integration of different modules in a wearable clothing system. The electronic fabric interface can prevent the problem of interface separation caused by stress concentration; the preparation method is simple; and long-term reliability and durability are realized during application.

The present application belongs to the technical field of intelligent electronic devices, and particularly relates to a preparation method of a flexible fiber integrated circuit. The method comprises the following steps: taking a micron-level polymer elastomer film as a base material, taking a high-modulus island-shaped polymer film as a buffer layer, and using an electronic device micro-nano processing preparation process and a multi-layer roll film assembly method to prepare the flexible fiber integrated circuit. The present application uses the high-modulus island-shaped polymer film layer as the buffer layer, which greatly enhances the stability of the performance of the electronic device when the electronic device on the fiber platform undergoes various deformations. The roll film method introduces the advanced high-precision preparation process (such as photolithography, etching, etc.) of the planar electronic device into the preparation of the fiber electronic device, realizes the integration of various high-precision and high-density electronic devices at the micro-nano scale, including resistors, capacitors, transistors, diodes and the like. The inner roll and the outer roll improve the protection of the electronic device and the convenience of electrode leading-out, respectively, and expand the application range of the fiber integrated circuit, such as in-vivo implantation, weaving into electronic fabrics and the like.